Patents by Inventor Fumitsugu Fukuyo
Fumitsugu Fukuyo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11733464Abstract: A fiber structure includes first and second optical fibers disposed such that end portions thereof butt, a sheet-shaped saturable absorber including a carbon nanotube and disposed between the end portion of the first optical fiber and the end portion of the second optical fiber, and a housing internally accommodating the end portion of the first optical fiber and the end portion of the second optical fiber. A space in the housing including the saturable absorber is airtight.Type: GrantFiled: July 11, 2019Date of Patent: August 22, 2023Assignee: HAMAMATSU PHOTONICS K.K.Inventors: Ryota Kakei, Shin Kato, Fumitsugu Fukuyo, Tomoya Nakazawa, Masaru Shimomaki, Shinichi Ohba, Yu Matsushiro
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Publication number: 20220352026Abstract: A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate 1, and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face 21 of the semiconductor substrate 1 after the step of forming the starting point region for cutting such that the semiconductor substrate 1 attains a predetermined thickness.Type: ApplicationFiled: July 19, 2022Publication date: November 3, 2022Applicant: HAMAMATSU PHOTONICS K.K.Inventors: Yoshimaro FUJII, Fumitsugu FUKUYO, Kenshi FUKUMITSU, Naoki UCHIYAMA
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Patent number: 11424162Abstract: A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate 1, and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face 21 of the semiconductor substrate 1 after the step of forming the starting point region for cutting such that the semiconductor substrate 1 attains a predetermined thickness.Type: GrantFiled: March 16, 2021Date of Patent: August 23, 2022Assignee: HAMAMATSU PHOTONICS K.K.Inventors: Yoshimaro Fujii, Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama
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Patent number: 11241757Abstract: A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.Type: GrantFiled: April 10, 2019Date of Patent: February 8, 2022Assignee: HAMAMATSU PHOTONICS K.K.Inventors: Kazuhiro Atsumi, Koji Kuno, Masayoshi Kusunoki, Tatsuya Suzuki, Kenshi Fukumitsu, Fumitsugu Fukuyo
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Publication number: 20210376554Abstract: A fiber structure includes first and second optical fibers disposed such that tip portions thereof butt and a sheet-shaped saturable absorber sandwiched between the tip portion of the first optical fiber and the tip portion of the second optical fiber. Each of the tip portions of the first optical fiber and the second optical fiber has a core, a cladding provided around the core, and a ferrule provided around the cladding. The tip portion of the first optical fiber has a protruding shape protruding to a tip side. The saturable absorber has an adhering part at least adhering to the core of the first optical fiber and a non-adhering part present around the adhering part and not adhering to the tip portion of the first optical fiber.Type: ApplicationFiled: July 11, 2019Publication date: December 2, 2021Applicant: HAMAMATSU PHOTONICS K.K.Inventors: Ryota KAKEI, Shin KATO, Masaru SHIMOMAKI, Fumitsugu FUKUYO, Tomoya NAKAZAWA, Yu MATSUSHIRO
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Publication number: 20210373246Abstract: A fiber structure includes first and second optical fibers disposed such that end portions thereof butt, a sheet-shaped saturable absorber including a carbon nanotube and disposed between the end portion of the first optical fiber and the end portion of the second optical fiber, and a housing internally accommodating the end portion of the first optical fiber and the end portion of the second optical fiber. A space in the housing including the saturable absorber is airtight.Type: ApplicationFiled: July 11, 2019Publication date: December 2, 2021Applicant: HAMAMATSU PHOTONICS K.K.Inventors: Ryota KAKEI, Shin KATO, Fumitsugu FUKUYO, Tomoya NAKAZAWA, Masaru SHIMOMAKI, Shinichi OHBA, Yu MATSUSHIRO
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Publication number: 20210210387Abstract: A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate 1, and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face 21 of the semiconductor substrate 1 after the step of forming the starting point region for cutting such that the semiconductor substrate 1 attains a predetermined thickness.Type: ApplicationFiled: March 16, 2021Publication date: July 8, 2021Applicant: HAMAMATSU PHOTONICS K.K.Inventors: Yoshimaro FUJII, Fumitsugu FUKUYO, Kenshi FUKUMITSU, Naoki UCHIYAMA
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Patent number: 10796959Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein at pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.Type: GrantFiled: November 9, 2017Date of Patent: October 6, 2020Assignee: HAMAMATSU PHOTONICS K.K.Inventors: Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda
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Publication number: 20200203225Abstract: A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate 1, and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face 21 of the semiconductor substrate 1 after the step of forming the starting point region for cutting such that the semiconductor substrate 1 attains a predetermined thickness.Type: ApplicationFiled: March 2, 2020Publication date: June 25, 2020Applicant: HAMAMATSU PHOTONICS K.K.Inventors: Yoshimaro FUJII, Fumitsugu FUKUYO, Kenshi FUKUMITSU, Naoki UCHIYAMA
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Patent number: 10622255Abstract: A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate 1, and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face 21 of the semiconductor substrate 1 after the step of forming the starting point region for cutting such that the semiconductor substrate 1 attains a predetermined thickness.Type: GrantFiled: July 31, 2018Date of Patent: April 14, 2020Assignee: HAMAMATSU PHOTONICS K.K.Inventors: Yoshimaro Fujii, Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama
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Publication number: 20190232422Abstract: A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.Type: ApplicationFiled: April 10, 2019Publication date: August 1, 2019Applicant: HAMAMATSU PHOTONICS K.K.Inventors: Kazuhiro ATSUMI, Koji KUNO, Masayoshi KUSUNOKI, Tatsuya SUZUKI, Kenshi FUKUMITSU, Fumitsugu FUKUYO
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Patent number: 10293433Abstract: A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.Type: GrantFiled: September 2, 2016Date of Patent: May 21, 2019Assignee: HAMAMATSU PHOTONICS K.K.Inventors: Kazuhiro Atsumi, Koji Kuno, Masayoshi Kusunoki, Tatsuya Suzuki, Kenshi Fukumitsu, Fumitsugu Fukuyo
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Publication number: 20180350682Abstract: A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate 1, and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face 21 of the semiconductor substrate 1 after the step of forming the starting point region for cutting such that the semiconductor substrate 1 attains a predetermined thickness.Type: ApplicationFiled: July 31, 2018Publication date: December 6, 2018Inventors: Yoshimaro FUJII, Fumitsugu FUKUYO, Kenshi FUKUMITSU, Naoki UCHIYAMA
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Patent number: 10068801Abstract: A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate 1, and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face 21 of the semiconductor substrate 1 after the step of forming the starting point region for cutting such that the semiconductor substrate 1 attains a predetermined thickness.Type: GrantFiled: June 8, 2017Date of Patent: September 4, 2018Assignee: HAMAMATSU PHOTONICS K.K.Inventors: Yoshimaro Fujii, Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama
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Publication number: 20180068897Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein at pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.Type: ApplicationFiled: November 9, 2017Publication date: March 8, 2018Inventors: Fumitsugu FUKUYO, Kenshi FUKUMITSU, Naoki UCHIYAMA, Toshimitsu WAKUDA
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Patent number: 9852898Abstract: A target for ultraviolet light generation comprises a substrate adapted to transmit ultraviolet light therethrough and a light-emitting layer, disposed on the substrate, for generating ultraviolet light in response to an electron beam. The light-emitting layer includes a powdery or granular oxide crystal containing Lu and Si doped with an activator (e.g., Pr:LPS and Pr:LSO crystals).Type: GrantFiled: September 6, 2013Date of Patent: December 26, 2017Assignee: HAMAMATSU PHOTONICS K.K.Inventors: Yoshinori Honda, Hiroyuki Taketomi, Fumitsugu Fukuyo, Koji Kawai, Hidetsugu Takaoka, Takashi Suzuki
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Patent number: 9837315Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.Type: GrantFiled: December 31, 2014Date of Patent: December 5, 2017Assignee: HAMAMATSU PHOTONICS K.K.Inventors: Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda
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Publication number: 20170271210Abstract: A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate 1, and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face 21 of the semiconductor substrate 1 after the step of forming the starting point region for cutting such that the semiconductor substrate 1 attains a predetermined thickness.Type: ApplicationFiled: June 8, 2017Publication date: September 21, 2017Inventors: Yoshimaro FUJII, Fumitsugu FUKUYO, Kenshi FUKUMITSU, Naoki UCHIYAMA
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Patent number: 9728393Abstract: A target for ultraviolet light generation comprises a substrate adapted to transmit ultraviolet light therethrough and a light-emitting layer disposed on the substrate and generating ultraviolet light UV in response to an electron beam. The light-emitting layer includes a powdery or granular rare-earth-containing aluminum garnet crystal doped with an activator. The light-emitting layer has an ultraviolet light emission peak wavelength of 300 nm or shorter.Type: GrantFiled: September 6, 2013Date of Patent: August 8, 2017Assignee: HAMAMATSU PHOTONICS K.K.Inventors: Yoshinori Honda, Hiroyuki Taketomi, Fumitsugu Fukuyo, Koji Kawai, Hidetsugu Takaoka, Takashi Suzuki
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Patent number: 9711405Abstract: A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate 1, and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face 21 of the semiconductor substrate 1 after the step of forming the starting point region for cutting such that the semiconductor substrate 1 attains a predetermined thickness.Type: GrantFiled: December 30, 2015Date of Patent: July 18, 2017Assignee: HAMAMATSU PHOTONICS K.K.Inventors: Yoshimaro Fujii, Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama