Patents by Inventor Gary B. Long

Gary B. Long has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040181764
    Abstract: A method and apparatus for reducing timing skew between conductor traces. A dielectric medium made of a resin reinforced with a fabric is provided. The fabric includes a first plurality of yarns running parallel to a first axis and a second plurality of yarns running parallel to a second axis. The first plurality of yarns are separated by a first weave pitch and the second plurality of yarns separated by a second weave pitch. At least two conductor traces are formed on the dielectric medium. The conductor traces are positioned on the dielectric medium such that the conductor traces each have substantially similar effective dielectric constants.
    Type: Application
    Filed: March 11, 2003
    Publication date: September 16, 2004
    Inventors: Gary A. Brist, Gary B. Long, William O. Alger, Carlos Mejia, Bryce Horine
  • Publication number: 20040175966
    Abstract: An apparatus for receiving a microchip and having a conductor buses therein. A top surface of the apparatus receives the microchip while the bottom surface is to mount to a circuit board. A plurality of pin receptacles pass through the top surface to receive a corresponding plurality of microchip pins of the microchip. The conductor bus resides at least in part between the top surface and the bottom surface and is electrically coupled to a first plurality of the plurality of the pin receptacles.
    Type: Application
    Filed: March 4, 2003
    Publication date: September 9, 2004
    Inventors: William O. Alger, Gary B. Long, Gary A. Brist, Carlos Mejia
  • Publication number: 20040058561
    Abstract: Formation of a mixed-material composition through diffusion using photo-thermal energy. The diffusion may be used to create electrically conductive traces. The diffusion may take place between material layers on one of a package substrate, semiconductor substrate, substrate for a printed circuit board (PCB), or other multilayered substrate. The photo-thermal energy may be supplied by various devices, for example a YAG laser device, CO2 laser device, or other energy source.
    Type: Application
    Filed: July 9, 2003
    Publication date: March 25, 2004
    Inventors: Gary A. Brist, Gary B. Long, Daryl A. Sato
  • Publication number: 20040058521
    Abstract: Formation of a mixed-material composition through diffusion using photo-thermal energy. The diffusion may be used to create electrically conductive traces. The diffusion may take place between material layers on one of a package substrate, semiconductor substrate, substrate for a printed circuit board (PCB), or other multi-layered substrate. The photo-thermal energy may be supplied by various devices, for example a YAG laser device, CO2 laser device, or other energy source.
    Type: Application
    Filed: July 9, 2003
    Publication date: March 25, 2004
    Inventors: Gary A. Brist, Gary B. Long, Daryl A. Sato
  • Patent number: 6642158
    Abstract: Formation of a mixed-material composition through diffusion using photo-thermal energy. The diffusion may be used to create electrically conductive traces. The diffusion may take place between material layers on one of a package substrate, semiconductor substrate, substrate for a printed circuit board (PCB), or other multi-layered substrate. The photo-thermal energy may be supplied by various devices, for example a YAG laser device, CO2 laser device, or other energy source.
    Type: Grant
    Filed: September 23, 2002
    Date of Patent: November 4, 2003
    Assignee: Intel Corporation
    Inventors: Gary A. Brist, Gary B. Long, Daryl A. Sato
  • Publication number: 20030059151
    Abstract: A method is provided for forming a waveguide in a printed circuit board. This may include forming a trench in a printed circuit board substrate and forming at least one metalized surface along the trench. A metalized capping surface may be provided over the trench so as to form the waveguide structure.
    Type: Application
    Filed: September 27, 2001
    Publication date: March 27, 2003
    Inventors: Gary A. Brist, Carlos Mejia, William O. Alger, Gary B. Long