Patents by Inventor Gang An

Gang An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240178207
    Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a photonic assembly may include an interposer having a surface, wherein a material of the interposer includes glass and the interposer includes through-glass vias (TGVs); a photonic integrated circuit (PIC) optically coupled to the surface of the interposer by optical glue or fusion bonding and electrically coupled to the TGVs in the interposer by hybrid bond interconnects; and an optical component optically coupled to the interposer, wherein the optical component is optically coupled to the PIC by an optical pathway through the interposer.
    Type: Application
    Filed: November 28, 2022
    Publication date: May 30, 2024
    Applicant: Intel Corporation
    Inventors: Jeremy Ecton, Brandon C. Marin, Srinivas V. Pietambaram, Gang Duan, Suddhasattwa Nad
  • Publication number: 20240179271
    Abstract: A method for transmitting web-conference content over a network connection is disclosed. In one embodiment, such a method conducts a web conference over a network connection. The method monitors characteristics of the network connection in order to determine bandwidth of the network connection during the web conference. The method implements, on the network connection, a “raw” mode wherein audio data of the web conference is transmitted over the network connection in an original format. Upon detecting a low bandwidth condition on the network connection, the method toggles from the “raw” mode to a “saving” mode where audio data of the web conference is converted to text at a first end of the network connection, transmitted over the network connection as text, and converted from text back to audio data at a second end of the network connection. A corresponding system and computer program product are also disclosed.
    Type: Application
    Filed: November 30, 2022
    Publication date: May 30, 2024
    Applicant: International Business Machines Corporation
    Inventors: Jun Su, Peng Hui Jiang, Gang Tang, Guang Han Sui, Yan Zhou
  • Publication number: 20240178939
    Abstract: Various embodiments herein provide techniques for physical uplink shared channel (PUSCH) transmission with repetitions to multiple transmission-reception points (TRPs). For example, embodiments include enhancement of channel state information (CSI) (e.g., aperiodic CSI (A-CSI) and/or semi-persistent CSI (SP-CSI)), configured grant (CG)-PUSCH, uplink power control (ULPC), beam switching gap, and phase tracking reference signal (PTRS)-demodulation reference signal (DMRS) association, among other issues for multi-TRP PUSCH repetition. Other embodiments may be described and claimed.
    Type: Application
    Filed: April 5, 2022
    Publication date: May 30, 2024
    Inventors: Alexei Davydov, Gang Xiong, Bishwarup Mondal, Dong Han
  • Publication number: 20240179087
    Abstract: A BGP route identification method and apparatus are provided. A network device obtains a BGP route. The BGP route includes an autonomous system path attribute AS_PATH attribute, the AS_PATH attribute includes a first autonomous system number AS number, an AS number corresponding to an autonomous system that the network device is located in or manages is a second AS number, and the first AS number is equal to the second AS number. The network device determines, based on the first AS number and the second AS number, whether the BGP route is abnormal.
    Type: Application
    Filed: February 8, 2024
    Publication date: May 30, 2024
    Inventors: Shunwan Zhuang, Haibo Wang, Yunan Gu, Gang Yan, Zhenbin Li
  • Publication number: 20240178945
    Abstract: Various embodiments herein are directed to time domain bundling of hybrid automatic repeat request-acknowledgement (HARQ-ACK) feedback. Other embodiments may be disclosed or claimed.
    Type: Application
    Filed: June 15, 2022
    Publication date: May 30, 2024
    Inventors: Gang Xiong, Yingyang Li, Daewon Lee, Alexei Davydov
  • Publication number: 20240177189
    Abstract: An image data association method, system, apparatus, and related computer program product are provided.
    Type: Application
    Filed: November 29, 2022
    Publication date: May 30, 2024
    Inventors: CHENG-HAN WU, FEI-TING CHEN, CHI-YEH HSU, YOU-GANG KUO
  • Publication number: 20240178973
    Abstract: The present invention relates to an apparatus comprising: memory to store configuration information for a first search space set group (SSSG) and a second SSSG associated with respective first and second physical downlink control channel (PDCCH) monitoring configurations; and processing circuitry, coupled with the memory, to retrieve the configuration information from the memory, and encode a message for transmission to a user equipment (UE) that includes the configuration information, wherein the configuration information includes an indication of a boundary for switching between the first SSSG and the second SSSG that is aligned with a boundary of a slot group.
    Type: Application
    Filed: March 31, 2022
    Publication date: May 30, 2024
    Inventors: Yingyang Li, Gang Xiong, Daewon Lee, Yi Wang
  • Publication number: 20240177918
    Abstract: Embodiments disclosed herein include a package core. In an embodiment, the package core comprises a core substrate, a first opening through the core substrate, a second opening through the core substrate and adjacent to the first opening, and a first structure around the core substrate between the first opening and the second opening. In an embodiment, the first structure is electrically conductive. The package core may further comprise a second structure around the core substrate outside of the first opening and the second opening, where the second structure is electrically conductive.
    Type: Application
    Filed: November 29, 2022
    Publication date: May 30, 2024
    Inventors: Suddhasattwa NAD, Brandon C. MARIN, Jeremy D. ECTON, Srinivas V. PIETAMBARAM, Gang DUAN, Mohammad Mamunur RAHMAN
  • Publication number: 20240178353
    Abstract: The present application provides a display panel and a manufacturing method thereof. The display panel includes: a driving substrate, a plurality of chips, a dielectric layer, and a plurality of encapsulating colloids. Each of the plurality of chips and each of the plurality of encapsulating colloids are correspondingly arranged, and the encapsulating colloid covers the chip. The dielectric layer is disposed on outer peripheries of the encapsulating colloids. The encapsulating colloid includes a substrate and a curved lens connected to each other, the substrate covers the chip, and the curved lens is disposed on a side of the substrate away from the chip.
    Type: Application
    Filed: February 8, 2024
    Publication date: May 30, 2024
    Inventors: Gang MA, Chen-Ke HSU
  • Publication number: 20240178119
    Abstract: Embodiments disclosed herein include an interconnect. In an embodiment, the interconnect comprises a substrate and a pad over the substrate. In an embodiment, a hole is provided through the pad. In an embodiment, the hole exposes a portion of the substrate. In an embodiment, a solder is provided over the pad, and the solder bridges across the hole through the pad.
    Type: Application
    Filed: November 29, 2022
    Publication date: May 30, 2024
    Inventors: Mohammad Mamunur RAHMAN, Jeremy D. ECTON, Gang DUAN
  • Publication number: 20240178146
    Abstract: Disclosed herein are microelectronic assemblies including strengthened glass cores, as well as related devices and methods. In some embodiments, a microelectronic assembly may include a glass core having a surface, a first region having a first concentration of ions extending from the surface of the core to a first depth; a second region having a second concentration of ions greater than the first concentration of ions, the second region between the first region and the surface of the core; a dielectric with a conductive pathway at the surface of the glass core; and a die electrically coupled to the conductive pathway in the dielectric at the surface of the core by an interconnect.
    Type: Application
    Filed: November 30, 2022
    Publication date: May 30, 2024
    Applicant: Intel Corporation
    Inventors: Benjamin T. Duong, Whitney Bryks, Kristof Kuwawi Darmawikarta, Srinivas V. Pietambaram, Gang Duan, Ravindranath Vithal Mahajan
  • Publication number: 20240179689
    Abstract: A computer-readable storage medium stores instructions to configure a UE for joint channel estimation of uplink transmissions in a Fifth Generation New Radio (5G NR) and beyond wireless network, and to cause the UE to perform operations. The operations include decoding DCI or higher layer signaling received from a base station. The DCI or the higher layer signaling indicates a number of PUSCH repetitions forming the uplink transmissions. The operations further include decoding higher layer signaling received from the base station, the higher layer signaling indicating a size of a time domain window (TDW) associated with the uplink transmissions. The TDW has a number of slots equal to the size. Each of the PUSCH repetitions within the TDW is associated with a same carrier phase and a same transmit power.
    Type: Application
    Filed: July 18, 2022
    Publication date: May 30, 2024
    Inventors: Gang Xiong, Yingyang LI, Sergey Sosnin, Gregory Ermolaev, Debdeep Chatterjee
  • Patent number: 11997046
    Abstract: Embodiments of the disclosure generally relate to feedback of a HARQ acknowledgement. A network device transmits, to a terminal device, a first trigger indicating a feedback mode of a HARQ acknowledgement. The feedback mode is selected from at least one of: a trigger mode, a timing mode, and a mixed mode. In response to successful access to an unsilenced band allocated to the HARQ acknowledgement, the network device transmits, to the terminal device, a second trigger indicating at least one target terminal device that is to feedback the HARQ acknowledgement based on the feedback mode indicated by the first trigger.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: May 28, 2024
    Assignee: NEC CORPORATION
    Inventors: Lin Liang, Gang Wang
  • Patent number: 11996290
    Abstract: A semiconductor structure, including a plurality of connection patterns disposed on the substrate, and a merged pattern disposed between adjacent two of the connection patterns, wherein the merged pattern includes a first outer line, a central line and a second outer line sequentially arranged along a first direction and connected with each other, and an end surface of the first outer line, an end surface of the central line and an end surface of the second outer line are misaligned along the first direction.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: May 28, 2024
    Assignee: Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Gang-Yi Lin, Yu-Cheng Tung, Yi-Wang Jhan, Yifei Yan, Xiaopei Fang
  • Patent number: 11995744
    Abstract: An imaging method may include obtaining original imaging data of an object in a raw-data domain including original time of flight (TOF) information. The method may also include gating the original imaging data into a plurality of data sets in the raw-data domain. The method may also include determining a plurality of motion vector fields based on the plurality of data sets. The method may also include generating corrected imaging data in the raw-data domain by performing motion correction on at least one of the plurality of data sets based on the original TOF information and at least one corresponding MVF of the plurality of MVFs. The method may also include generating one or more target images of the object by performing, based on the corrected imaging data, image reconstruction.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: May 28, 2024
    Assignee: SHANGHAI UNITED IMAGING HEALTHCARE CO., LTD.
    Inventors: Tao Feng, Yang Lyu, Hao Liu, Gang Yang
  • Patent number: 11993601
    Abstract: Bridged compounds of Formula (I) and Formula (II), pharmaceutical compositions containing them, methods of making them, and methods of using them including methods for treating disease states, disorders, and conditions associated with MGL modulation, such as those associated with pain, psychiatric disorders, neurological disorders (including, but not limited to major depressive disorder, treatment resistant depression, anxious depression, bipolar disorder), cancers and eye conditions. wherein R2, R3 R4, R5 and R6 are defined herein.
    Type: Grant
    Filed: January 27, 2023
    Date of Patent: May 28, 2024
    Inventors: Michael K. Ameriks, Gang Chen, Chaofeng Huang, Brian Ngo Laforteza, Suchitra Ravula, Wei Zhang
  • Patent number: 11996947
    Abstract: Embodiments of the present disclosure relate to resource allocation for feedback in groupcast communication. A method comprises identifying a plurality of destination devices for reception of data from a source device in groupcast communication; in response to the number of the plurality of destination devices being below a threshold, allocating resources to the plurality of destination devices to enable feedback transmission associated with the reception by the plurality of destination devices; and in response to the number of the plurality of destination devices exceeding the threshold, disabling feedback transmission associated with the reception by the plurality of destination devices. By flexibly allocating resources to the destination devices, it is possible to facilitate identifying destination devices that miss the data or control information and save the resource consumption.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: May 28, 2024
    Assignee: NEC CORPORATION
    Inventor: Gang Wang
  • Patent number: 11992890
    Abstract: The invention provides an electrochemical discharge-assisted micro-grinding device for micro-components of brittle and hard materials. The device includes a micro-grinding tool, grinding fluid, a workpiece, an auxiliary electrode, a processing groove, and a pulsed DC power supply; the processing groove is filled with grinding fluid; the micro-grinding tool, the workpiece, and the auxiliary electrode are immersed in the grinding fluid; the micro-grinding tool is composed of a conductive grinding tool base, an electroplating layer, and insulated superabrasives. The micro-grinding tool is connected to the negative electrode of the pulsed DC power supply; the grinding fluid is composed of H2O2, Na2CO3, EDTA-Fe-Na, and deionized water; the workpiece material is brittle and hard; a large number of micro structures need to be produced on the surface of the workpiece.
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: May 28, 2024
    Assignee: Changsha University of Science and Technology
    Inventors: Cong Mao, Ziyang Chen, Yinghui Ren, Wei Li, Yuanqiang Luo, Gang Wu, Mingjun Zhang, Kun Tang, Yongle Hu, Feng Shi, Weidong Tang, Ci Song
  • Patent number: 11997666
    Abstract: Embodiments of the present disclosure relate to methods, devices and computer readable media for communication. A method comprises determining, at a first device, a first parameter for determination of a sequence group index based on at least one of the following: a second parameter indicating an identity associated with a physical channel between the first device and a second device, a third parameter indicating a scrambling identity, and a fourth parameter indicating a cell identity; determining the sequence group index based on the first parameter; generating, at least based on the sequence group index, a Demodulation Reference Signal (DMRS) sequence to be transmitted to the second device; and transmitting the generated DMRS sequence to the second device over the physical channel. Embodiments of the present disclosure can enable DMRS transmission with low Peak to Average Power Ratio (PAPR) and high flexibility.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: May 28, 2024
    Assignee: NEC CORPORATION
    Inventors: Yukai Gao, Gang Wang
  • Patent number: D1029366
    Type: Grant
    Filed: April 14, 2023
    Date of Patent: May 28, 2024
    Inventors: Xing Peng, Bozhong Li, Gang Huang