Abstract: In a surface electrode structure on a ceramic multi-layer substrate having on the surface SAW device mounting surface electrodes for mounting flip chips 30 as surface-acoustic-wave devices by gold-gold bonding and soldered parts mounting surface electrodes, at least the lowermost layer is made of a sintered silver conductor 51 which is partly buried in the ceramic multi-layer substrate 40, a nickel or a nickel alloy layer 52 being contained as an intermediate layer, and the topmost layer being a gold layer 53. Thus, it is provided a surface electrode structure on a ceramic multi-layer substrate that is suitable for both mounting of SAW devices by gold-gold bonding and mounting of other parts by soldering and which enable consistent mounting of individual parts using a ceramic multi-layer substrate to provide higher reliability.

Abstract: A multi-layer ferrite chip inductor array, wherein an element main body 11 is composed by laminating a ferrite layer and a conductor layer in such a manner that the laminated face thereof is vertical with an element mounting surface 15, a plurality of coil shaped internal conductors are furnished within the element main body 11, the coiling direction of said coil shaped internal conductor being parallel with the element mounting surface, and the ferrite sheets formed with through-holes are printed with a plurality of coil shaped internal conductors and conductor patterns with the electrically conductive material, and the ferrite sheets are laminated such that the laminated face thereof is vertical with the element mounting surface. This realization of the invention depends on the production method having the process enabling to obtain the laminated body where the plurality of coil shaped internal conductors are formed, the coiling direction of said conductors being parallel with said element mounting surface.

Abstract: A method for manufacturing radio frequency module components with a surface acoustic wave element includes a gold plating step of plating gold at a component bonded portion on a conductive surface of a ceramic multi-layer substrate 40 to have a mounted electrode 43, a surface acoustic wave element mounting step of face down bonding a flip chip 30 as the surface acoustic wave element on the ceramic multi-layer substrate 40 by the gold-gold connection, a side wall formation step of bonding a side wall member 60 surrounding the flip chip 30 onto the ceramic multi-layer substrate 40 by adhesives, a lid formation step of bonding a lid member 61 enclosing an opening of the side wall onto the side wall member by adhesives, after mounting the flip chip 30, and a soldered component mounting step of mounting a soldered component 50 by the use of solder, after the lid formation step.

Abstract: The surface acoustic wave elements and the other surface mounting elements are mounted on a ceramic multi-layer substrate 40, wherein the surface acoustic wave elements are flip chips 30 which are face-down-bonded to the gold coated mounting electrodes 43 of the multi-layer ceramic substrate 40 by way of gold-to-gold bonding, and at least the surface acoustic wave elements are covered as sealed airtight with the side walls 60 fixed to the multi-layer ceramic substrate 40 and a cover 61 closing the opening of the side walls.

Abstract: An inductor device provided with a plurality of insulating layers; coil pattern units each formed between insulating layers; and connection portions for connecting upper and lower coil pattern units separated by the insulating layers to form a coil shape. The coil pattern units each have two substantially parallel linear patterns and a curved pattern connecting first ends of the linear patterns. The ratio A1/A2, where the total of the areas of the two linear patterns seen from the plane view is A1 and the area of the curved pattern seen from the plane view is A2, of 1.45 to 1.85, preferably 1.55 to 1.75. When the total area of a unit section of the insulating layer in which one coil pattern unit is contained is A0, the ratio (A1+A2)/A0 is in a range of 0.10 to 0.30, preferably 0.13 to 0.20.

Abstract: A process for the production of an inductor device comprising the steps of forming a green sheet to form an insulating layer; forming a plurality of conductive coil pattern units on the surface of the green sheet in order that a plurality of unit sections each including a single coil pattern unit are arranged on the surface of the green sheet and each two coil pattern units adjoining in the substantially perpendicular direction to the longitudinal direction of the unit sections are arranged centro-symmetrically with respect to a center point of a boundary line of adjoining unit sections; stacking a plurality of green sheets formed with the plurality of coil pattern units arranged in centro-symmetry and connecting the upper and lower coil pattern units separated by the green sheets to form a coil shape; and sintering the stacked green sheets. It is possible to obtain an inductor device able to suppress the stack deviation without complicating the production process even if the device is made small in size.

Abstract: A laminated ferrite chip inductor array wherein the array is composed in that multiple layers of ferrite sheets printed with U-shaped patterns of internal conductors are piled in such a manner that the U-shaped patterns of the internal conductors on adjacent sheets are opposed one another, and a plurality of channels composed by sintering the piled layers of coil-shaped structure of the internal conductive printed patterns made electrically communicating via through holes pierced in the ferrite sheets are held in ferrite porcelains, characterized in that the internal conductive pattern shapes of the adjacent chip inductors are turned 180 degree one another.

Abstract: Magnetic material has a ceramics having a composition in the range of Fe2O3 35.0 to 44.5 mol %, NiO 47.0 to 56.5 mol % and CuO 5.0 to 12.0 mol %, and the ceramics having relative magnetic permeability of 15 or less, and composes the inductance element comprising this magnetic material and the internal metallic conductor. For making laminated inductance elements by concurrently baking ceramic green sheets and internal metallic conductors, substances to be used as ceramic green sheets, which substances have the composition in the above mentioned range are used, and a silver or silver alloys are used as the internal metallic conductor, and the calcination is carried out at temperature of 880 to 920° C.

Abstract: A laminated ferrite chip inductor array wherein the array is composed in that multiple layers of ferrite sheets printed with U-shaped patterns of internal conductors are piled in such a manner that the U-shaped patterns of the internal conductors on adjacent sheets are opposed one another, and a plurality of channels composed by sintering the piled layers of coil-shaped structure of the internal conductive printed patterns made electrically communicating via through holes pierced in the ferrite sheets are held in ferrite porcelains, characterized in that the internal conductive pattern shapes of the adjacent chip inductors are turned 180 degree one another.

Abstract: The present invention is directed to an inductor element for noise suppression capable of suppressing the high frequency component in the GHz band through absorption.A core for passing through a signal line conductor is provided. The core is at least partially constituted with a compound member that is prepared by mixing ferromagnetic metal particles and resin. The compound member imparts a frequency-dependant absorption loss to a signal running through the signal line conductor. The absorption loss starts essentially in the GHz band and the high level of absorption remains in effect up to at least 20 GHz.

Abstract: Disclosed is a novel ceramic-glass composite material useful as a material of electronic parts for attenuation of noise components in the GHz range. The composite material is a sintered body obtained by a heat treatment of a powder blend consisting of 35-55% by weight of a hexagonal ferrite of the formula Ba.sub.3 M.sub.2 Fe.sub.24 O.sub.41 (M.dbd.Co, Ni and/or Zn) and the balance of a glass material consisting of SiO.sub.2, Al.sub.2 O.sub.3, SrO, CaO, MgO and B.sub.2 O.sub.3, of which the content of SrO is 15-25% by moles, at a relatively low sintering temperature of 850-920 .degree. C. for 10-30 minutes.

Abstract: A method for manufacturing an inductor element for noise suppression, including the steps of coating one surface of a supporting body with a paste comprising ferromagnetic particles and resin so as to form a sheet, forming a conductive line by printing a conductive paste on the sheet, and coating the conductive line with a paste including ferromagnetic particles and resin so as to cover the conductive line and form a core. Also included is a step of applying heat treatment under pressure. The ferromagnetic metal particles include iron particles having diameters that fall within a range of 0.01 .mu.m to 10 .mu.m, and a content of the ferromagnetic metal particles is within a range of 30 vol % to 70 vol %.

Abstract: A ground conductor and a signal conductor are provided in an insulating magnetic body respectively. The insulating magnetic body is a compound member that combines ferromagnetic metal particles and an insulating resin. A signal transmission element, a connector or a circuit board with high frequency stopping and low pass characteristics which will ensure reliable absorption of high frequency components in the high frequency range, can be provided. The ground conductor and the signal conductor are provided on opposite sides of the insulating magnetic body.

Abstract: A ground conductor and a signal conductor are provided in an insulating magnetic body respectively. The insulating magnetic body is a compound member that combines ferromagnetic metal particles and an insulating resin. A signal transmission element, a connector or a circuit board with high frequency stopping and low pass characteristics which will ensure reliable absorption of high frequency components in the high frequency range, can be provided.

Abstract: A ground conductor and a signal conductor are provided in an insulating magnetic body respectively. The insulating magnetic body is a compound member that combines ferromagnetic metal particles and an insulating resin. A signal transmission element, a connector or a circuit board with high frequency stopping and low pass characteristics which will ensure reliable absorption of high frequency components in the high frequency range, can be provided.