Abstract: A protective digit shield for a protective sports glove, the shield having a hard chassis portion and an energy absorbing portion forming a hinge. The chassis portion provides an arcuate channel in which the thumb/digit is received. The chassis is segmented along the longitudinal axis to provide a proximal portion and a distal portion corresponding generally with the proximal and distal phalanx bones of the thumb/digit. A resilient, energy absorbing element along the channel provides separation between the chassis and forms a living hinge such that the chassis can rotate. The energy absorbing element may also include a damping element along opposing edges at the segmented joint to absorb and dissipate forces and prevent hyperextension. In an alternate embodiment, the energy absorbing element is replaced with a connection cable for connecting the portions of the chassis.

Abstract: In one embodiment, a method for software security scanning employing a scan quality index may include (1) a server comprising at least one computer processor receiving an identification of a computer program for security scanning; (2) the server executing a security scan on the computer program resulting in at least one log file comprising results of the security scan; (3) the server executing a scan quality index tool that analyzes the at least one log file resulting in a scan quality index score; and (4) the server outputting the scan quality index score.

Abstract: The present disclosure is directed to a circuit board having a first polyimide coverlay, a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply, a third imaged metal layer, a second electrically insulating layer, a forth imaged metal layer and a second polyimide coverlay. The first polyimide coverlay, the polyimide bondply and the second polyimide coverlay are derived from 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl) benzidine, and 10 to 80 mole % 4,4?-oxydianiline.

Abstract: A protective shin guard includes a floating knee section attached to a shin section, both sections being formed of a hard outer shell overlying a non-rigid inner padding layer. The hard outer shell of the shin section is defined by a unique pattern of flexible hinges. An alternate embodiment that uses pliable transition inserts is also described. In addition, the shin guard is attached to the leg by a novel strap system including two elastic calf straps and one greater-than 360 degree (360+) behind-the-knee compression strap that combine to provide maximum protection to the user's shin and knee while maintaining flexibility.

Abstract: The present disclosure is directed to a circuit board having a first polyimide coverlay, a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply, a third imaged metal layer, a second electrically insulating layer, a forth imaged metal layer and a second polyimide coverlay. The first polyimide coverlay, the polyimide bondply and the second polyimide coverlay are derived from 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4?-oxydianiline.

Abstract: The present disclosure is directed to a circuit board having a first electrically insulating layer, a first imaged metal layer and a first polyimide coverlay derived from 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4?-oxydianiline. The circuit board does not have an adhesive layer between the first imaged metal layer and the polyimide coverlay.

Abstract: The present disclosure is directed to a circuit board having a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply comprising a polyimide derived from 80 to 90 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4?-oxydiphthalic anhydride and 100 mole % 2,2?-bis(trifluoromethyl) benzidine, a third imaged metal layer, a second electrically insulating layer and a fourth imaged metal layer.

Abstract: The present disclosure is directed to a circuit board having a first electrically insulating layer, a first imaged metal layer and a first polyimide coverlay comprising a polyimide derived from 80 to 90 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4?-oxydiphthalic anhydride and 100 mole % 2,2?-bis(trifluoromethyl) benzidine. An adhesive layer is not present between the first imaged metal layer and the first polyimide coverlay.

Abstract: The present disclosure is directed to a circuit board having a first polyimide coverlay and a second polyimide coverlay derived from 80 to 90 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4?-oxydiphthalic anhydride and 100 mole % 2,2?-bis(trifluoromethyl) benzidine or 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl) benzidine, and 10 to 80 mole % 4,4?-oxydianiline, a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply having a polyimide derived from 80 to 90 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 10 to 20 mole 4,4?-oxydiphthalic anhydride and 100 mole % 2,2?-bis(trifluoromethyl) benzidine, a third imaged metal layer, a second electrically insulating layer, a fourth imaged metal layer.

Abstract: The present disclosure is directed to a polyimide metal clad laminate. The metal clad laminate has a metal foil and a polyimide layer. The polyimide layer having a polyimide derived from 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4?-oxydianiline. The polyimide metal clad laminate does not have an adhesive layer between the metal foil and the polyimide layer.