Abstract: A photographic light diffusing device is provided. A cowl is adapted to be mounted on a photographic light source, the cowl including an opening through which the photographic light source is visible when the cowl is mounted on the photographic light source. The cowl may also include at least one movable flap and a filter slot for a gel filter.

Abstract: A cooling arrangement is provided for a mold centering device for multi-level stack molds having a spline shaft with a central region journaled to an intermediate mold level with involute spline pathways extending in oppositely twisting helices from the central region toward opposite ends thereof and respective spline nuts secured to adjacent mold levels threadedly engaging the spline pathways to run therealong for converting linear motion into rotational motion and vice versa thereby controlling relative opening and closing rates of the adjacent mold levels relative to the intermediate mold levels therebetween. The cooling arrangement has an internal fluid passageway extending along the spline shaft into a region of the spline shaft received in the spline nuts. A fluid inlet communicates with and supplies fluid to the fluid passageway. A fluid outlet communicates with and discharges fluid from the fluid passageway.

Abstract: The present invention provides a composite nozzle cap having a first part made of metal and an outer tip of a polymeric material. The first part mechanically secures the nozzle into the nozzle housing by engaging the nozzle housing and pressing against a base flange on the nozzle to clamp the flange between the first part of the nozzle housing. The second part extends away from the nozzle housing and is mechanically secured to the first part. An inner face of the second part contacts the nozzle tip to prevent melt flow between the second part of the nozzle tip. An outer face of the second part contacts the gate insert to avoid melt flow between the second part and the gate insert. As the second part is of a polymeric material, it avoids the heat transfer concerns associated with a metallic interface between the nozzle tip and the gate insert.

Abstract: A photographic light diffusing system includes a camera having both a lens unit and a flash unit, and a light diffuser having a semi-transparent panel with an aperture mounted on the lens unit of a camera. The semi-transparent panel of the light diffuser obscures the flash unit when viewed from a subject in a field of view of the lens unit of a camera. The semi-transparent panel of the light diffuser may also include a textured surface on a side of the semi-transparent panel furthest from the flash unit, the textured surface being made up of a field of raised pyramids provided on the semi-transparent panel.

Abstract: A photographic light diffusing device comprises a semi-transparent cowl which is adapted to be mounted on a photographic light source, the cowl including an opening through which the photographic light source is visible when the cowl is mounted thereon, and a removable semi-transparent cover detachably mounted on the cowl. In another embodiment, a camera flash system comprises a camera flash unit, and a diffuser unit having an adaptor and a tapered cylindrical body. The adaptor is formed to match the shape of the housing of the camera flash unit so that it may be fitted thereto, and the adaptor extends between the camera flash unit and the tapered cylindrical body of the diffuser unit. The diffuser unit widens from the adaptor to meet the tapered cylindrical body.

Abstract: A photographic light diffusing device is provided. A flexible, transparent cowl is adapted to be mounted on a photographic light source, the cowl including a plurality of ribs and an opening through which the photographic light source is visible when the cowl is mounted on the photographic light source. The cowl elastically deforms to fit onto the photographic light source. A removable, flexible cover is placed over the opening of the cowl.

Abstract: An optical fiber-based distribution system for converting color video and stereo audio electrical signals for transmission over the fewest possible number of optical fiber cables and for then re-converting such signals back to electrical format for use at each projection room in a multi-theater complex. The color video signals include the red R, green G and blue B color video signals and attendant synchronization signals, horizontal synch H and vertical synch V. The audio signals include left L and right R channel stereo signals. The five electrical video signals R, G, B, V, H are converted in an RGB transmitter to three distinct optical signals for transmission over three fiber optic cables and the two electrical audio stereo signals L, R are converted in a stereo audio transmitter for transmission over one fiber optic cable.

Abstract: According to the present invention a coding plate is interspersed between first and second respective inlet and outlet cross over nozzle parts. The cooling plate engages ends of the cross over nozzles during mould filling and provides a melt transfer passage therebetween. Once the mould is filled, the cooling plate acts to dissipate heat from the melt transfer passage thereby promoting solidification of melt therein. Accordingly melt solidification in the sprue is assured with more certainty than prior art designs enabling relatively fax mould cycling with minimal risk of drool.

Abstract: According to the present invention, a manifold mounting arrangement is provided wherein a leg manifold is securely mounted midway along its length rather than at its sprue bushing and whereby thermally induced length changes are accommodated outwardly from its centre. Additionally, a first end of the leg manifold is clampingly secured between a sprue housing and a manifold insulator to avoid movement of the first end toward the sprue upon a sprue break portion of the injection moulding cycle.

Abstract: According to the present invention a coding plate is interspersed between first and second respective inlet and outlet cross over nozzle parts. The cooling plate engages ends of the cross over nozzles during mould filling and provides a melt transfer passage therebetween. Once the mould is filled, the cooling plate acts to dissipate heat from the melt transfer passage thereby promoting solidification of melt therein. Accordingly melt solidification in the sprue is assured with more certainty than prior art designs enabling relatively fax mould cycling with minimal risk of drool.

Abstract: According to the present invention, a manifold mounting arrangement is provided wherein a leg manifold is securely mounted midway along its length rather than at its sprue bushing and whereby thermally induced length changes are accommodated outwardly from its centre. Additionally, a first end of the leg manifold is clampingly secured between a sprue housing and a manifold insulator to avoid movement of the first end toward the sprue upon a sprue break portion of the injection moulding cycle.

Abstract: According to the present invention, a nozzle cap is provided which has a housing end that threadedly engages the nozzle housing to secure the nozzle tip to the nozzle housing. The remainder of the cap substantially fills the space between the nozzle tip and the gate insert while maintaining a small clearance between the cap and both the nozzle tip and the gate insert in the region surrounding an outlet end of the nozzle. The clearance prevents direct conductive heat transfer from the outlet end of the nozzle tip to the gate insert yet is sufficiently small enough to substantially eliminate melt to flow past it.

Abstract: A method and apparatus are disclosed for forming thin polymer layers on semiconductor substrates. In one embodiment, the method and apparatus include the vaporization of stable di-pxylylene, the pyrolytic conversion of such gaseous dimer material into reactive monomers, and the optional blending of the resulting gaseous p-xylylene monomers with one or more polymerizable materials in gaseous form capable of copolymerizing with the p-xylylene monomers to form a low dielectric constant polymerized parylene material. An apparatus is also disclosed which provides for the distribution of the polymerizable gases into the deposition chamber, for cooling the substrate down to a temperature at which the gases will condense to form a polymerized dielectric material, for heating the walls of the deposition chamber to inhibit formation and accumulation of polymerized residues thereon, and for recapturing unreacted monomeric vapors exiting the deposition chamber.

Abstract: According to the present invention, a nozzle cap is provided which has a housing end that threadedly engages the nozzle housing to secure the nozzle tip to the nozzle housing. The remainder of the cap substantially fills the space between the nozzle tip and the gate insert while maintaining a small clearance between the cap and both the nozzle tip and the gate insert in the region surrounding an outlet end of the nozzle. The clearance prevents direct conductive heat transfer from the outlet end of the nozzle tip to the gate insert yet is sufficiently small enough to substantially eliminate melt to flow past it.

Abstract: The present invention provides systems, methods and apparatus for high temperature (at least about 500-800° C.) processing of semiconductor wafers. The systems, methods and apparatus of the present invention allow multiple process steps to be performed in situ in the same chamber to reduce total processing time and to ensure high quality processing for high aspect ratio devices. Performing multiple process steps in the same chamber also increases the control of the process parameters and reduces device damage. In particular, the present invention can provide high temperature deposition, heating and efficient cleaning for forming dielectric films having thickness uniformity, good gap fill capability, high density, low moisture, and other desired characteristics.

Abstract: An apparatus for increasing the ozone concentration in the output of an ozone-generating system is disclosed. The invention reduces the concentration of O.sup.+ ions, which would otherwise react with ozone to form diatomic oxygen, by means of an ionic filter. In one embodiment, a gas-permeable electrode within a gas conduit attached to the output of an ozonator is negatively charged to several kilovolts with respect to the distribution line. This electrode attracts the positively charged oxygen ions, removing them before they can react with the ozone. This provides a higher ozone concentration that does not vary as much with distance from the ozone generator.

Abstract: The present invention provides systems, methods and apparatus for high temperature (at least about 500-800.degree. C.) processing of semiconductor wafers. The systems, methods and apparatus of the present invention allow multiple process steps to be performed in situ in the same chamber to reduce total processing time and to ensure high quality processing for high aspect ratio devices. Performing multiple process steps in the same chamber also increases the control of the process parameters and reduces device damage. In particular, the present invention can provide high temperature deposition, heating and efficient cleaning for forming dielectric films having thickness uniformity, good gap fill capability, high density, low moisture, and other desired characteristics.

Abstract: The present invention provides systems, methods and apparatus for high temperature (at least about 500-800.degree. C.) processing of semiconductor wafers. The systems, methods and apparatus of the present invention allow multiple process steps to be performed in situ in the same chamber to reduce total processing time and to ensure high quality processing for high aspect ratio devices. Performing multiple process steps in the same chamber also increases the control of the process parameters and reduces device damage. In particular, the present invention can provide high temperature deposition, heating and efficient cleaning for forming dielectric films having thickness uniformity, good gap fill capability, high density, low moisture, and other desired characteristics.

Abstract: The present invention provides systems, methods and apparatus for high temperature (at least about 500-800.degree. C.) processing of semiconductor wafers. The systems, methods and apparatus of the present invention allow multiple process steps to be performed in situ in the same chamber to reduce total processing time and to ensure high quality processing for high aspect ratio devices. Performing multiple process steps in the same chamber also increases the control of the process parameters and reduces device damage. In particular, the present invention can provide high temperature deposition, heating and efficient cleaning for forming dielectric films having thickness uniformity, good gap fill capability, high density, low moisture, and other desired characteristics.