Abstract: A thin film semiconductor device has a semiconductor layer including a mixture of an amorphous semiconductor ionic metal oxide and an amorphous insulating covalent metal oxide. A pair of terminals is positioned in communication with the semiconductor layer and define a conductive channel, and a gate terminal is positioned in communication with the conductive channel and further positioned to control conduction of the channel. The invention further includes a method of depositing the mixture including using nitrogen during the deposition process to control the carrier concentration in the resulting semiconductor layer.

Abstract: The present invention provides a liquid crystal display device and a method for manufacturing a light guide plate (LGP) positioning block thereof. The LGP positioning block (9) of the liquid crystal display device includes a positioning block body (91) and liquid (93) hermetically sealed in the positioning block body (91). The positioning block body (91) possesses elasticity. In a low temperature, the liquid (93) is condensed and expanded so as to enlarge the size of the positioning block body (91) to compensate the reduction of the size of a light guide plate (3) due to contraction caused by cooling; and in a high temperature, the elasticity of the positioning block body (91) absorbs the expansion of the size of the light guide plate (3) caused by heating.

Abstract: A method of fabricating a stable, high mobility metal oxide thin film transistor includes the steps of providing a substrate, positioning a gate on the substrate, and depositing a gate dielectric layer on the gate and portions of the substrate not covered by the gate. A multiple film active layer including a metal oxide semiconductor film and a metal oxide passivation film is deposited on the gate dielectric with the passivation film positioned in overlying relationship to the semiconductor film. An etch-stop layer is positioned on a surface of the passivation film and defines a channel area in the active layer. A portion of the multiple film active layer on opposite sides of the etch-stop layer is modified to form an ohmic contact and metal source/drain contacts are positioned on the modified portion of the multiple film active layer.

Abstract: A heat dissipation pipe loop and a backlight module using the heat dissipation pipe loop are provided. The heat dissipation pipe loop includes: a first evaporator section, a second evaporator section arranged opposite to the first evaporator section, a first pipe, a second pipe arranged opposite to the first pipe, and a heat dissipation liquid arranged in the first pipe and the second pipe. The first pipe includes a first gas pipe connected to the first evaporator section, a first condenser pipe connected to the first gas pipe, and a first liquid pipe connected to the first condenser pipe and the second evaporator section. The second pipe includes a second gas pipe connected to the second evaporator section, a second condenser pipe connected to the second gas pipe, and a second liquid pipe connected to the second condenser pipe and the first evaporator section.

Abstract: A method, device and system for regulating power consumption are provided in the embodiments of the present invention. A method for regulating power consumption includes: obtaining, by a base station, an application point and a configuration parameter; sending, by the base station, an indication message to a terminal according to the application point and configuration parameter; regulating, by the base station, the power consumption of the base station by using the configuration parameter at the application point; the configuration parameter comprises cell antenna information or system bandwidth information; the indication message instructs the terminal to use the configuration parameter at the application point. Under the condition that user's normal communication is remained, the number of cell antennas or the cell bandwidth is dynamically changed. This reduces the power consumption of the network device.

Abstract: The present invention provides a backplane and a backlight module and a liquid crystal display device using the backplane. The backplane includes: a bottom plate (2) and multiple side plates (4) connected to the bottom plate (2). The bottom plate (2) includes a base section (22) and a mounting section (24) connected to a lateral edge of the base section (22). The base section (22) has two ends that are each provided with a stepwise structure (222) for mounting a curved light guide plate to an inner side thereof. The mounting sections (24) has an outside surface that is curved for mounting a circuit board. The base section (22) has an outside surface on which first reinforcement ribs (226) and second reinforcement ribs (228) perpendicularly connected thereto are formed.

Abstract: A full-color AM OLED includes a transparent substrate, a color filter positioned on an upper surface of the substrate, and a metal oxide thin film transistor backpanel positioned in overlying relationship on the color filter and defining an array of pixels. An array of OLEDs is formed on the backpanel and positioned to emit light downwardly through the backpanel, the color filter, and the substrate in a full-color display. Light emitted by each OLED includes a first emission band with wavelengths extending across the range of two of the primary colors and a second emission band with wavelengths extending across the range of the remaining primary color. The color filter includes for each pixel, two zones separating the first emission band into two separate primary colors and a third zone passing the second emission band.

Abstract: A method of fabricating a high mobility semiconductor metal oxide thin film transistor including the steps of depositing a layer of semiconductor metal oxide material, depositing a blanket layer of etch-stop material on the layer of MO material, and patterning a layer of source/drain metal on the blanket layer of etch-stop material including etching the layer of source/drain metal into source/drain terminals positioned to define a channel area in the semiconductor metal oxide layer. The etch-stop material being electrically conductive in a direction perpendicular to the plane of the blanket layer at least under the source/drain terminals to provide electrical contact between each of the source/drain terminals and the layer of semiconductor metal oxide material. The etch-stop material is also chemical robust to protect the layer of semiconductor metal oxide channel material during the etching process.

Abstract: A method of fabricating a stable high mobility amorphous MOTFT includes a step of providing a substrate with a gate formed thereon and a gate dielectric layer positioned over the gate. A carrier transport structure is deposited by sputtering on the gate dielectric layer. The carrier transport structure includes a layer of amorphous high mobility metal oxide adjacent the gate dielectric and a relatively inert protective layer of material deposited on the layer of amorphous high mobility metal oxide both deposited without oxygen and in situ. The layer of amorphous metal oxide has a mobility above 40 cm2/Vs and a carrier concentration in a range of approximately 1018 cm?3 to approximately 5×1019 cm?3. Source/drain contacts are positioned on the protective layer and in electrical contact therewith.

Abstract: A backlight module is disclosed. The backlight module includes a light guide plate, a light source, a back plate, and a positioning component for maintaining a light coupling distance between the light emitting surface of the light source and the light incident surface of the light guide plate. There is a light coupling distance between the light emitting surface of the light source and the light incident surface of the light guide plate. When a temperature change occurs, the positioning component occurs as a first deformation, as well as the light guide plate occurs as a second deformation. The light coupling distance remains unchanged under the influence of the first deformation and the second deformation. The positioning reliability of the light guide plate is improved in the present invention.

Abstract: A method of dispersing semiconductor chips from a wafer of semiconductor chips onto a substrate while preserving the neighboring relationship of each chip to each adjacent chip is disclosed. The method includes dispersing the wafer into sequential columns of semiconductor chips with a first pitch between columns while preserving the neighboring relationship and sequentially dispersing the columns of semiconductor chips into rows of individual chips with a second pitch between rows onto a substrate while preserving the neighboring relationship.

Abstract: The present invention relates to the use of heparin derivatives for the prevention and/or treatment of cancer and/or cancer metastasis. The heparin derivatives are substantially 2-O and/or 6-O desulphated heparins which function as inhibitors of galectin-3 activity.

Abstract: The present invention provides a curved liquid crystal display device, which includes: a backlight module (2), a mold frame (4), a liquid crystal display panel (6), and a front bezel (8). The backlight module (2) includes a backplane (22), a curved light guide plate (24) arranged in the backplane (22), a backlight source (26) arranged in the backplane (22), and a heat dissipation board (28) receiving the backlight source (26) mounted thereto. The heat dissipation board (28) includes a bracket section (282) and a mount section (284) connected, in an inclined manner, to the bracket section (282). The bracket section (282) is mounted to the backplane (22). The backlight source (26) is mounted to the mount section (284). The front bezel (8) includes a front plate (82) and a side plate (84) connected to the front plate (82). The mount section (284) includes a mounting tab (286) extending therefrom toward the side plate (84).

Abstract: The present invention provides a backlight module and a liquid crystal display device using the backlight module. The backlight module includes a backplane (2), a light guide plate (4) arranged in the backplane (2), a backlight source (6) arranged in the backplane (2), and a heat dissipation plate (8) arranged between the backlight source (6) and the backplane (2). The backplane (2) includes a bottom plate (22) and a side plate (24) perpendicularly connected to the bottom plate (22). The backlight source (6) includes a PCB (62) and an LED chip (64) mounted on the PCB (62). The PCB (62) is arranged on the bottom plate (22) of the backplane (2) and the heat dissipation plate (8). The PCB (62) includes a mounting section (622) and a lapping section (624) connected to the mounting section (622). The heat dissipation plate (8) includes a support section (82) and a bearing section (84) connected to the support section (82). The lapping section (624) is positioned on and overlaps the bearing section (84).

Abstract: The present invention provides a backplane and a backlight module and a liquid crystal display device using the backplane. The backplane includes: a bottom plate (2) and multiple side plates (4) connected to the bottom plate (2). The bottom plate (2) includes a base section (22) and a mounting section (24) connected to a lateral edge of the base section (22). The base section (22) has two ends that are each provided with a stepwise structure (222) for mounting a curved light guide plate to an inner side thereof. The mounting sections (24) has an outside surface that is curved for mounting a circuit board. The base section (22) has an outside surface on which first reinforcement ribs (226) and second reinforcement ribs (228) perpendicularly connected thereto are formed.

Abstract: A combination backboard includes a main body to which a first bracket is coupled. The main body includes a base plate and first and second side plates perpendicularly mounted to the base plate and opposite to each other. The first and second side plates have an end forming a first coupling section adjacent to the first bracket. The first bracket includes a first bottom plate and a third side plate perpendicularly mounted to the first bottom plate. The third side plate has two ends forming resilient first coupling slots corresponding to the first coupling sections to receive and retained the first coupling sections therein for coupling the first bracket and the main body together. Also provided are a backlight module and a liquid crystal display device that use the combination backboard.

Abstract: A method of fabricating MOTFTs includes positioning opaque gate metal on a transparent substrate, depositing gate dielectric material overlying the gate metal and a surrounding area, and depositing metal oxide semiconductor material thereon. Etch stop material is deposited on the semiconductor material. Photoresist defines an isolation area in the semiconductor material. Exposing the photoresist from the rear surface of the substrate and removing exposed portions to leave the etch stop material uncovered except for a portion overlying and aligned with the gate metal. Etching uncovered portions of the semiconductor material to isolate the TFT. Using the photoresist, selectively etching the etch stop layer to leave a portion overlying and aligned with the gate metal and defining a channel area in the semiconductor material. Depositing and patterning conductive material to form source and drain areas.

Abstract: The present invention provides a curved liquid crystal display device, which includes a backlight module (1), a mold frame (3) mounted on the backlight module (1), a liquid crystal panel (5) arranged on the mold frame (3), and a bezel (7) that retains the liquid crystal panel (5) on the mold frame (3). The backlight module (1) includes a curved backplane (11) and optical components (13) arranged in the curved backplane (11). The curved backplane (11) includes a bottom board (111) and a bracing (9) mounted to the bottom board (111). The bracing (9) includes a base (91), a pair of guide rails (93) mounted to the base (91), a screw (95) rotatably mounted to the base (91), and a pair of slide blocks (97) that are in engagement with the screw (95) and slidable along the guide rails (93). The bottom board (111) includes a pair of protrusions (113) formed a surface thereof that is in contact engagement with the slide blocks (97) to correspond to the slide blocks (97).

Abstract: The present invention provides a direct backlight module, which includes: a backplane (2), a plurality of backlight sources (4) mounted in the backplane (2), and a diffusion board (8) mounted on the backplane (2) and located above the backlight sources (4). The backplane (2) includes a bottom board (20) and a plurality of side boards (22) perpendicularly connected to the bottom board (20). The bottom board (20) includes a plurality of detachable carrier plates (24). The backlight sources (4) are mounted on the carrier plates (24). The direct backlight module of the present invention includes a plurality of carrier plates pieced together to form a bottom board of a backplane so that in assembling the backlight module, it is possible to simultaneously mount backlight sources to the plurality of carrier plates to thereby enhance the assembling efficiency.

Abstract: A thin film semiconductor device has a semiconductor layer including a mixture of an amorphous semiconductor ionic metal oxide and an amorphous insulating covalent metal oxide. A pair of terminals is positioned in communication with the semiconductor layer and define a conductive channel, and a gate terminal is positioned in communication with the conductive channel and further positioned to control conduction of the channel. The invention further includes a method of depositing the mixture including using nitrogen during the deposition process to control the carrier concentration in the resulting semiconductor layer.