Abstract: The invention relates to a fingerprint recognition module comprising a substrate consisting of a material that is electrically insulating at least on its upper side and at least partially thermally insulating. Said substrate receives a composite of structured thin films on its surface, which directly forms a measuring field on the surface of the substrate for measuring a fingerprint. Said composite consists of an array of resistive, temperature-dependent elements, and contains strip conductors which connect the resistive, temperature-dependent elements to at least one connection field located on the substrate, outside the measuring field, and form part of the composite of structured thin films.

Abstract: A process is provided for the intracellular manipulation of a biological cell (3) which is positioned adhering to a support area (5) in a culture medium (2). Inside the support area (5) for the cell (3) an opening into the membrane of the cell (3) is created spaced from its support edge. The edge of the cell membrane surrounding the opening, adhering to the support area (5), thus seals off the cell fluid situated in the interior of the cell (3) from the culture medium (2) and insulates the cell fluid against the culture medium (2). The interior of the cell (3) is manipulated through the opening. An apparatus for implementing the process is also provided, including an object carrier (4) with a support area (5) for adhering the cell and a poration tool (6) for creating the opening in the cell membrane. The poration tool (6) may be any of various chemical, mechanical and/or electrical devices.

Abstract: According to a method for producing a solid body (1) including a microstructure (2), the surface of a substrate (3) is provided with a masking layer (6) that is impermeable to a substance to be applied. The substance is then incorporated into the substrate regions not covered by the masking layer (6). A heat treatment is used to diffuse the substance into a substrate region covered by the masking layer (6) such that a concentration gradient of the substance is created in the substrate region covered by the masking layer (6), proceeding from the edge of the masking layer (6) inward with increasing distance from the edge. The masking layer (6) is then removed to expose the substrate region under this layer, and a near-surface layer of the substrate (3) in the exposed substrate region is converted by a chemical conversion reaction into a coating (9) which has a layer thickness profile corresponding to the concentration gradient of the substance contained in this near-surface layer.

Abstract: The invention relates to a method for producing a sensor (1), wherein a carrier chip (2) is produced. Said chip is provided with a sensor structure (3) comprising an active sensor surface (4). A material (9) capable of flowing is applied onto carrier chips (2) in such a way that the sensor structure (3) has a thinner layer thickness on said active sensor surface (4) than on the area of the carrier chip (2) which borders on the active sensor surface (4). The material (9) which is capable of flowing is hardened thereafter. The hardened material (9) is subsequently removed by chemical means from the surface which faces said carrier chip (2) until the active sensor surface of the sensor structure is layed bare.

Abstract: The invention relates to a method for producing an optical transmitting and receiving device (1, 1a) comprising a light emitting transmission element (3, 3a) and a receiving element (4, 4a) which converts this light into an electrical magnitude. The transmission and receiving elements are inserted into a silicon substrate. The optical transmitting and receiving device (1) is preferably inserted in a monolithic manner into a common substrate, comprising a sequence of superimposed layers for the light emitting transmission element (3) and the light receiving element (4). An electrically insulating intermediate layer (9, 9a) is incorporated between the transmission and receiving element.

Abstract: The invention relates to a capacitive magnetic field sensor. This sensor has a first electrode (2) and a second electrode (3), which are spaced apart from one another and which form a measurement capacitance. The first electrode (2) is situated on a first substrate body (4), and the second electrode (3) on a second substrate body (5). The second substrate body (5) is designed as a deformable membrane in the vicinity of the second electrode (3). A magnetic body (6) is situated in the vicinity of the second electrode (3) and the membrane, and is rigidly connected to the membrane and to the second electrode (3). As a result of this rigid connection, the influence of an external magnetic field on the magnetic body causes not only the magnetic body (6) to change its position but also causes the membrane and the second electrode (3) to change their position, since they are rigidly connected to said magnetic body.

Abstract: In a method for examination of the surface of an object for a topographic and/or a chemical property, the object-surface is impinged with surface-structure selective biocomponents for examination of a topographic property and/or with chemoselective biocomponents for the examination of a chemical property, together with a nutrient medium and/or an osmotic protective medium for the biocomponents. The biocomponents contained in the nutrient medium and/or the osmotic protective medium are in contact with the object-surface or are spaced from the object surface by less than the detection range of the biocomponents. The object surface is then examined with the biocomponents contained in the nutrient medium and/or the osmotic protective medium by determining at least one examination measurement value. The examination measurement value is compared with a reference measurement value, and conclusions can be drawn about the topographic and/or chemical properties of the object from the result of the comparison.

Abstract: A process for manufacturing a semiconductor arrangement (3), whereby in particular a wafer (1) with a large number of semiconductor arrangements forming chips (7) is manufactured, and the wafer is divided afterward, and in this way the semiconductor arrangements are separated. At least one region of a wafer side is covered by a passivation layer (9) during the etching of the remaining wafer area. After etching, the passivation layer (9) is removed. At least in an outer edge region of the wafer, if need be additionally in the shape of the wafer front side, outside the active chip surface and especially in the regions bounding the respective chip systems, adhesion zones (8) for the passivation layer (9) are created which enter into a sealing, and in particular a chemical combination with the material used for the passivation layer.

Abstract: A method is provided for measuring a state variable of a biological cell (3) located in a nutrient medium (2) and supported on and adhering to a support area (5). Within the support area (5) for the cell (3) and at a distance from the support area edge, an opening is made in the membrane of the cell (3). The edge of the cell membrane that surrounds the opening and adheres to the support area (5) seals off the liquid found inside the cell (3) from the nutrient medium (2). Through the opening the state variable (2) is measured. An apparatus for performing the method is also provided.

Abstract: A reference electrode (1) for electrochemical measurements includes a metallic palladium-containing electrode component (3) which is covered by a layer (4) formed of or containing a palladium compound poorly soluble in aqueous media. Positioned on layer (4) is a reference electrolyte (5) which contains anions of this palladium compound in dissolved form (FIG. 4).

Abstract: A process is provided for the intracellular manipulation of a biological cell (3) which is positioned adhering to a support area (5) in a culture medium (2). Inside the support area (5) for the cell (3) an opening into the membrane of the cell (3) is created spaced from its support edge. The edge of the cell membrane surrounding the opening, adhering to the support area (5), thus seals off the cell fluid situated in the interior of the cell (3) from the culture medium (2) and insulates the cell fluid against the culture medium (2). The interior of the cell (3) is manipulated through the opening. An apparatus for implementing the process is also provided, including an object carrier (4) with a support area (5) for adhering the cell and a poration tool (6) for creating the opening in the cell membrane. The poration tool (6) may be any of various chemical, mechanical and/or electrical devices.

Abstract: A measuring device (1), for examining a medium (2) that is liquid or free-flowing, has at least two electrically and/or optically conducting layers or layer areas (5a, 5b, 5c, 6a, 6b, 7a, 7b) located on a substrate layer (3), wherein these layers or layer areas are electrically and/or optically insulated from each other. At least one of these layers or layer areas (5a, 5b, 5c, 6a, 6b, 7a, 7b) is part of a layer stack (4), which has several layers arranged on top of each other on the substrate layer (3). The layer stack has, on its side facing away from the substrate layer (3), a recess that adjoins the electrically and/or optically conducting layers or layer areas (5a, 5b, 6a, 6b, 7a, 7b). At least one electrically and/or optically conducting layer or layer area (5a, 5b, 6a, 6b, 7a, 7b) located in the layer stack (4) is spaced at a distance from the bottom (11) of the recess (10).

Abstract: A capacitive sensor is described which includes a first electrode remote from a second electrode, wherein the first electrode and the second electrode form a measurement capacitance. The first electrode is arranged on a first substrate member and the second electrode is arranged on a second substrate member. At least one of the electrodes has a spatially resolved structure which allows a spatially resolved measurement of the capacitance. The spatial structure of the electrode may be implemented in form of several mutually parallel stripe-shaped elements or in form of a plurality of spaced-apart elements that are arranged in a two-dimensional pattern. Associated with the electrodes are electronic processing units integrated in the substrate members.

Abstract: In a process for manufacturing an electrode (1) on a substrate (2) using a conventional structuring process, an electrically conducting surface structure is created which has at least one tip (3) or edge (4). In the area of the tip (3) or edge (4), an electrode layer (5) is galvanized onto the substrate (2) and/or applied by electrostatic powder coating. Then, a surface area of the substrate (2), which surrounds the electrode layer (5) located on the tip (3) or edge (4), is converted into an insulating layer (8) by a chemical reaction. The electrode layer (5) can also be applied in a manner where, in the area of the tip (3) or edge (4), a chemical is released, which upon irradiation by electromagnetic and/or particle radiation, precipitates an electrically conducting material. This chemical is then impinged in the area of the tip (3) or edge (4) with optical radiation.

Abstract: A measuring device (1) has a semiconductor arrangement, which includes a semiconductor chip (2) connected to a carrier (4) having at least one through-hole (3). The semiconductor chip (2) has at least one sensor (6) with an active sensor surface (5) facing the through-hole (3). The semiconductor chip (2) has electrical terminal points (9), which are connected using flip-chip connections (10) to terminal contacts (11) facing the terminal points (9) and located on the carrier (4). The carrier (4) has electrical strip conductors (12), which connect the terminal contacts (11) to contact elements (13) located on the carrier. To the rear side of the carrier (4) having the contact elements (13) a strip conductor carrier (16) is provided, which has strip conductors (12) connected to opposing contacts (14). The opposing contacts (14) are each electrically connected using flip-chip connections (17), to a contact element (13), which are allocated to each of them.

Abstract: A capacitive sensor including a first electrode and a second electrode which are disposed opposite each other in spaced-apart relationship to form a capacitor, the first electrode being disposed on a first substrate and the second electrode on a second substrate, the substrates being joined together at the sides of the electrodes, and the second substrate forming, in the area of the second electrode, a diaphragm deformable by pressure. An electronic signal processing device for processing the measurement signals is incorporated in one of the substrates below the electrode disposed thereon.

Abstract: A semiconductor component (1) has a pressure sensor and a semiconductor chip (2) with a semiconductor structure (3) for at least one additional function of the semiconductor component (1). The semiconductor chip (2) is connected to a casing (5) by means of an elastic carrier arrangement (4) and can be deflected relative to the casing (5) against the restoring force of the material of the carrier arrangement (4) on the whole. For indirect measurement of a pressure acting on the semiconductor chip (2) and causing the deflection of the semiconductor chip (2), at least one position sensor that works together with the semiconductor chip (2) is provided.

Abstract: A method is provided for measuring a state variable of a biological cell (3) located in a nutrient medium (2) and supported on and adhering to a support area (5). Within the support area (5) for the cell (3) and at a distance from the support area edge, an opening is made in the membrane of the cell (3). The edge of the cell membrane that surrounds the opening and adheres to the support area (5) seals off the liquid found inside the cell (3) from the nutrient medium (2). Through the opening the state variable (2) is measured. An apparatus for performing the method is also provided.

Abstract: A coupling (1) has a coupling receiver (2) and a coupling counterpart (3) connectable with it, which in the coupling position is held in a receiver depression (6) of the coupling receiver. The receiver depression (6) is arranged in a layer stack (4) with at least two layers (5a, 5b, 5c, 5d, 5e). Proceeding from the flat surface of the layer stack (4) bordering upon the recess depression (6) to the interior of the receiver depression (6), the lateral boundary wall of the recess depression (6) has at least one cutback, which is formed by a receding layer (5a, 5c) or a receding layer area. The coupling counterpart (3) has at least one lateral guide and/or locking projection (9a, 9b), which engages into a cutback (8a, 8b) of the component (2) in the coupling position.

Abstract: In a process for coating a substrate, a texture (4) is created in a portion of its surface. A first layer (5) to be applied on the surface of the substrate adheres better to the texture (4) than it does to a surface area located outside of the texture (4). Then, the layer (5) is applied to the surface of the substrate and after that, areas of the layer projecting laterally beyond the texture (4) are mechanically removed. The material of the texture (4) contains at least one chemical element or a compound, which the layer (5) does not have or has only in a smaller concentration than the material of the texture (4). On the first layer (5), at least one second layer (7) is then applied which does not have the chemical element or compound contained in the material of the texture (4), or it has it only in a smaller concentration than the material of the texture (4).