Abstract: An encapsulating material for solar cell excellent in a balance among properties including transparency, flexibility, adhesiveness, heat resistance, appearance, crosslinking properties, electrical properties and calender moldability. The encapsulating material includes an ethylene/?-olefin copolymer satisfying the following requirements: (a1) the content ratio of structural units derived from ethylene is from 80 to 90 mol % and the content ratio of structural units derived from ?-olefin having 3 to 20 carbon atoms is from 10 to 20 mol %; (a2) MFR is equal to or more than 2 g/10 minutes and less than 10 g/10 minutes as measured under the conditions of a temperature of 190 degrees centigrade and a load of 2.16 kg in accordance with ASTM D1238; (a3) the density is from 0.865 to 0.884 g/cm3 as measured in accordance with ASTM D1505; and (a4) the shore A hardness is from 60 to 85 as measured in accordance with ASTM D2240.

Abstract: An encapsulating material for solar cell of the invention contains an ethylene/?-olefin copolymer, an organic peroxide, at least one crosslinking aid selected from a group consisting of divinyl aromatic compounds, cyanurates, diallyl compounds, triallyl compounds, oximes and maleimides, and a (meth)acrylate-based monomer. The content of the (meth)acrylate-based monomer in the encapsulating material for solar cell is in a range of 0.1 parts by weight to 5.0 parts by weight with respect to 100 parts by weight of the ethylene/?-olefin copolymer, and the content of the crosslinking aid in the encapsulating material for solar cell is in a range of 0.1 parts by weight to 3 parts by weight with respect to 100 parts by weight of the ethylene/?-olefin copolymer.

Abstract: An encapsulating material for solar cell is made of a resin composition containing a crosslinkable resin, and satisfies the following 1) and 2). 1) When the encapsulating material for solar cell is immersed in acetone at 23° C. for one hour after a crosslinking treatment in which the encapsulating material for solar cell is heated and depressurized at 150° C. and 250 Pa for three minutes, and then is heated and pressurized at 150° C. and 100 kPa for 15 minutes, an acetone-absorbing ratio is in a range of 3.5 weight % to 12.0 weight % with respect to the weight of the above-described crosslinking-treated encapsulating material for solar cell. 2) A volume resistivity of the above-described crosslinking-treated encapsulating material for solar cell, which is based on JIS K6911 and measured at a temperature of 100° C. with an applied voltage of 500 V, is in a range of 1.0×1013 ?·cm to 1.0×1018 ?·cm.

Abstract: The encapsulating material for solar cell is an encapsulating material for solar cell including an ethylene/?-olefin copolymer and an organic peroxide having a one-minute half-life temperature in a range of 100° C. to 170° C. In addition, the complex viscosity of the encapsulating material for solar cell has the minimum value (?*1) of the complex viscosity at a temperature in a range of 100° C. to lower than 135° C., the minimum value (?*1) of the complex viscosity is in a range of 6.0×103 Pa·s to 4.0×104 Pa·s, the complex viscosity (?2) of the encapsulating material for solar cell at 150° C. is in a range of 2.0×104 Pa·s to 1.0×105 Pa·s, and the content of the organic peroxide in the encapsulating material for solar cell is in a range of 0.1 parts by weight to 3 parts by weight with respect to 100 parts by weight of the ethylene/?-olefin copolymer.

Abstract: A solar-cell sealant that has excellent properties such as transparency, flexibility, adhesiveness, heat resistance, appearance, cross-linking characteristics, electrical characteristics, and calenderability. A solar-cell sealant that contains an ethylene/?-olefin/unconjugated-polyene copolymer satisfying requirements (a1) through (a3). Requirement (a1) is that constituent units derived from ethylene constitute 80-90 mol %, constituent units derived from C3-20 ?-olefin constitute 9.99-19.99 mol %, and constituent units derived from an unconjugated polyene constitute 0.01-5.0 mol % of said copolymer. Requirement (a2) is that the MFR of said copolymer, as measured in accordance with ASTM D1238 at 190° C. under a 2.16 kg load, be at least 2 g/10 min. and less than 10 g/10 min. Requirement (a3) is that the Shore A hardness of said copolymer, as measured in accordance with ASTM D2240, be 60 to 85.

Abstract: An encapsulating material for solar cell of the invention contains an ethylene/?-olefin copolymer, and a content of a fluorine element in the ethylene/?-olefin copolymer, which is determined using a combustion method and an ion chromatograph method, is equal to or less than 30 ppm.

Abstract: An ethylene resin composition is provided which has excellent properties including adhesion properties, electrically insulating properties, transparency, moldability and process stability and can be produced without requiring any cross-linking procedure if necessary to improve productivity; and others. The ethylene resin composition contains a modified product produced by modifying an ethylene polymer (A) that meets all of the requirements a) to e) mentioned below with an ethylenically unsaturated silane compound (B). a) The density is 900 to 940 kg/m3. b) The melting peak temperature is 90 to 125 ° C. as determined by DSC. c) The melt flow rate (MFR2) is 0.1 to 100 g/10 minutes as measured at 190 ° C. and a load of 2.16 kg in accordance with JIS K-6721. d) The Mw/Mn ratio is 1.2 to 3.5. e) The content of metal residues is 0.1 to 50 ppm.

Abstract: An encapsulating material for solar cell of the invention contains an ethylene/?-olefin copolymer, an organic peroxide, at least one crosslinking aid selected from a group consisting of divinyl aromatic compounds, cyanurates, diallyl compounds, triallyl compounds, oximes and maleimides, and a (meth)acrylate-based monomer. The content of the (meth)acrylate-based monomer in the encapsulating material for solar cell is in a range of 0.1 parts by weight to 5.0 parts by weight with respect to 100 parts by weight of the ethylene/?-olefin copolymer, and the content of the crosslinking aid in the encapsulating material for solar cell is in a range of 0.1 parts by weight to 3 parts by weight with respect to 100 parts by weight of the ethylene/?-olefin copolymer.

Abstract: An encapsulating material for solar cell that is capable of suppressing the corrosion of metal and the occurrence of yellowing at a high temperature and has excellent long-term reliability in a constant temperature and humidity is provided. The encapsulating material for solar cell of the invention contains an ethylene/?-olefin copolymer, a hindered amine-based light stabilizer, a hindered phenol-based stabilizer, and a phosphorous-based stabilizer as essential components.

Abstract: An encapsulating material for solar cell is made of a resin composition containing a crosslinkable resin, and satisfies the following 1) and 2). 1) When the encapsulating material for solar cell is immersed in acetone at 23° C. for one hour after a crosslinking treatment in which the encapsulating material for solar cell is heated and depressurized at 150° C. and 250 Pa for three minutes, and then is heated and pressurized at 150° C. and 100 kPa for 15 minutes, an acetone-absorbing ratio is in a range of 3.5 weight % to 12.0 weight % with respect to the weight of the above-described crosslinking-treated encapsulating material for solar cell. 2) A volume resistivity of the above-described crosslinking-treated encapsulating material for solar cell, which is based on JIS K6911 and measured at a temperature of 100° C. with an applied voltage of 500 V, is in a range of 1.0×1013 ?·cm to 1.0×1018 ?·cm.

Abstract: An encapsulating material for solar cell containing an ethylene/?-olefin copolymer satisfying the following a1) and a2), and a specific peroxyketal having a 1-hour half-life temperature in a range of 100 to 135 degrees centigrade; the peroxyketal being contained in an amount of 0.1 to less than 0.8 weight parts relative to 100 weight parts of the ethylene/?-olefin copolymer. a1) the shore A hardness is from 60 to 85 as measured in accordance with ASTM D2240. a2) MFR is from 2 to 50 g/10 minutes as measured under the conditions of a temperature of 190 degrees centigrade and a load of 2.

Abstract: Disclosed is an encapsulating material for solar cell containing an ethylene/?-olefin copolymer satisfying the following requirements (a1) to (a4): (a1) the content ratio of structural units derived from ethylene is from 80 to 90 mol % and the content ratio of structural units derived from ?-olefin having 3 to 20 carbon atoms is from 10 to 20 mol %; (a2) MFR is from 10 to 50 g/10 minutes as measured under the conditions of a temperature of 190 degrees centigrade and a load of 2.16 kg in accordance with ASTM D1238; (a3) the density is from 0.865 to 0.884 g/cm3 as measured in accordance with ASTM D1505; and (a4) the shore A hardness is from 60 to 85 as measured in accordance with ASTM D2240.

Abstract: A solar-cell sealant that has excellent properties such as transparency, flexibility, adhesiveness, heat resistance, appearance, cross-linking characteristics, electrical characteristics, and calenderability. A solar-cell sealant that contains an ethylene/?-olefin/unconjugated-polyene copolymer satisfying requirements (a1) through (a3). Requirement (a1) is that constituent units derived from ethylene constitute 80-90 mol %, constituent units derived from C3-20 ?-olefin constitute 9.99-19.99 mol %, and constituent units derived from an unconjugated polyene constitute 0.01-5.0 mol % of said copolymer. Requirement (a2) is that the MFR of said copolymer, as measured in accordance with ASTM D1238 at 190° C. under a 2.16 kg load, be at least 2 g/10 min. and less than 10 g/10 min. Requirement (a3) is that the Shore A hardness of said copolymer, as measured in accordance with ASTM D2240, be 60 to 85.

Abstract: An encapsulating material for solar cell excellent in a balance among properties including transparency, flexibility, adhesiveness, heat resistance, appearance, crosslinking properties, electrical properties and calender moldability. The encapsulating material includes an ethylene/?-olefin copolymer satisfying the following requirements: (a1) the content ratio of structural units derived from ethylene is from 80 to 90 mol % and the content ratio of structural units derived from ?-olefin having 3 to 20 carbon atoms is from 10 to 20 mol %; (a2) MFR is equal to or more than 2 g/10 minutes and less than 10 g/10 minutes as measured under the conditions of a temperature of 190 degrees centigrade and a load of 2.16 kg in accordance with ASTM D1238; (a3) the density is from 0.865 to 0.884 g/cm3 as measured in accordance with ASTM D1505; and (a4) the shore A hardness is from 60 to 85 as measured in accordance with ASTM D2240.

Abstract: Disclosed is an encapsulating material for solar cell containing an ethylene/?-olefin copolymer satisfying the following requirements (a1) to (a4): (a1) the content ratio of structural units derived from ethylene is from 80 to 90 mol % and the content ratio of structural units derived from ?-olefin having 3 to 20 carbon atoms is from 10 to 20 mol %; (a2) MFR is from 10 to 50 g/10 minutes as measured under the conditions of a temperature of 190 degrees centigrade and a load of 2.16 kg in accordance with ASTM D1238; (a3) the density is from 0.865 to 0.884 g/cm3 as measured in accordance with ASTM D1505; and (a4) the shore A hardness is from 60 to 85 as measured in accordance with ASTM D2240.

Abstract: The purpose of the present invention is to provide an ethylene resin composition which has excellent properties including adhesion properties, electrically insulating properties, transparency, moldability and process stability and can be produced without requiring any cross-linking procedure if necessary to improve productivity; and others. The ethylene resin composition contains a modified product produced by modifying an ethylene polymer (A) that meets all of the requirements a) to e) mentioned below with an ethylenically unsaturated silane compound (B). a) The density is 900 to 940 kg/m3. b) The melting peak temperature is 90 to 125 DEG C as determined by DSC. c) The melt flow rate (MFR2) is 0.1 to 100 g/10 minutes as measured at 190° C. and a load of 2.16 kg in accordance with JIS K-6721. d) The Mw/Mn ratio is 1.2 to 3.5. e) The content of metal residues is 0.1 to 50 ppm.

Abstract: Disclosed is a photocurable resin composition which is highly sensitive to ultraviolet light or visible light having a long wavelength, in particular a photocurable resin composition which is useful as a sealing agent. Specifically disclosed is a photocurable resin composition containing a component (a) which is composed of an anthraquinone derivative represented by the formula (I) below, and a component (b) which is composed of a compound having a (meth)acryloyl group in the molecule. The photocurable resin composition is characterized in that a part or the entire of the component (b) further contains an oxiranyl group in the molecule, and the component (a) content is 0.01-10% by mass relative to the component (b) content. [chemical formula 1] (I) (In the formula (I), X represents a phenyl group, an alkyl group having 1-8 carbon atoms, an alcoholic form of the phenyl group or the alkyl group, or a derivative of the alcoholic form.

Abstract: A one component resin composition curable with a combination of light and heat, which comprises (1) an epoxy resin, (2) an acrylic ester monomer and/or methacrylic ester monomer, or an oligomer thereof, (3) a latent epoxy curing agent, (4) a photo radical initiator, and (5) a compound having two or more thiol groups per molecule, wherein the ingredient (5) is contained in an amount of 0.001 to 5.0 parts by weight per 100 parts by weight of this resin composition. According to the present invention, a one component resin composition curable with a combination of light and heat, which has excellent curability especially in a light-shielded area can be provided. Also, a liquid crystal sealant composition curable with a combination of light and heat, which is applicable to the one-drop-fill method and has excellent curability in light-shielded areas and adhesion reliability, especially high-temperature and high-humidity adhesion reliability, can be provided.

Abstract: A liquid crystal sealing agent composition that is a one-component light and heat-curable resin composition containing: (1) a solid epoxy resin having a ring and ball method softening temperature of 40° C. or above; (2) an acrylate monomer and/or a methacrylate monomer, or an oligomer thereof; (3) a thermoplastic polymer having a ring and ball method softening temperature of 50 to 120° C., the thermoplastic polymer being obtained by copolymerizing an acrylate monomer and/or a methacrylate monomer with a monomer copolymerizable therewith; (4) a light-activated radical polymerization initiator; and (5) a latent epoxy curing agent.

Abstract: Disclosed is a photocurable resin composition which is highly sensitive to ultraviolet light or visible light having a long wavelength, in particular a photocurable resin composition which is useful as a sealing agent. Specifically disclosed is a photocurable resin composition containing a component (a) which is composed of an anthraquinone derivative represented by the formula (I) below, and a component (b) which is composed of a compound having a (meth)acryloyl group in the molecule. The photocurable resin composition is characterized in that a part or the entire of the component (b) further contains an oxiranyl group in the molecule, and the component (a) content is 0.01-10% by mass relative to the component (b) content. [chemical formula 1] (I) (In the formula (I), X represents a phenyl group, an alkyl group having 1-8 carbon atoms, an alcoholic form of the phenyl group or the alkyl group, or a derivative of the alcoholic form.