Abstract: The present invention provides a mold frame for curved displaying and a curved liquid crystal display device using the mold frame. The mold frame for curved displaying includes two opposite first side frame members (11) and two opposite second side frame members (13) respectively mounted to two ends of the two first side frame members (11). Each of the first side frame members (11) includes a plurality of first engagement slots (115) and open notches (117) between two adjacent ones of the first engagement slots (115) formed therein. The first engagement slots (115) receive and are coupled to the first projection blocks (211) of the curved backplane the first side plates (21). The first side frame members (11) are made of an elastic plastic material. The first side frame members (11) show a flat and straight configuration before being assembled to a curved backplane and show a curved configuration after being assembled to the curved backplane.

Abstract: A method of fabricating a stable, high mobility metal oxide thin film transistor includes the steps of providing a substrate, positioning a gate on the substrate, and depositing a gate dielectric layer on the gate and portions of the substrate not covered by the gate. A multiple film active layer including a metal oxide semiconductor film and a metal oxide passivation film is deposited on the gate dielectric with the passivation film positioned in overlying relationship to the semiconductor film. An etch-stop layer is positioned on a surface of the passivation film and defines a channel area in the active layer. A portion of the multiple film active layer on opposite sides of the etch-stop layer is modified to form an ohmic contact and metal source/drain contacts are positioned on the modified portion of the multiple film active layer.

Abstract: The present invention discloses a liquid crystal display device, the liquid crystal display device comprises a liquid crystal panel, a side board, a plastic housing, a front frame and a least one fastening unit. The plastic housing or the front frame is formed with a fastening hole, and a fastening block is provided and embedded into the fastening hole and fixed on the side board. Thus, the plastic housing or the front frame can be tightly installed on the side board. The assembly convenience can be increased, and the engagement relationship between components of the module also can be strengthened, so as to increase the structural strength of the module.

Abstract: The invention discloses a packing case with a stacking structure including a base and a case body disposed at the base, wherein, a first groove is disposed along a first direction of a bottom of the base, a first card is disposed to match a first groove along the first direction on a top surface of the case body. In the invention, during the stacking procedure of the packing case with stacking structure, a card on a top surface of another packing case is engaged by the groove on the bottom to restrict the packing cases at horizontal direction, and the packing cases won't fall down even encounter adverse factors, ex: quacking, during transporting and then protecting the safety of products effectively and increasing working efficiency of loading/uploading and carrying simultaneously.

Abstract: The process of fabricating a flexible TFT back-panel includes depositing etch stop material on a glass support. A matrix of contact pads, gate electrodes and gate dielectric are deposited overlying the etch stop material. Vias are formed through the dielectric in communication with each pad. A matrix of TFTs is formed by depositing and patterning metal oxide semiconductor material to form an active layer of each TFT overlying the gate electrode. Source/drain metal is deposited on the active layer and in the vias in contact with the pads, the source/drain metal defining source/drain terminals of each TFT. Passivation material is deposited in overlying relationship to the TFTs. A color filter layer is formed on the passivation material and a flexible plastic carrier is affixed to the color filter. The glass support member and the etch stop material are then etched away to expose a surface of each of the pads.

Abstract: A method, device and system for regulating power consumption are provided in the embodiments of the present invention. A method for regulating power consumption includes: obtaining, by a base station, an application point and a configuration parameter; sending, by the base station, an indication message to a terminal according to the application point and configuration parameter; regulating, by the base station, the power consumption of the base station by using the configuration parameter at the application point; the configuration parameter comprises cell antenna information or system bandwidth information; the indication message instructs the terminal to use the configuration parameter at the application point. Under the condition that user's normal communication is remained, the number of cell antennas or the cell bandwidth is dynamically changed. This reduces the power consumption of the network device.

Abstract: A cover of a backlight module for protecting backlight components is disclosed. The cover includes: a main body; and bent clasping sheets arranged on at least one edge portion of the main body, the clasping sheet is fixed in a groove cavity between a backplane and a front frame so as to fix the cover on the backplane. In addition, a backlight module and a liquid crystal display are disclosed. The above-mentioned cover, the backlight module, and the liquid crystal display may simplify the assembly process of the backlight module, and may reduce the cost at the same time.

Abstract: The application provides a screw threaded fastening component, which comprises a stud bolt having an external thread, a first connecting part into which a first screw threaded hole adaptive to the stud bolt is formed, and a second connecting part into which a second screw threaded hole adaptive to the stud bolt is formed, and a threaded direction of the second screw threaded hole is against the threaded direction of the first screw threaded hole. The first connecting part and the second connecting part are assembled on two ends of the stud bolt through the first screw threaded hole and the second screw threaded hole, respectively, and the first connecting part is engaged against the second connecting part when the stud bolt is rotated in a direction. The stud bolt is contained in the first screw threaded hole and the second screw threaded hole when the first connecting part and the second connecting part are engaged completely.

Abstract: A method of dispersing semiconductor chips from a wafer of semiconductor chips onto a substrate while preserving the neighboring relationship of each chip to each adjacent chip is disclosed. The method includes dispersing the wafer into sequential columns of semiconductor chips with a first pitch between columns while preserving the neighboring relationship and sequentially dispersing the columns of semiconductor chips into rows of individual chips with a second pitch between rows onto a substrate while preserving the neighboring relationship.

Abstract: The present invention provides a heat dissipation pipe loop and a backlight module using the dissipation pipe loop. The heat dissipation pipe loop includes: an evaporator section (2), a liquid pipe (4) connected to an end of the evaporator section (2), a condenser pipe (6) connected to an end of the liquid pipe (4) distant from the evaporator section (2), and a gas pipe (8) having an end connected to the condenser pipe (6) and an opposite end connected to the evaporator section (2). The evaporator section (2) includes an enclosure (22) and a separation board (24) received in the enclosure (22). The enclosure (22) defines therein a receiving space (246) and the separation board (24) is mounted in the receiving space (246) to divide the receiving space (246) into a liquid chamber (262) and a gas chamber (264). The liquid pipe (4) is in communication with the liquid chamber (262) and the gas pipe (8) is in communication with the gas chamber (264).

Abstract: Disclosed herein is an insulinotropic peptide multi-dose aqueous parenteral pharmaceutical composition and use thereof. A long-term storage formulation of the insulinotropic peptide can be obtained via the method of the present disclosure. The pharmaceutical composition of the present disclosure comprises: insulinotropic peptide, insulinotropic peptide analogue and derivative; pharmaceutically acceptable tonicity modifier (stabilizer); pharmaceutically acceptable preservative; and pharmaceutically acceptable dissolution enhancer and pharmaceutically acceptable buffer solution. The pharmaceutical composition of the insulinotropic peptide is used in the preparation of drugs for treating diabetes and adiposis.

Abstract: A method including providing a substrate with a gate, a layer of gate insulator material adjacent the gate, and a layer of metal oxide semiconductor material positioned on the gate insulator opposite the gate, forming a selectively patterned etch stop passivation layer and heating at elevated temperature in an oxygen-containing or nitrogen-containing or inert ambience to selectively increase the carrier concentration in regions of the metal oxide semiconductor not covered by the etch stop layer, on which overlying and spaced apart source/drain metals are formed. Subsequently heating the transistor in an oxygen-containing or nitrogen-containing or inert ambience to further improve the source/drain contacts and adjust the threshold voltage to a desired level. Providing additional passivation layer(s) on top of the transistor with electric insulation and barrier property to moisture and chemicals in the surrounding environment.

Abstract: A backlight module is disclosed. The backlight module includes a light guide plate, a light source, a back plate, and a positioning component for maintaining a light coupling distance between the light emitting surface of the light source and the light incident surface of the light guide plate. There is a light coupling distance between the light emitting surface of the light source and the light incident surface of the light guide plate. When a temperature change occurs, the positioning component occurs as a first deformation, as well as the light guide plate occurs as a second deformation. The light coupling distance remains unchanged under the influence of the first deformation and the second deformation. The positioning reliability of the light guide plate is improved in the present invention.

Abstract: A method of fabricating a pixelated imager and structure including a substrate with a bottom contact layer and active element blanket layers deposited on the bottom contact layer. The blanket layers are separated into an array of active elements with trenches isolating adjacent active elements in the array. A dielectric passivation/planarization layer is positioned over the array of active elements. An array of active element readout circuits overlies the passivation/planarization layer above the trenches with one active element readout circuit coupled to each active element of the array of active elements. Each active element and coupled active element readout circuit defines a pixel and the array of active elements and the coupled array of active element readout circuits defines a pixelated imager, and the readout circuit coupled to each active element includes at least one TFT with an active channel comprising a metal-oxide semiconductor material.

Abstract: A method of fabricating metal oxide TFTs on transparent substrates includes the steps of positioning an opaque gate metal area on the front surface of the substrate, depositing transparent gate dielectric and transparent metal oxide semiconductor layers overlying the gate metal and a surrounding area, depositing transparent passivation material on the semiconductor material, depositing photoresist on the passivation material, exposing and developing the photoresist to remove exposed portions, etching the passivation material to leave a passivation area defining a channel area, depositing transparent conductive material over the passivation area, depositing photoresist over the conductive material, exposing and developing the photoresist to remove unexposed portions, and etching the conductive material to leave source and drain areas on opposed sides of the channel area.

Abstract: A method of fabricating a pixelated projector display includes providing a wafer with a supporting substrate, a first semiconductive layer, an emission layer, and a second semiconductive layer. The wafer is patterned into an array of LEDs/LDs and a planarization layer is deposited over the array. One via for each LED/LD element is formed through the planarization layer. A MOTFT backplane is positioned on the planarization layer, one driver circuit in controlling electrical communication with each via through the planarization layer. A passivation layer is deposited over the MOTFT backplane and heat plugs are extended through the passivation layer, the MOTFT backplane, the planarization layer, and the III-V LED/LD wafer partially through the first semiconductive layer to thermally couple heat from the array of LEDs/LDs to the surface of the passivation layer. An upper end of the heat plugs is accessible for thermal coupling to a heat spreader and/or a heatsink.

Abstract: A method of fabricating MO TFTs includes positioning opaque gate metal on a transparent substrate to define a gate area. Depositing gate dielectric material overlying the gate metal and a surrounding area, and depositing metal oxide semiconductor material thereon. Depositing etch stop material on the semiconductor material. Positioning photoresist defining an isolation area in the semiconductor material, the etch stop material and the photoresist being selectively removable. Exposing the photoresist from the rear surface of the substrate and removing exposed portions to leave the etch stop material uncovered except for a portion overlying and aligned with the gate metal. Etching uncovered portions of the semiconductor material to isolate the TFT. Using the photoresist, selectively etching the etch stop layer to leave a portion overlying and aligned with the gate metal and defining a channel area in the semiconductor material. Depositing and patterning conductive material to form source and drain areas.

Abstract: The present invention provides a backlight module, which includes: a backplane (2), a light guide plate (4) arranged in the backplane (2), a backlight source (6) arranged in the backplane (2) and located at one side of the light guide plate (4), a light shield (8) arranged between the backlight source (6) and the backplane (2), and a side reflection plate (10) arranged between the light guide plate (4) and the backlight source (6). The backlight source (6) includes an LED substrate (62) and a plurality of LED lights (64) mounted on the LED substrate (62). The side reflection plate (10) has resiliency. The side reflection plate (10) includes a plurality of openings (102) formed therein to correspond to the LED lights (64). The LED lights (64) are receivable in the openings (102) to serve as light sources of the light guide plate (4).

Abstract: A slim bezel liquid crystal display device includes a rear enclosure, a front enclosure mating the rear enclosure, and a liquid crystal display module arranged inside the rear enclosure. The quid crystal display module has two opposite sides each forming a raised portion that includes a constraint section and an extension section extending from a middle portion of a free end of the constraint section. The rear enclosure forms retention sections in the form of recesses corresponding to the extension sections, such that the retention sections are respectively receivable in the recesses so as to fix the liquid crystal display module in the rear enclosure.

Abstract: The present invention provides a backlight module of a curved liquid crystal display device, which includes a light-guiding plate, having an upper curved surface, a lower curved surface, a first side surface and a second side surface, wherein the upper curved surface and the lower curved surface being connected to the first side surface and the second side surface at both ends respectively; a first light source unit, fixedly disposed near the first side surface, a back frame, having a back plate comprising a plurality of steps, wherein the step surface of the steps contacting to support the lower curved surface. The present invention simplifies the back frame structure and reduces manufacturing cost. The present invention also discloses a curved liquid crystal display device with the above backlight module.