Abstract: The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices. The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling, shock and vibrations and severe environment conditions in general. For leaded devices, the leads are oriented to face the thermal center of the devices and the system they interact with. For leadless devices, the mounting elements are treated or prepared to control the migration of solder along the length of the elements, to ensure that those elements retain their desired flexibility.

Abstract: Three-Way Light Bulbs and Sockets can create a condition, where “light flicker” can occur. One way to correct the situation and to reduce the chance of having light flicker is described in this patent. It consists of introducing an “INTERPOSER”, between the light bulb and the socket. Several interposer designs and construction options are described in the patent, as well.

Abstract: The invention covers a number of alternative improvements to the prior art pull-tab used to open container such as soda cans. One improvement is by forming the nose of the pull tab at a certain angle to the body of the tab, thus allowing the user to tilt the tab thus lifting the pull tip higher and providing more room for the user to insert the finger tip under the pull tip thus making it easier to open the container. Another improvement is by rotating the pull tab a certain angle and making it follow a caming surface thus lifting the pull tip and again providing more room to insert the finger tip and making it easier to open the container.

Abstract: Improvements to a 3-way light bulb socket are shown. The major improvement is to replace or complement the rigid middle contact element of the socket with an elastic/flexible contact spring. The 3-way light bulb has a solder blob on its middle contact ring, where said blob usually has a rough, uneven surface, and frequently does protrude beyond the general surface of the bulb middle contact ring. The solder blob interferes with the conventional socket middle contact element, which is rigid, and prevents the system from creating a good, permanent and reliable electrical connection between the socket and the bulb. Potential flicker and discomfort to the user can occur as a result. Also, the operating life of the bulb as well as the power consumption can be affected. The proposed flexible middle contact spring can alleviate most of these problems.

Abstract: Described are probes, designed to make electrical contact with high-density chips or similar electronic devices. Two groups of probes are covered. The first group includes probes that are moved laterally, parallel to the surface of the contact pads of the device under test, after the initial contact has been made. This is to create the desired wipe or scrub. The second group includes probes that operate on the principle of suction cups. When the probe is pushed against the device under test, the probe lips stretch outwardly and create the desirable wipe or scrub.

Abstract: Improvements to 3-way light bulbs and to their electrical sockets are shown. The major improvement is to replace the rigid middle contact element of the socket by an elastic contact spring. Other improvements are described, which can be applied to the bulbs as well. These include flattening and smoothing the solder joint that is located on the bulb middle contact ring. Also, some new add-ons inserts or adapters are described, which can be used together with the bulbs and sockets, to improve the performance of such bulbs.

Abstract: Described are methods of using probes, for making electrical contact to high-density chips or similar electronic devices. Two groups of probes are covered. The first group includes probes that are moved laterally, parallel to the surface of the contact pads of the device under test, after the initial contact has been made. This is to create the desired wipe or scrub. The second group includes probes that operate on the principle of suction cups. When the probe is pushed against the device under test, the probe working tips stretch outwardly and create the desirable wipe or scrub. Described also are the probes themselves that are used for the above methods.

Abstract: The invention discloses methods of mounting heat shields onto a spacecraft. It shows a number of ways to attach heat shield tiles in a way that allows for and accommodates the thermal expansion and contraction of the tiles without overstressing them and without loosing them due to delamination of adhesives. Shown also are various fasteners, which are flexible in several directions and which should preferably be oriented to provide the least resistance to the expected deformations of the tiles.

Abstract: The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices. The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling, shock and vibrations and severe environment conditions in general. For leaded devices, the leads are oriented to face the thermal center of the devices and the system they interact with. For leadless devices, the mounting elements are treated or prepared to control the migration of solder along the length of the elements, to ensure that those elements retain their desired flexibility.

Abstract: Improvements to 3-way light bulbs and to their electrical sockets are shown. The major improvement is to replace the rigid middle contact element of the socket by an elastic contact spring. Other improvements are described, which can be applied to the bulbs as well. These include flattening and smoothing the solder joint that is located on the bulb middle contact ring. Also, some new add-ons inserts or adapters are described, which can be used together with the bulbs and sockets, to improve the performance of such bulbs.

Abstract: The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices. The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling, shock and vibrations and severe environment conditions in general. For leaded devices, the leads are oriented to face the thermal center of the devices and the system they interact with. For leadless devices, the mounting elements are treated or prepared to control the migration of solder along the length of the elements, to ensure that those elements retain their desired flexibility.

Abstract: The invention discloses design concepts and means and methods that can be used for enhancing the reliability and extending the operating life of electronic devices, and assemblies incorporating such devices, and substrates and/or PCBs, especially if such assemblies are exposed to severe environments such as thermal cycling or power cycling. The main thrust of the invention is to provide flexible joints, such as columns, between the attached components, and preferably to orient such joints, so that they would present their softest bending direction towards the thermal center or fixation point of the assemblies. Joints with rectangular or elongated cross-section are preferred, and they should be oriented so that the wide face of each joint would be facing the thermal center, perpendicular to the thermal deformation ray emanating from the thermal center towards the center of each respective joint. The concepts apply equally to leadless packages as well as to leaded packages.

Abstract: Improvements to 3-way light bulbs and to their electrical sockets are shown. The major improvement is to replace the rigid middle contact element of the socket by an elastic contact spring. Other improvements are described, which can be applied to the bulbs as well. These include flattening and smoothing the solder joint that is located on the bulb middle contact ring. Also, some new add-ons inserts or adapters are described, which can be used together with the bulbs and sockets, to improve the performance of such bulbs.

Abstract: Wiping means are provided to help skiers, hunters, cyclists, tennis players and others in keeping their nose clean and dry. Also, to wipe sweat from foreheads. Various embodiments are shown. For example, the wipes can be attached to gloves, or to sleeves of jackets, or can simply be in the shape of a wristband or armband. Wipes can be covered for esthetic reasons. Wipes and their components can be provided together with their base patches; or separately, where users can purchase spare sponges to apply to their existing patches. Both patches and/or sponges can be of various colors and/or imprinted with logos, trade names, or other advertising information.

Abstract: Described are probes, designed to make electrical contact with high-density chips or similar electronic devices. Two groups of probes are covered. The first group includes probes that are moved laterally, parallel to the surface of the contact pads of the device under test, after the initial contact has been made. This is to create the desired wipe or scrub. The second group includes probes that operate on the principle of suction cups. When the probe is pushed against the device under test, the probe lips stretch outwardly and create the desirable wipe or scrub.

Abstract: A circuit protection device for protecting electrical circuits against voltage transients comprises a chip package which includes a threshold switch device formed from an amorphous composition.

Abstract: This invention provides anti-glare eyeglasses for drivers for shielding the glare of on-coming headlights and the glare of headlights of following vehicles reflected in rear view mirrors. The central vision area is bordered by a shaded area on the left side, the edge of the shaded area next to the central vision area is vertical and straight, the shaded area extends to the left at an angle corresponding to the apparent angle at which the on-coming headlights pass to the left of the driver, and additional shaded areas are provided to the left and right for screening the headlight glare of following vehicles reflected in rear view mirrors. The shaded areas may be reversed for use by drivers driving on the left side of the road. The invention also provides a kit of parts of attachable shaded shapes which can be placed on regular eyeglasses to correspond to the eyeglasses of this invention.

Abstract: This invention provides anti-glare visors for drivers for sheilding the glare of on-coming headlights and the glare of headlights of following vehicles reflected in rear view mirrors. The central vision area is bordered by a shaded area on the left side, the edge of the shaded area next to the central vision area is vertical and straight, the shaded area extends to the left at an angle corresponding to the apparent angle at which the on-coming headlights pass to the left of the driver, and additional shaded areas are provided to the left and right for screening the headlight glare of following vehicles. The shaded areas may be reversed for use by drivers driving on the left side of the road. The invention also provides a kit of parts of self-adhesive shaded shapes which can be placed on regular visors to correspond to the visors of this invention.

Abstract: Mechanical means and methods for delivery of solder preforms arranged in generally rectilinear patterns and oriented so that the ends of the solder preforms may join two planar surfaces upon the application of heat are disclosed. Several embodiments facilitate the delivery of solder preforms in the forms of posts, clips and rings.