Patents by Inventor Fung Chen

Fung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050246991
    Abstract: The present invention relates to a one component adhesive for adhering polymeric membranes to roof substrates. The one component adhesives are comprised of the reaction product of an isocyanate and a mixture of a compound having an average of two isocyanate reactive functional groups and a compound having an average of three isocyanate reactive functional groups.
    Type: Application
    Filed: February 18, 2005
    Publication date: November 10, 2005
    Inventors: Gang-Fung Chen, Chung-Ying Chang
  • Patent number: 6951701
    Abstract: A method for optically transferring a lithographic pattern corresponding to an integrated circuit utilizing a high transmission attenuated phase-shift mask onto a semiconductor substrate by use of an optical exposure tool. The method comprising the steps of generating a diffraction pattern corresponding to the lithographic pattern, where the diffraction pattern indicates a plurality of spatial frequency components corresponding to the lithographic pattern; determining which of the spatial frequency components need to be captured by a lens in the optical exposure tool in order to accurately reproduce the lithographic pattern; determining a set of illumination conditions required for the optical exposure tool to capture the spatial frequency components necessary for accurately reproducing the lithographic pattern; and illuminating the high transmission attenuated phase-shift mask with this set of illumination conditions.
    Type: Grant
    Filed: August 19, 2002
    Date of Patent: October 4, 2005
    Assignee: ASML Masktools B.V.
    Inventors: Michael Hsu, Stephen Hsu, Thomas Laidig, Douglas Van Den Broeke, Jang Fung Chen
  • Patent number: 6920628
    Abstract: A method of generating a mask for use in printing a target pattern on a substrate. The method includes the steps of: (a) determining a target pattern representing a circuit design to be printed on a substrate; (b) generating a first pattern by scaling the target pattern by a factor of 0.5; and (c) generating a second pattern by performing a Boolean operation which combines the target pattern and the first pattern. The second pattern is then utilized to print the target pattern on the substrate.
    Type: Grant
    Filed: March 25, 2003
    Date of Patent: July 19, 2005
    Assignee: ASML Masktools B.V.
    Inventors: Jang Fung Chen, Douglas Van Den Broeke
  • Patent number: 6915505
    Abstract: A method of printing a gate pattern on a substrate comprising the steps of: identifying at least one area in the pattern in which one of the gate features overlays one of the active regions; reducing a width dimension of the one of the gate features at the location which the one of the gate features overlays the one of the active regions; extracting the gate features from the pattern; decomposing the gate features into a vertical component mask and a horizontal component mask; and illuminating the vertical component mask and the horizontal component mask utilizing dipole illumination.
    Type: Grant
    Filed: March 25, 2003
    Date of Patent: July 5, 2005
    Assignee: ASML Masktools B.V.
    Inventors: Stephen D. Hsu, Noel Corcoran, Jang Fung Chen
  • Patent number: 6875545
    Abstract: A method of transferring a lithographic pattern onto a substrate by use of a lithographic apparatus. The method includes the steps of: (1) defining features to be printed on the substrate; (2) determining which of the features require assist features to be disposed adjacent thereto in order for the features to be printed within defined resolution limits; (3) generating a mask containing the features to be printed and the assist features; (4) performing a first illumination process so as to print the features on the substrate, the first illumination process resulting in the partial printing of the assist features on the substrate; and (5) performing a second illumination process so as to reduce the amount of the assist features printed on the substrate; the second illumination process entails the step of performing a quadrapole illumination.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: April 5, 2005
    Assignee: ASML Masktools B.V.
    Inventors: Markus Franciscus Antonius Eurlings, Jang Fung Chen, Duan-Fu Stephen Hsu
  • Patent number: 6851103
    Abstract: A method of generating a mask of use in printing a target pattern on a substrate. The method includes the steps of (a) determining a maximum width of features to be imaged on the substrate utilizing phase-structures formed in the mask; (b) identifying all features contained in the target pattern having a width which is equal to or less than the maximum width; (c) extracting all features having a width which is equal to or less than the maximum width from the target pattern; (d) forming phase-structures in the mask corresponding to all features identified in step (b); and (e) forming opaque structures in the mask for all features remaining in target pattern after performing step (c).
    Type: Grant
    Filed: March 25, 2003
    Date of Patent: February 1, 2005
    Assignee: ASML Masktools, B.V.
    Inventors: Doug Van Den Broeke, Jang Fung Chen, Thomas Laidig, Kurt E. Wampler, Stephen Hsu
  • Patent number: 6835510
    Abstract: A method of forming a hybrid mask for optically transferring a lithographic pattern corresponding to an integrated circuit from the mask onto a semiconductor substrate by use of an optical exposure tool. The method includes the steps of forming at least one non-critical feature on the mask utilizing one of a low-transmission phase-shift mask (pattern) and a non-phase shifting mask (pattern), and forming at least one critical feature on the mask utilizing a high-transmission phase-shift mask (pattern).
    Type: Grant
    Filed: September 16, 2003
    Date of Patent: December 28, 2004
    Assignee: ASML Masktools B.V.
    Inventors: Jang Fung Chen, Roger Caldwell, Thomas Laidig, Kurt E. Wampler
  • Publication number: 20040229133
    Abstract: Disclosed concepts include a method of optimizing an illumination profile of a pattern to be formed in a surface of a substrate. Illumination is optimized by defining a transmission cross coefficient (“TCC”) function determined in accordance with an illumination pupil and a projection pupil corresponding to an illuminator, representing at least one resolvable feature of a mask to be printed on the substrate by at least one impulse function, and creating an interference map of a predetermined order based on the at least one impulse function and the TCC function, wherein the interference map represents the at least one resolvable feature to be printed on the substrate and areas of destructive interference.
    Type: Application
    Filed: January 14, 2004
    Publication date: November 18, 2004
    Inventors: Robert John Socha, Xuelong Shi, Douglas Van Den Broeke, Jang Fung Chen
  • Publication number: 20040209170
    Abstract: A method of generating a mask design having optical proximity correction features disposed therein. The methods includes the steps of obtaining a desired target pattern having features to be imaged on a substrate; determining an interference map based on the target pattern, the interference map defining areas of constructive interference and areas of destructive interference between at least one of the features to be imaged and a field area adjacent the at least one feature; and placing assist features in the mask design based on the areas of constructive interference and the areas of destructive interference.
    Type: Application
    Filed: January 14, 2004
    Publication date: October 21, 2004
    Inventors: Douglas Van Den Broeke, Jang Fung Chen, Thomas Laidig, Kurt E. Wampler, Stephen Duan-Fu Hsu
  • Patent number: 6792591
    Abstract: Optical proximity effects (OPEs) are a well-known phenomenon in photolithography. OPEs result from the structural interaction between the main feature and neighboring features. It has been determined by the present inventors that such structural interactions not only affect the critical dimension of the main feature at the image plane, but also the process latitude of the main feature. Moreover, it has been determined that the variation of the critical dimension as well as the process latitude of the main feature is a direct consequence of light field interference between the main feature and the neighboring features. Depending on the phase of the field produced by the neighboring features, the main feature critical dimension and process latitude can be improved by constructive light field interference, or degraded by destructive light field interference. The phase of the field produced by the neighboring features is dependent on the pitch as well as the illumination angle.
    Type: Grant
    Filed: February 27, 2002
    Date of Patent: September 14, 2004
    Assignee: ASML Masktools B.V.
    Inventors: Xuelong Shi, Jang Fung Chen, Duan-Fu Stephen Hsu
  • Patent number: 6788400
    Abstract: A method of detecting aberrations associated with a projection lens utilized in an optical lithography system. The method includes the steps of forming a mask for transferring a lithographic pattern onto a substrate, forming a plurality of non-resolvable features disposed on the mask, where the plurality of non-resolvable features are arranged so as to form a predetermined pattern on the substrate, exposing the mask using an optical exposure tool so as to print the mask on the substrate, and analyzing the position of the predetermined pattern formed on the substrate and the position of the plurality of non-resolvable features disposed on the mask so as to determine if there is an aberration. If the position of the predetermined pattern formed on the substrate differs from an expected position, which is determined from the position of the plurality of non-resolvable features, this shift from the expected position indicates the presence of an aberration.
    Type: Grant
    Filed: December 4, 2001
    Date of Patent: September 7, 2004
    Assignee: ASML Masktools B.V.
    Inventor: J. Fung Chen
  • Publication number: 20040151916
    Abstract: One aspect of the present invention is an adhesive composition formed from two packs. One pack includes an isocyanate-functional prepolymer formed by reacting a polyisocyanate with an alcohol (e.g., polyol). The isocyanate equivalents from the polyisocyanate exceed the hydroxyl equivalents from the alcohol. The second pack is an aqueous polymer emulsion. These two packs are combined to form the novel adhesive composition. Another aspect of the invention is a method for joining together two surfaces of wood products by application of an adhesive thereto. The first step in this method is to mist with water the wood product surfaces to be joined. An adhesive composition then is applied to the misted wood product surfaces. Alternatively, the water misting can be replaced with an aqueous emulsion being part of the adhesive composition. Finally, the adhesive composition is cured.
    Type: Application
    Filed: July 24, 2003
    Publication date: August 5, 2004
    Inventors: Gang-Fung Chen, Gary J. Walsworth
  • Publication number: 20040142251
    Abstract: A method of generating complementary masks for use in a multiple-exposure lithographic imaging process.
    Type: Application
    Filed: November 12, 2003
    Publication date: July 22, 2004
    Inventors: Duan-Fu Stephen Hsu, Kurt E. Wampler, Markus Franciscus Antonius Eurlings, Jang Fung Chen, Noel Corcoran
  • Publication number: 20040140055
    Abstract: Adhesive additives that are used in conjunction with polyisocyanate resins to form adhesive compositions. The adhesive additives contain castor oil, a mixture of castor oil and triglycerides, or a reaction product from the transesterification of one or more polyols and one or more triglycerides. The adhesive compositions are well suited for use as a binder in the manufacture of various composite products, particularly composite wood products including OSB construction panels and laminate composites.
    Type: Application
    Filed: January 21, 2003
    Publication date: July 22, 2004
    Inventors: Gang-Fung Chen, Stephen Hupp, Philip L. Schell
  • Publication number: 20040139418
    Abstract: A method of automatically applying optical proximity correction techniques to a reticle design containing a plurality of features. The method comprises the steps of: (1) generating a first set of rules for applying scatter bar assist features to the plurality of features for a given illumination setting; (2) generating a second set of rules for applying biasing to the plurality of features for said given illumination setting; (3) forming a look-up table containing the first set of rules and the second set of rules; and (4) analyzing each of the plurality of features with the first set of rules and the second set of rules contained in the look-up table to determine if either the first set of rules or the second set of rules is applicable to a given feature. If either the first set of rules or the second set of rules is applicable to the given feature, the given feature is modified in accordance with the applicable rule.
    Type: Application
    Filed: July 25, 2003
    Publication date: July 15, 2004
    Inventors: Xuelong Shi, Jang Fung Chen
  • Patent number: 6753954
    Abstract: A method of detecting aberrations associated with a projection lens utilized in an optical lithography system. The method includes the steps of forming a mask for transferring a lithographic pattern onto a substrate, forming a plurality of non-resolvable features disposed on the mask, where the plurality of non-resolvable features are arranged so as to form a predetermined pattern on the substrate, exposing the mask using an optical exposure tool so as to print the mask on the substrate, and analyzing the position of the predetermined pattern formed on the substrate and the position of the plurality of non-resolvable features disposed on the mask so as to determine if there is an aberration. If the position of the predetermined pattern formed on the substrate differs from an expected position, which is determined from the position of the plurality of non-resolvable features, this shift from the expected position indicates the presence of an aberration.
    Type: Grant
    Filed: December 6, 2000
    Date of Patent: June 22, 2004
    Assignee: ASML Masktools B.V.
    Inventor: J. Fung Chen
  • Publication number: 20040115539
    Abstract: A method of generating masks for printing a pattern including a plurality of features having varying critical dimensions. The method includes the steps of: (1) obtaining data representing the pattern; (2) defining a plurality of distinct zones based on the critical dimensions of the plurality of features; (3) categorizing each of the features into one of the plurality of distinct zones; and (4) modifying the mask pattern for each feature categorized into a predefined distinct zone of the plurality of distinct zones.
    Type: Application
    Filed: September 11, 2003
    Publication date: June 17, 2004
    Inventors: Doug Van Den Broeke, Chungwei Hsu, Jang Fung Chen
  • Publication number: 20040067423
    Abstract: A method of forming a hybrid mask for optically transferring a lithographic pattern corresponding to an integrated circuit from the mask onto a semiconductor substrate by use of an optical exposure tool. The method includes the steps of forming at least one non-critical feature on the mask utilizing one of a low-transmission phase-shift mask (pattern) and a non-phase shifting mask (pattern), and forming at least one critical feature on the mask utilizing a high-transmission phase-shift mask (pattern).
    Type: Application
    Filed: September 16, 2003
    Publication date: April 8, 2004
    Applicant: ASML MASKTOOLS NETHERLANDS B.V.
    Inventors: Jang Fung Chen, Roger Caldwell, Thomas Laidig, Kurt E. Wampler
  • Publication number: 20040010770
    Abstract: A method of generating a mask of use in printing a target pattern on a substrate. The method includes the steps of (a) determining a maximum width of features to be imaged on the substrate utilizing phase-structures formed in the mask; (b) identifying all features contained in the target pattern having a width which is equal to or less than the maximum width; (c) extracting all features having a width which is equal to or less than the maximum width from the target pattern; (d) forming phase-structures in the mask corresponding to all features identified in step (b); and (e) forming opaque structures in the mask for all features remaining in target pattern after performing step (c).
    Type: Application
    Filed: March 25, 2003
    Publication date: January 15, 2004
    Inventors: Doug Van Den Broeke, Jang Fung Chen, Thomas Laidig, Kurt E. Wampler, Stephen Hsu
  • Publication number: 20040006757
    Abstract: A method of generating a mask for use in printing a target pattern on a substrate. The method includes the steps of: (a) determining a target pattern representing a circuit design to be printed on a substrate; (b) generating a first pattern by scaling the target pattern by a factor of 0.5; and (c) generating a second pattern by performing a Boolean operation which combines the target pattern and the first pattern. The second pattern is then utilized to print the target pattern on the substrate.
    Type: Application
    Filed: March 25, 2003
    Publication date: January 8, 2004
    Inventors: Jang Fung Chen, Douglas Van Den Broeke