Abstract: One embodiment of the present invention is a pattern forming method for forming a fine three-dimensional structural pattern, including: forming a resist material film on a substrate having a projecting pattern on a step in such a manner as to cover at least a marginal portion of the projecting pattern such that the resist material film is heaped on the projecting pattern in conformity with the step; reducing the heaped resist material film formed by first etching until the marginal portion of the projecting pattern is exposed from an edge of the heaped resist material film; and forming an upper projecting pattern according to the projecting pattern in a self-aligning manner by second etching on the marginal portion of the exposed projecting pattern by using the reduced resist material film as a mask.

Abstract: A method of manufacturing a microneedle including the steps of forming a plurality of first linear grooves on a substrate in parallel to one another along a first direction using grinding, and forming a plurality of second linear grooves on the substrate in parallel to one another in a second direction intersecting the first direction using grinding.

Abstract: The invention discloses a method of manufacturing a microneedle including the steps of forming an island etching mask having thickness distribution on a substrate, and processing the substrate into a needle by taking advantage of a difference in etching rates between the etching mask and the substrate. The invention enables to readily control a point angle and height of the manufactured needle.