Patents by Inventor Gareth Geoffrey Hougham
Gareth Geoffrey Hougham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8832936Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, a method of forming an electrical connecting device includes the steps of: depositing an elastomeric material on an electrically insulating carrier; and metallizing the elastomeric material so as to form an electrically conductive layer running continuously through a plane of the carrier and along a surface of the elastomeric material.Type: GrantFiled: July 31, 2009Date of Patent: September 16, 2014Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
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Patent number: 8241957Abstract: A method for fabricating a negative thermal expanding system device includes coating a wafer with a thermally decomposable polymer, patterning the decomposable polymer into repeating disk patterns, releasing the decomposable polymer from the wafer and forming a sheet of repeating patterned disks, suspending the sheet into a first solution with seeding compounds for electroless decomposition, removing the sheet from the first solution, suspending the sheet into a second solution to electrolessly deposit a first layer material onto the sheet, removing the sheet from the second solution, suspending the sheet into a third solution to deposit a second layer of material having a lower TCE value than the first layer of material, separating the patterned disks from one another, and annealing thermally the patterned disks to decompose the decomposable polymer and creating a cavity in place of the decomposable polymer.Type: GrantFiled: October 18, 2010Date of Patent: August 14, 2012Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, S. Jay Chey, James Patrick Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul Alfred Lauro, Nancy C. LaBianca, Michael J. Rooks
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Patent number: 8138592Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.Type: GrantFiled: June 20, 2008Date of Patent: March 20, 2012Assignee: International Business Machines CorporationInventors: Paul Coteus, Kevin C. Gower, Shawn Anthony Hall, Gareth Geoffrey Hougham, Dale J. Pearson
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Patent number: 8119206Abstract: A method of forming a negative coefficient of thermal expansion particle includes flattening a hollow sphere made of a first material, annealing the flattened hollow sphere at a reference temperature above a predetermined maximum use temperature to set a stress minimum of the flattened hollow sphere, and forming a coating made of a second material on the flattened hollow sphere at the reference temperature, the second material having a lower coefficient of thermal expansion than that of the first material, the negative coefficient of thermal expansion particle characterized by volumetric contraction when heated.Type: GrantFiled: May 7, 2009Date of Patent: February 21, 2012Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, Xiao Hu Liu, S. Jay Chey, Joseph Zinter, Jr., Michael J. Rooks, Brian Richard Sundolf, Jon Alfred Casey
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Patent number: 8054095Abstract: A probe structure for an electronic device is provided. In one aspect, the probe structure includes an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure includes an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier. The probe structure includes one or more other contact structures adapted for connection to a test apparatus.Type: GrantFiled: September 30, 2005Date of Patent: November 8, 2011Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
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Patent number: 7897878Abstract: A circuit package is provided. The circuit package includes a plurality of electrically conductive pads located on a bottom surface of the circuit package, wherein at least one pad of the plurality of bottom surface pads has a recession for receiving an electrically conductive protrusion located on a substrate to which the circuit package is to be mounted.Type: GrantFiled: January 26, 2007Date of Patent: March 1, 2011Assignee: International Business Machines CorporationInventors: Paul Coteus, Gareth Geoffrey Hougham, Brian R. Sundlof
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Publication number: 20110034047Abstract: A method for fabricating a negative thermal expanding system device includes coating a wafer with a thermally decomposable polymer, patterning the decomposable polymer into repeating disk patterns, releasing the decomposable polymer from the wafer and forming a sheet of repeating patterned disks, suspending the sheet into a first solution with seeding compounds for electroless decomposition, removing the sheet from the first solution, suspending the sheet into a second solution to electrolessly deposit a first layer material onto the sheet, removing the sheet from the second solution, suspending the sheet into a third solution to deposit a second layer of material having a lower TCE value than the first layer of material, separating the patterned disks from one another, and annealing thermally the patterned disks to decompose the decomposable polymer and creating a cavity in place of the decomposable polymer.Type: ApplicationFiled: October 18, 2010Publication date: February 10, 2011Applicant: International Business Machines CorporationInventors: Gareth Geoffrey HOUGHAM, S. Jay CHEY, James Patrick DOYLE, Xiao Hu LIU, Christopher V. JAHNES, Paul Alfred LAURO, Nancy C. LaBIANCA, Michael J. ROOKS
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Patent number: 7883919Abstract: A method for fabricating a negative thermal expanding system device includes coating a wafer with a thermally decomposable polymer, patterning the decomposable polymer into repeating disk patterns, releasing the decomposable polymer from the wafer and forming a sheet of repeating patterned disks, suspending the sheet into a first solution with seeding compounds for electroless decomposition, removing the sheet from the first solution, suspending the sheet into a second solution to electrolessly deposit a first layer material onto the sheet, removing the sheet from the second solution, suspending the sheet into a third solution to deposit a second layer of material having a lower TCE value than the first layer of material, separating the patterned disks from one another, and annealing thermally the patterned disks to decompose the decomposable polymer and creating a cavity in place of the decomposable polymer.Type: GrantFiled: July 6, 2009Date of Patent: February 8, 2011Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, S. Jay Chey, James Patrick Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul Alfred Lauro, Nancy C. LaBianca, Michael J. Rooks
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Patent number: 7863091Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.Type: GrantFiled: July 2, 2008Date of Patent: January 4, 2011Assignee: International Business Machines CorporationInventors: Paul Coteus, Kevin C. Gower, Shawn Anthony Hall, Gareth Geoffrey Hougham, Dale J. Pearson
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Patent number: 7863089Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.Type: GrantFiled: September 14, 2007Date of Patent: January 4, 2011Assignee: International Business Machines CorporationInventors: Paul Coteus, Kevin C. Gower, Shawn Anthony Hall, Gareth Geoffrey Hougham, Dale J. Pearson
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Patent number: 7771208Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.Type: GrantFiled: May 27, 2008Date of Patent: August 10, 2010Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
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Publication number: 20090300914Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, a method of forming an electrical connecting device includes the steps of: depositing an elastomeric material on an electrically insulating carrier; and metallizing the elastomeric material so as to form an electrically conductive layer running continuously through a plane of the carrier and along a surface of the elastomeric material.Type: ApplicationFiled: July 31, 2009Publication date: December 10, 2009Applicant: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
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Publication number: 20090263991Abstract: A method for fabricating a negative thermal expanding system device includes coating a wafer with a thermally decomposable polymer, patterning the decomposable polymer into repeating disk patterns, releasing the decomposable polymer from the wafer and forming a sheet of repeating patterned disks, suspending the sheet into a first solution with seeding compounds for electroless decomposition, removing the sheet from the first solution, suspending the sheet into a second solution to electrolessly deposit a first layer material onto the sheet, removing the sheet from the second solution, suspending the sheet into a third solution to deposit a second layer of material having a lower TCE value than the first layer of material, separating the patterned disks from one another, and annealing thermally the patterned disks to decompose the decomposable polymer and creating a cavity in place of the decomposable polymer.Type: ApplicationFiled: July 6, 2009Publication date: October 22, 2009Inventors: Gareth Geoffrey Hougham, S. Jay Chey, James Patrick Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul Alfred Lauro, Nancy C. LaBianca, Michael J. Rooks
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Publication number: 20090214780Abstract: A negative coefficient of thermal expansion particle includes a first bilayer having a first bilayer inner layer and a first bilayer outer layer, and a second bilayer having a second bilayer inner layer and a second bilayer outer layer. The first and second bilayers are joined together along perimeters of the first and second bilayer outer layers and first and second bilayer inner layers, respectively. The first bilayer inner layer and the second bilayer inner layer are made of a first material and the first bilayer outer layer and the second bilayer outer layer are made of a second material. The first material has a greater coefficient of thermal expansion than that of the second material.Type: ApplicationFiled: May 7, 2009Publication date: August 27, 2009Applicant: International Business MachinesInventors: Gareth Geoffrey Hougham, Xiao Hu Liu, S. Jay Chey, Joseph Zinter, JR., Michael J. Rooks, Brian Richard Sundlof, Jon Alfred Casey
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Patent number: 7579069Abstract: A negative coefficient of thermal expansion particle includes a first bilayer having a first bilayer inner layer and a first bilayer outer layer, and a second bilayer having a second bilayer inner layer and a second bilayer outer layer. The first and second bilayers are joined together along perimeters of the first and second bilayer outer layers and first and second bilayer inner layers, respectively. The first bilayer inner layer and the second bilayer inner layer are made of a first material and the first bilayer outer layer and the second bilayer outer layer are made of a second material. The first material has a greater coefficient of thermal expansion than that of the second material.Type: GrantFiled: November 6, 2003Date of Patent: August 25, 2009Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, Xiao Hu Liu, S. Jay Chey, James Patrick Doyle, Joseph Zinter, Jr., Michael J. Rooks, Brian Richard Sundlof, Jon Alfred Casey
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Patent number: 7566959Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.Type: GrantFiled: September 14, 2007Date of Patent: July 28, 2009Assignee: International Business Machines CorporationInventors: Paul Coteus, Kevin C. Gower, Shawn Anthony Hall, Gareth Geoffrey Hougham, Dale J. Pearson
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Patent number: 7556979Abstract: A Negative Thermal Expansion system (NTEs) device for TCE compensation or CTE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging. One aspect of the present invention provides a method for fabricating micromachine devices that have negative thermal expansion coefficients that can be made into a composite for manipulation of the TCE of the material. These devices and composites made with these devices are in the categories of materials called “smart materials” or “responsive materials.” Another aspect of the present invention provides microdevices comprised of dual opposed bilayers of material where the two bilayers are attached to one another at the peripheral edges only, and where the bilayers themselves are at a minimum stress conditions at a reference temperature defined by the temperature at which the bilayers are formed.Type: GrantFiled: October 31, 2007Date of Patent: July 7, 2009Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, S. Jay Chey, James Patrick Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul Alfred Lauro, Nancy C. LaBianca, Michael J. Rooks
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Publication number: 20090075502Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.Type: ApplicationFiled: July 2, 2008Publication date: March 19, 2009Inventors: Paul COTEUS, Kevin C. Gower, Shawn Anthony Hall, Gareth Geoffrey Hougham, Dale J. Pearson
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Publication number: 20090072372Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.Type: ApplicationFiled: June 20, 2008Publication date: March 19, 2009Inventors: Paul COTEUS, Kevin C. Gower, Shawn Anthony Hall, Gareth Geoffrey Hougham, Dale J. Pearson
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Publication number: 20090053908Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.Type: ApplicationFiled: May 27, 2008Publication date: February 26, 2009Applicant: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan