Patents by Inventor Gareth Geoffrey Hougham
Gareth Geoffrey Hougham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7473102Abstract: An electronic apparatus includes first and second level package structures and an LGA (land grid array) interposer. The first level package structure includes a package substrate, one or more integrated circuit chips mounted on a first surface of the package substrate, and a first pattern of I/O contacts with pitch P1 formed on a second surface of the package substrate opposite the first surface. The second level package structure includes a second pattern of I/O contacts with pitch P2, wherein P2 is not equal to P1. The LGA interposer is disposed between the first and second level package structures and provides space transform electrical interconnections between the first second patterns of I/O contacts, and further includes a dummy contact formed on at least a first or second surface of the LGA interposer and aligned to an LGA contact on an opposing surface of the LGA interposer.Type: GrantFiled: March 31, 2006Date of Patent: January 6, 2009Assignee: International Business Machines CorporationInventors: Evan George Colgan, Paul W. Coteus, Hubert Harrer, Gareth Geoffrey Hougham, John Harold Magerlein, John Torok
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Patent number: 7452212Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.Type: GrantFiled: September 30, 2005Date of Patent: November 18, 2008Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
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Patent number: 7442049Abstract: Techniques for providing electrical connections are provided. In one aspect, an electrical connecting device is provided which comprises a plurality of compressible contacts; and a downstop structure surrounding at least a portion of one or more of the contacts, limiting compression of the contacts, and being configured to limit interaction between the contacts. The electrical connecting device may be further configured to have the plurality of compressible contacts have a first coefficient of thermal expansion and the downstop structure have a second coefficient of thermal expansion, the first coefficient of thermal expansion being substantially similar to the second coefficient of thermal expansion.Type: GrantFiled: August 1, 2005Date of Patent: October 28, 2008Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, Brian Samuel Beaman, Claudius Feger
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Patent number: 7417315Abstract: A Negative Thermal Expansion system (NTEs) device for TCE compensation or CTE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging. One aspect of the present invention provides a method for fabricating micromachine devices that have negative thermal expansion coefficients that can be made into a composite for manipulation of the TCE of the material. These devices and composites made with these devices are in the categories of materials called “smart materials” or “responsive materials.” Another aspect of the present invention provides microdevices comprised of dual opposed bilayers of material where the two bilayers are attached to one another at the peripheral edges only, and where the bilayers themselves are at a minimum stress conditions at a reference temperature defined by the temperature at which the bilayers are formed.Type: GrantFiled: December 5, 2002Date of Patent: August 26, 2008Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, S. Jay Chey, James Patrick Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul Alfred Lauro, Nancy C. LaBianca, Michael J. Rooks
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Publication number: 20080180927Abstract: A circuit package is provided. The circuit package includes a plurality of electrically conductive pads located on a bottom surface of the circuit package, wherein at least one pad of the plurality of bottom surface pads has a recession for receiving an electrically conductive protrusion located on a substrate to which the circuit package is to be mounted.Type: ApplicationFiled: January 26, 2007Publication date: July 31, 2008Inventors: Paul Coteus, Gareth Geoffrey Hougham, Brian R. Sundlof
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Patent number: 7402053Abstract: A PGA socket including a plurality of sub-socket components, which when used in combination forms a larger effective socket, includes multiple apertures configured to receive corresponding pins of an IC. The PGA socket further includes multiple contact members, each of the contact members corresponding to a respective one of the apertures. The contact members are configured to movably engage corresponding pins of the IC upon respective movement of the apertures so as to provide electrical and mechanical contact thereto. Each of the sub-socket components is configured to mechanically engage at least one of the other sub-socket components such that the contact members in each of the sub-socket components are capable of electrically connecting to corresponding pins of the IC substantially simultaneously.Type: GrantFiled: June 15, 2007Date of Patent: July 22, 2008Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, William Louis Brodsky, Thomas M. Cipolla, Paul William Coteus, Ronald Malfatt
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Publication number: 20080026627Abstract: A PGA socket including a plurality of sub-socket components, which when used in combination forms a larger effective socket, includes multiple apertures configured to receive corresponding pins of an IC. The PGA socket further includes multiple contact members, each of the contact members corresponding to a respective one of the apertures. The contact members are configured to movably engage corresponding pins of the IC upon respective movement of the apertures so as to provide electrical and mechanical contact thereto. Each of the sub-socket components is configured to mechanically engage at least one of the other sub-socket components such that the contact members in each of the sub-socket components are capable of electrically connecting to corresponding pins of the IC substantially simultaneously.Type: ApplicationFiled: July 31, 2006Publication date: January 31, 2008Applicant: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, William Louis Brodsky, Thomas M. Cipolla, Paul William Coteus, Ronald Malfatt
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Publication number: 20080026628Abstract: A PGA socket including a plurality of sub-socket components, which when used in combination forms a larger effective socket, includes multiple apertures configured to receive corresponding pins of an IC. The PGA socket further includes multiple contact members, each of the contact members corresponding to a respective one of the apertures. The contact members are configured to movably engage corresponding pins of the IC upon respective movement of the apertures so as to provide electrical and mechanical contact thereto. Each of the sub-socket components is configured to mechanically engage at least one of the other sub-socket components such that the contact members in each of the sub-socket components are capable of electrically connecting to corresponding pins of the IC substantially simultaneously.Type: ApplicationFiled: June 15, 2007Publication date: January 31, 2008Applicant: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, William Louis Brodsky, Thomas M. Cipolla, Paul William Coteus, Ronald Malfatt
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Patent number: 7322844Abstract: A PGA socket including a plurality of sub-socket components, which when used in combination forms a larger effective socket, includes multiple apertures configured to receive corresponding pins of an IC. The PGA socket further includes multiple contact members, each of the contact members corresponding to a respective one of the apertures. The contact members are configured to movably engage corresponding pins of the IC upon respective movement of the apertures so as to provide electrical and mechanical contact thereto. Each of the sub-socket components is configured to mechanically engage at least one of the other sub-socket components such that the contact members in each of the sub-socket components are capable of electrically connecting to corresponding pins of the IC substantially simultaneously.Type: GrantFiled: July 31, 2006Date of Patent: January 29, 2008Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, William Louis Brodsky, Thomas M. Cipolla, Paul William Coteus, Ronald Malfatt
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Patent number: 7282790Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.Type: GrantFiled: June 6, 2005Date of Patent: October 16, 2007Assignee: International Business Machines CorporationInventors: Paul Coteus, Kevin C. Gower, Shawn Anthony Hall, Dale J. Pearson, Gareth Geoffrey Hougham
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Patent number: 7276787Abstract: A carrier structure and method for fabricating a carrier structure with through-vias each having a conductive structure with an effective coefficient of thermal expansion which is less than or closely matched to that of the substrate, and having an effective elastic modulus value which is less than or closely matches that of the substrate. The conductive structure may include concentric via fill areas having differing materials disposed concentrically therein, a core of the substrate material surrounded by an annular ring of conductive material, a core of CTE-matched non-conductive material surrounded by an annular ring of conductive material, a conductive via having an inner void with low CTE, or a full fill of a conductive composite material such as a metal-ceramic paste which has been sintered or fused.Type: GrantFiled: December 5, 2003Date of Patent: October 2, 2007Assignee: International Business Machines CorporationInventors: Daniel Charles Edelstein, Paul Stephen Andry, Leena Paivikki Buchwalter, Jon Alfred Casey, Sherif A. Goma, Raymond R. Horton, Gareth Geoffrey Hougham, Michael Wayne Lane, Xiao Hu Liu, Chirag Suryakant Patel, Edmund Juris Sprogis, Michelle Leigh Steen, Brian Richard Sundlof, Cornelia K. Tsang, George Frederick Walker
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Patent number: 6890599Abstract: New etch barriers of indium-tin-oxide in the manufacturing process of thin film transistor-liquid crystal display are self-assembled monolayers, such as n-alkylsilanes. A typical process of applying a self-assembled monolayer is to ink a hydrolyzed n-octadecyltrimethoxysilane solution on to a stamp and then to transfer the solution onto ITO. The surface of the stamp may be polar enough to be wet with polar self-assembled monolayer solutions of an akylsilane. A non-polar stamp surface may be treated with oxygen plasma to obtain a wettable polar surface.Type: GrantFiled: June 13, 2003Date of Patent: May 10, 2005Assignee: Intellectual Business Machines CorporationInventors: Stephen L. Buchwalter, Gareth Geoffrey Hougham, Kang-Wook Lee, John J. Ritsko, Mary Elizabeth Rothwell, Peter M. Fryer
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Publication number: 20040110322Abstract: A Negative Thermal Expansion system (NTEs) device for TCE compensation or CTE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging. One aspect of the present invention provides a method for fabricating micromachine devices that have negative thermal expansion coefficients that can be made into a composite for manipulation of the TCE of the material. These devices and composites made with these devices are in the categories of materials called “smart materials” or “responsive materials.” Another aspect of the present invention provides microdevices comprised of dual opposed bilayers of material where the two bilayers are attached to one another at the peripheral edges only, and where the bilayers themselves are at a minimum stress conditions at a reference temperature defined by the temperature at which the bilayers are formed.Type: ApplicationFiled: December 5, 2002Publication date: June 10, 2004Applicant: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, S. Jay Chey, James Patrick Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul Alfred Lauro, Nancy C. LaBianca, Michael J. Rooks
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Publication number: 20030211341Abstract: New etch barriers of indium-tin-oxide in the manufacturing process of thin film transistor-liquid crystal display are self-assembled monolayers, such as n-alkylsilanes. A typical process of applying a self-assembled monolayer is to ink a hydrolyzed n-octadecyltrimethoxysilane solution on to a stamp and then to transfer the solution onto ITO. The surface of the stamp may be polar enough to be wet with polar self-assembled monolayer solutions of an akylsilane. A non-polar stamp surface may be treated with oxygen plasma to obtain a wettable polar surface.Type: ApplicationFiled: June 13, 2003Publication date: November 13, 2003Inventors: Stephen L. Buchwalter, Gareth Geoffrey Hougham, Kang-Wook Lee, John J. Ritsko, Mary Elizabeth Rothwell, Peter M. Fryer
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Patent number: 6636290Abstract: Liquid crystal display (LCD ) panels can be formed rapidly by this method, which involves depositing liquid crystal (LC) in a central region of one substrate, depositing a fillet of epoxy material in a continuous loop along the periphery of one substrate to surround the LC material, placing a second glass substrate over the first substrate and in continuous contact with the epoxy fillet, and then causing the fillet to set by curing or cross-linking. Advantageously, the epoxy fillet can be hardened by scanning it with an infrared or ultraviolet laser focussed to avoid heating the LC material. Alternatively, the epoxy fillet can be formed from two-component epoxy by depositing one fillet of each component on the peripheral region of one of the substrates, joining the substrates to merge the two components, and then vibrating the joined substrates to enhance commingling and setting of the two components into a strong hermetic seal.Type: GrantFiled: May 10, 1999Date of Patent: October 21, 2003Assignee: International Business Machines CorporationInventors: James Henry Glownia, Gareth Geoffrey Hougham, Eric Gerhard Liniger, Robert Jacob Von Gutfeld
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Patent number: 6632536Abstract: New etch barriers of indium-tin-oxide in the manufacturing process of thin film transistor-liquid crystal display are self-assembled monolayers, such as n-alkylsilanes. A typical process of applying a self-assembled monolayer is to ink a hydrolyzed n-octadecyltrimethoxysilane solution on to a stamp and then to transfer the solution onto ITO. The surface of the stamp may be polar enough to be wet with polar self-assembled monolayer solutions of an akylsilane. A non-polar stamp surface may be treated with oxygen plasma to obtain a wettable polar surface.Type: GrantFiled: December 28, 2000Date of Patent: October 14, 2003Assignee: International Business Machines CorporationInventors: Stephen L. Buchwalter, Gareth Geoffrey Hougham, Kang-Wook Lee, John J. Ritsko, Mary Elizabeth Rothwell, Peter M. Fryer
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Publication number: 20030186572Abstract: In the invention the various effects of temperature and responsiveness in the technology is moderated in the resulting interconnect structure by building into the supporting frame arrangement a selected thermal expansion property that operates to exert some control on the thermal dimensional aspects of the elastomeric interconnect in its' fabrication and throughout its' service. In accordance with the invention the materials involved in the interconnect and frame are at least partially provided with a selected coefficient of thermal expansion (CTE) property that provides a direction and magnitude aspect in the structure that operates to compensate for dimensional changes to the interconnects that may occur to the array in fabrication and service.Type: ApplicationFiled: April 1, 2002Publication date: October 2, 2003Inventors: Gareth Geoffrey Hougham, Claudius Feger
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Publication number: 20030127002Abstract: A layered structure and process for a microcontact printing stamp has individual layers chosen to impart particular properties such as one layer chosen for surface properties and another layer chosen for bulk mechanical properties. The invention is fabricated through having a first layer with coatable properties and a subsequent layer with injectable properties resulting in a layered structure wherein the layer at the surface has optimized surface properties and is positioned on an underlying layer with carefully chosen bulk mechanical properties, and other unique functional properties can be imparted through an intermediate layer. A fabrication process is provided that employs a coating capability for one portion, an injection capability for another property and a porosity property for still another portion.Type: ApplicationFiled: January 4, 2002Publication date: July 10, 2003Inventors: Gareth Geoffrey Hougham, Mary Elizabeth Rothwell, Ronald Wayne Nunes
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Publication number: 20020150783Abstract: Spilled, difficult to handle material can be transferred from the spillage location through the use of a deformable absorber member that has a thin surface coating that has a high affinity for the spilled material. The deformable absorber may be provided with a large spilled material receiving surface area through being formed of a group of contacting particles or intertwined filaments that impart a wicking capability with respect to a spillage in liquid form. The invention is of particular use in the cleaning up of spilled mercury droplets using a woven copper wick member coated with a thin layer of gold.Type: ApplicationFiled: April 13, 2001Publication date: October 17, 2002Inventors: Gareth Geoffrey Hougham, Keith Edward Fogel, Donald Thomas DeMouth
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Publication number: 20020084252Abstract: New etch barriers of indium-tin-oxide in the manufacturing process of thin film transistor-liquid crystal display are self-assembled monolayers, such as n-alkylsilanes. A typical process of applying a self-assembled monolayer is to ink a hydrolyzed n-octadecyltrimethoxysilane solution on to a stamp and then to transfer the solution onto ITO. The surface of the stamp may be polar enough to be wet with polar self-assembled monolayer solutions of an akylsilane. A non-polar stamp surface may be treated with oxygen plasma to obtain a wettable polar surface.Type: ApplicationFiled: December 28, 2000Publication date: July 4, 2002Inventors: Stephen L. Buchwalter, Gareth Geoffrey Hougham, Kang-Wook Lee, John J. Ritsko, Mary Elizabeth Rothwell, Peter M. Fryer