Patents by Inventor Fumito Takeuchi

Fumito Takeuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • One component resin composition curable with combination of light and heat and use of the same
    Publication number: 20070096056
    Abstract: A one component resin composition curable with a combination of light and heat, which comprises (1) an epoxy resin, (2) an acrylic ester monomer and/or methacrylic ester monomer, or an oligomer thereof, (3) a latent epoxy curing agent, (4) a photo radical initiator, and (5) a compound having two or more thiol groups per molecule, wherein the ingredient (5) is contained in an amount of 0.001 to 5.0 parts by weight per 100 parts by weight of this resin composition. According to the present invention, a one component resin composition curable with a combination of light and heat, which has excellent curability especially in a light-shielded area can be provided. Also, a liquid crystal sealant composition curable with a combination of light and heat, which is applicable to the one-drop-fill method and has excellent curability in light-shielded areas and adhesion reliability, especially high-temperature and high-humidity adhesion reliability, can be provided.
    Type: Application
    Filed: November 25, 2004
    Publication date: May 3, 2007
    Applicants: MITSUI CHEMICALS, INC., SHARP KABUSHIKI KAISHA
    Inventors: Fumito Takeuchi, Takahisa Miyawaki, Kenji Itou, Kenichi Yashiro, Kei Nagata, Souta Itou, Tazo Ikeguchi, Nobuo Sasaki, Makoto Nakahara
  • Sealing composition for liquid crystal displays and process for production of liquid crystal display panels
    Publication number: 20060009579
    Abstract: A liquid crystal sealing agent composition that is a one-component light and heat-curable resin composition containing: (1) a solid epoxy resin having a ring and ball method softening temperature of 40° C. or above; (2) an acrylate monomer and/or a methacrylate monomer, or an oligomer thereof; (3) a thermoplastic polymer having a ring and ball method softening temperature of 50 to 120° C., the thermoplastic polymer being obtained by copolymerizing an acrylate monomer and/or a methacrylate monomer with a monomer copolymerizable therewith; (4) a light-activated radical polymerization initiator; and (5) a latent epoxy curing agent.
    Type: Application
    Filed: September 19, 2003
    Publication date: January 12, 2006
    Applicant: MITSUI CHEMICALS AND AND SHARP KABUSHIKI KAISHA
    Inventors: Takahisa Miyawaki, Yasushi Mizuta, Fumito Takeuchi, Kenji Itou, Tadashi Kitamura, Hiroyuki Asakura, Kenichi yashiro, Kei Nagata