Patents by Inventor Fumiteru Asai

Fumiteru Asai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10211083
    Abstract: The present invention relates to a film for flip chip type semiconductor back surface, which is to be disposed on a back surface of a semiconductor element flip chip-connected onto an adherend, the film for flip chip type semiconductor back surface including an adhesive layer and a protective layer laminated on the adhesive layer, in which the protective layer is constituted of a heat-resistant resin having a glass transition temperature of 200° C. or more or a metal.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: February 19, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Naohide Takamoto, Goji Shiga, Fumiteru Asai
  • Publication number: 20180346640
    Abstract: The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected onto an adherend, the film for flip chip type semiconductor back surface having a ratio of A/B falling within a range of 1 to 8×103 (%/GPa), in which A is an elongation ratio (%) of the film for flip chip type semiconductor back surface at 23° C. before thermal curing and B is a tensile storage modulus (GPa) of the film for flip chip type semiconductor back surface at 23° C. before thermal curing.
    Type: Application
    Filed: August 9, 2018
    Publication date: December 6, 2018
    Applicant: NITTO DENKO CORPORATION
    Inventors: Goji SHIGA, Naohide TAKAMOTO, Fumiteru ASAI
  • Patent number: 9761475
    Abstract: The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ? of the thickness of the separator.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: September 12, 2017
    Assignee: NITTO DENKO CORPORATION
    Inventors: Naohide Takamoto, Goji Shiga, Fumiteru Asai
  • Patent number: 9478454
    Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, including a film for flip chip type semiconductor back surface for protecting a back surface of a semiconductor element flip chip-connected onto an adherend, and a dicing tape, the dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material, the film for flip chip type semiconductor back surface being formed on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is a radiation-curable pressure-sensitive adhesive layer whose pressure-sensitive adhesive force toward the film for flip chip type semiconductor back surface is decreased by irradiation with a radiation ray.
    Type: Grant
    Filed: March 21, 2014
    Date of Patent: October 25, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventors: Naohide Takamoto, Goji Shiga, Fumiteru Asai, Toshimasa Sugimura
  • Publication number: 20160172230
    Abstract: The present invention relates to a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material having an asperities-formed surface, and a pressure-sensitive adhesive layer laminated on the base material, and a film for semiconductor back surface laminated on the pressure-sensitive adhesive layer of the dicing tape, in which the dicing tape has a haze of at most 45%.
    Type: Application
    Filed: February 17, 2016
    Publication date: June 16, 2016
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naohide TAKAMOTO, Goji SHIGA, Fumiteru ASAI
  • Patent number: 9324616
    Abstract: An object of the present invention is to provide a method of manufacturing a flip-chip type semiconductor device with a simplified process, in which various types of information are supplied in a visually recognizable manner. The present invention relates to a method of manufacturing a flip-chip type semiconductor device comprising: a step A of laminating on a semiconductor wafer a film for the backside of a flip-chip type semiconductor, in which the film is to be formed on the backside of a semiconductor element that is flip-chip connected onto an adherend; a step B of dicing the semiconductor wafer; and a step C of laser marking the film for the backside of a flip-chip type semiconductor, wherein the film for the backside of a flip-chip type semiconductor in the step C is uncured.
    Type: Grant
    Filed: January 15, 2013
    Date of Patent: April 26, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventors: Goji Shiga, Fumiteru Asai, Naohide Takamoto
  • Patent number: 9293387
    Abstract: The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected onto an adherend, in which the film for flip chip type semiconductor back surface before thermal curing has, at the thermal curing thereof, a volume contraction ratio within a range of 23° C. to 165° C. of 100 ppm/° C. to 400 ppm/° C.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: March 22, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yusuke Komoto, Naohide Takamoto, Goji Shiga, Fumiteru Asai
  • Patent number: 9074113
    Abstract: The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected to an adherend, the film for flip chip type semiconductor back surface containing an inorganic filler in an amount within a range of 70% by weight to 95% by weight based on the whole of the film for flip chip type semiconductor back surface.
    Type: Grant
    Filed: July 18, 2011
    Date of Patent: July 7, 2015
    Assignee: NITTO DENKO CORPORATION
    Inventors: Naohide Takamoto, Goji Shiga, Fumiteru Asai
  • Publication number: 20150162236
    Abstract: The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ? of the thickness of the separator.
    Type: Application
    Filed: February 18, 2015
    Publication date: June 11, 2015
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naohide TAKAMOTO, Goji SHIGA, Fumiteru ASAI
  • Patent number: 9050773
    Abstract: The present invention relates to a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material layer, a first pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer stacked in this order, and a film for semiconductor back surface stacked on the second pressure-sensitive adhesive layer of the dicing tape, in which a peel strength Y between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer is larger than a peel strength X between the second pressure-sensitive adhesive layer and the film for semiconductor back surface, and in which the peel strength X is from 0.01 to 0.2 N/20 mm, and the peel strength Y is from 0.2 to 10 N/20 mm.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: June 9, 2015
    Assignee: NITTO DENKO CORPORATION
    Inventors: Fumiteru Asai, Goji Shiga, Naohide Takamoto
  • Patent number: 8986486
    Abstract: The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ? of the thickness of the separator.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: March 24, 2015
    Assignee: Nitto Denko Corporation
    Inventors: Naohide Takamoto, Goji Shiga, Fumiteru Asai
  • Publication number: 20140361443
    Abstract: An object of the present invention is to provide a method of manufacturing a flip-chip type semiconductor device with a simplified process, in which various types of information are supplied in a visually recognizable manner. The present invention relates to a method of manufacturing a flip-chip type semiconductor device comprising: a step A of laminating on a semiconductor wafer a film for the backside of a flip-chip type semiconductor, in which the film is to be formed on the backside of a semiconductor element that is flip-chip connected onto an adherend; a step B of dicing the semiconductor wafer; and a step C of laser marking the film for the backside of a flip-chip type semiconductor, wherein the film for the backside of a flip-chip type semiconductor in the step C is uncured.
    Type: Application
    Filed: January 15, 2013
    Publication date: December 11, 2014
    Inventors: Goji Shiga, Fumiteru Asai, Naohide Takamoto
  • Publication number: 20140203458
    Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, including a film for flip chip type semiconductor back surface for protecting a back surface of a semiconductor element flip chip-connected onto an adherend, and a dicing tape, the dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material, the film for flip chip type semiconductor back surface being formed on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is a radiation-curable pressure-sensitive adhesive layer whose pressure-sensitive adhesive force toward the film for flip chip type semiconductor back surface is decreased by irradiation with a radiation ray.
    Type: Application
    Filed: March 21, 2014
    Publication date: July 24, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naohide TAKAMOTO, Goji SHIGA, Fumiteru ASAI, Toshimasa SUGIMURA
  • Publication number: 20140178680
    Abstract: The present invention relates to a film for flip chip type semiconductor back surface, which is to be disposed on a back surface of a semiconductor element flip chip-connected onto an adherend, the film for flip chip type semiconductor back surface including an adhesive layer and a protective layer laminated on the adhesive layer, in which the protective layer is constituted of a heat-resistant resin having a glass transition temperature of 200° C. or more or a metal.
    Type: Application
    Filed: February 27, 2014
    Publication date: June 26, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naohide TAKAMOTO, Goji SHIGA, Fumiteru ASAI
  • Publication number: 20140154450
    Abstract: A polyvinyl chloride-based adhesive tape or sheet has a base material layer formed to include 10 to 40 parts by weight of plasticizing agent(s) in relation to 100 parts by weight of a polyvinyl chloride-based resin and an adhesive layer on one surface of the base material layer, the plasticizing agent includes at least one type of plasticizing agent having an SP value of at least 9.0.
    Type: Application
    Filed: March 2, 2012
    Publication date: June 5, 2014
    Applicants: NITTO EUROPE N.V., NITTO DENKO CORPORATION
    Inventors: Takumi Yutou, Fumiteru Asai, Toshio Shintani, Toshitaka Suzuki, Minoru Hanaoka, Edwin Thys, Bart Forier
  • Patent number: 8722517
    Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, including a film for flip chip type semiconductor back surface for protecting a back surface of a semiconductor element flip chip-connected onto an adherend, and a dicing tape, the dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material, the film for flip chip type semiconductor back surface being formed on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is a radiation-curable pressure-sensitive adhesive layer whose pressure-sensitive adhesive force toward the film for flip chip type semiconductor back surface is decreased by irradiation with a radiation ray.
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: May 13, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Naohide Takamoto, Goji Shiga, Fumiteru Asai, Toshimasa Sugimura
  • Patent number: 8679931
    Abstract: The present invention relates to a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material layer, a first pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer stacked in this order, and a film for semiconductor back surface stacked on the second pressure-sensitive adhesive layer of the dicing tape, in which a peel strength Y between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer is larger than a peel strength X between the second pressure-sensitive adhesive layer and the film for semiconductor back surface, and in which the peel strength X is from 0.01 to 0.2 N/20 mm, and the peel strength Y is from 0.2 to 10 N/20 mm.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: March 25, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Fumiteru Asai, Goji Shiga, Naohide Takamoto
  • Patent number: 8652938
    Abstract: The present invention relates to a thermally releasable sheet-integrated film for semiconductor back surface, which includes: a pressure-sensitive adhesive sheet including a base material layer and a pressure-sensitive adhesive layer, and a film for semiconductor back surface formed on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet, in which the pressure-sensitive adhesive sheet is a thermally releasable pressure-sensitive adhesive sheet whose peel force from the film for semiconductor back surface decreases upon heating.
    Type: Grant
    Filed: July 26, 2011
    Date of Patent: February 18, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Naohide Takamoto, Goji Shiga, Fumiteru Asai
  • Patent number: 8647956
    Abstract: The present invention relates to a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material layer, a first pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer stacked in this order, and a film for semiconductor back surface stacked on the second pressure-sensitive adhesive layer of the dicing tape, in which a peel strength Y between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer is larger than a peel strength X between the second pressure-sensitive adhesive layer and the film for semiconductor back surface, and in which the peel strength X is from 0.01 to 0.2 N/20 mm, and the peel strength Y is from 0.2 to 10 N/20 mm.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: February 11, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Fumiteru Asai, Goji Shiga, Naohide Takamoto
  • Publication number: 20140037923
    Abstract: The present invention relates to a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material layer, a first pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer stacked in this order, and a film for semiconductor back surface stacked on the second pressure-sensitive adhesive layer of the dicing tape, in which a peel strength Y between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer is larger than a peel strength X between the second pressure-sensitive adhesive layer and the film for semiconductor back surface, and in which the peel strength X is from 0.01 to 0.2 N/20 mm, and the peel strength Y is from 0.2 to 10 N/20 mm.
    Type: Application
    Filed: October 11, 2013
    Publication date: February 6, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Fumiteru ASAI, Goji Shiga, Naohide TAKAMOTO