Patents by Inventor Gary J. Dispoto

Gary J. Dispoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11964436
    Abstract: In an example, a method includes operating, by a processor, on object model data and operating, on a processor, on pattern data. The object model data describes at least part of an object to be generated in additive manufacturing and the pattern data describes an object pattern intended to be formed on at least a portion of the part of the object to be generated in additive manufacturing. The method includes determining, by a processor, control data to control a print agent applicator to apply a pattern of fusing agent onto a part of a layer of build material. The pattern of fusing agent comprises a fusing agent area and a gap area that lacks fusing agent. The gap area corresponds to the object pattern such that no fusing agent is applied to a part of the layer of build material that corresponds to the object pattern.
    Type: Grant
    Filed: December 20, 2022
    Date of Patent: April 23, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wei Huang, Gary J. Dispoto, Craig Peter Sayers
  • Patent number: 11904535
    Abstract: A hybrid connection for connecting a first portion of a three-dimensional (3D) print design to a second portion of the 3D print design may include a cross-sectional pattern of fully-fused connections and under-fused connections that connect between the first portion of the 3D print design and the second portion of the 3D print design. Systems and methods are also described herein that facilitate designing 3D parts with hybrid connections and/or automatically replacing fully-fused connections with hybrid connections.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: February 20, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wei Huang, Patrick De Marcillac, Gary J. Dispoto
  • Publication number: 20230356474
    Abstract: According to examples, a three-dimensional (3D) fabrication system may include a controller that may control an agent delivery system to deposit a fusing agent onto a fusing area of a layer of particles of build material. The controller may also control the agent delivery system to deposit an energy absorbing agent onto an unfused thermal support area of the layer of particles, the unfused thermal support area being located adjacent to the fusing area. The controller may further control an energy supply system to supply energy, in which supply of the energy is to cause the particles on which the fusing agent has been deposited to melt and a temperature of the particles in the unfused thermal support area to be raised to a level that is below a melting point temperature of the particles.
    Type: Application
    Filed: April 26, 2023
    Publication date: November 9, 2023
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Wei Huang, Gary J. Dispoto
  • Patent number: 11724448
    Abstract: A device comprising a material distributor and a fluid dispenser. The material distributor to distribute a build material, layer-by-layer, to form a 3D object. A fluid dispenser to selectively dispense in at least some of the respective layers a first fluid agent and a second fluid agent. The first fluid agent, comprising a first color, is to be dispensed at first selectable voxel locations to affect a first material property of a first portion of the 3D object. The second fluid agent, comprising a second color, is to be dispensed at second selectable voxel locations to at least partially disguise the first color of the first portion of the 3D object.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: August 15, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wei Huang, Steven J. Simske, Gary J. Dispoto
  • Patent number: 11691339
    Abstract: An example system includes an object and a support frame supporting the object. The support frame constrains movement of the object relative to the support frame, and the support frame includes at least one of a cage or a shackle to non-rigidly constrain movement of at least a part of the object.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: July 4, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wei Huang, Steven J. Simske, Ingeborg Tastl, Melanie M. Gottwals, Gary J. Dispoto
  • Publication number: 20230166453
    Abstract: A method includes additively manufacturing a three-dimensional object including a selectable parameter to control at least one thermal parameter of the three-dimensional object.
    Type: Application
    Filed: April 9, 2020
    Publication date: June 1, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Wei Huang, William J. Allen, Gary J. Dispoto
  • Patent number: 11660823
    Abstract: According to examples, a three-dimensional (3D) fabrication system may include a controller that may control an agent delivery system to deposit a fusing agent onto a fusing area of a layer of particles of build material. The controller may also control the agent delivery system to deposit an energy absorbing agent onto an unfused thermal support area of the layer of particles, the unfused thermal support area being located adjacent to the fusing area. The controller may further control an energy supply system to supply energy, in which supply of the energy is to cause the particles on which the fusing agent has been deposited to melt and a temperature of the particles in the unfused thermal support area to be raised to a level that is below a melting point temperature of the particles.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: May 30, 2023
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Wei Huang, Gary J. Dispoto
  • Publication number: 20230146931
    Abstract: A device comprises a control portion to additively manufacturing a 3D object to include a first interior portion having a first thermal history different from a second thermal history of at least second interior portions surrounding the selectable first interior portion to induce an authentication surface feature at a first exterior surface portion overlying the first interior portion.
    Type: Application
    Filed: April 13, 2020
    Publication date: May 11, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Wei Huang, Gary J. Dispoto
  • Publication number: 20230124156
    Abstract: In an example, a method includes operating, by a processor, on object model data and operating, on a processor, on pattern data. The object model data describes at least part of an object to be generated in additive manufacturing and the pattern data describes an object pattern intended to be formed on at least a portion of the part of the object to be generated in additive manufacturing. The method includes determining, by a processor, control data to control a print agent applicator to apply a pattern of fusing agent onto a part of a layer of build material. The pattern of fusing agent comprises a fusing agent area and a gap area that lacks fusing agent. The gap area corresponds to the object pattern such that no fusing agent is applied to a part of the layer of build material that corresponds to the object pattern.
    Type: Application
    Filed: December 20, 2022
    Publication date: April 20, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Wei Huang, Gary J. Dispoto, Craig Peter Sayers
  • Patent number: 11628627
    Abstract: In an example, a method is described that includes generating a model for fabricating an item via an additive manufacturing process. The model includes a first region defining the item and a second region defining a sacrificial artifact whose presence disguises a physical characteristic of the item. The item and the sacrificial artifact are then fabricated in a common build batch via the additive manufacturing process.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: April 18, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wei Huang, Steven J. Simske, Gary J. Dispoto
  • Publication number: 20230102343
    Abstract: In some examples, a method comprises obtaining, by an additive manufacturing device, a file compatible with the additive manufacturing device, the file comprising representations of objects and a support structure for the objects, the representation of the support structure having an identifier for identifying the support structure; and the additive manufacturing device using an additive manufacturing process and the file to manufacture the objects, the support structure, and the identifier for identifying the support structure.
    Type: Application
    Filed: March 26, 2020
    Publication date: March 30, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Wei Huang, Gary J. Dispoto
  • Patent number: 11607842
    Abstract: According to examples, a three-dimensional (3D) fabrication system may include a controller to identify a feature of an object to be fabricated and based on the identified feature having a size that is smaller than a predefined size, determine a thermal support for the identified feature. The controller may also control fabrication components to form, through application of energy, the determined thermal support from a first set of particles, form an intermediate section adjacent to the formed thermal support from a second set of particles, and form, through application of energy, the feature adjacent to the intermediate section from a third set of particles, in which heat from the thermal support is to reduce a thermal bleed rate of the third set of particles.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: March 21, 2023
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Wei Huang, Gary J. Dispoto
  • Patent number: 11597143
    Abstract: In an example, a method is described that includes generating a model for fabricating an object via an additive manufacturing process. The model includes a first region defining the object and a second region defining a sacrificial artifact. The object is fabricated via the additive manufacturing process, using a fusing printing fluid. The sacrificial artifact is fabricated simultaneously with fabricating the object, via the additive manufacturing process, using a non-fusing printing fluid.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: March 7, 2023
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Wei Huang, Steven J. Simske, Gary J. Dispoto
  • Patent number: 11577463
    Abstract: In an example, a method includes operating, by a processor, on object model data and operating, on a processor, on pattern data. The object model data describes at least part of an object to be generated in additive manufacturing and the pattern data describes an object pattern intended to be formed on at least a portion of the part of the object to be generated in additive manufacturing. The method includes determining, by a processor, control data to control a print agent applicator to apply a pattern of fusing agent onto a part of a layer of build material. The pattern of fusing agent comprises a fusing agent area and a gap area that lacks fusing agent. The gap area corresponds to the object pattern such that no fusing agent is applied to a part of the layer of build material that corresponds to the object pattern.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: February 14, 2023
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Wei Huang, Gary J. Dispoto, Craig Peter Sayers
  • Patent number: 11565472
    Abstract: A 3D object is additively formed via arranging non-conductive material relative to a receiving surface. During additive formation of the 3D object, a conductive channel is formed as part of the 3D object. In some instances, non-destructive fracture sensing is performed via measurement of an electrical parameter of the conductive channel.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: January 31, 2023
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Wei Huang, Lihua Zhao, Gary J. Dispoto
  • Publication number: 20230020639
    Abstract: The present disclosure relates to a three-dimensional printing kit comprising: a powder bed material comprising polymer particles; a fusing agent comprising a radiation absorber and a liquid carrier; and a magnetic marking agent comprising magnetic nanoparticles, a humectant and a liquid carrier, wherein the concentration of magnetic nanoparticles is 5 to 70 weight % based on the total weight of the magnetic agent. The present disclosure also relates to a method of three-dimensional (3D) printing a 3D printed object. The method comprises: selectively applying a magnetic marking agent onto powder bed material, wherein the powder bed material comprises polymer particles, and wherein the magnetic marking agent comprises magnetic nanoparticles and a liquid carrier; selectively fusing the powder bed material, such that the magnetic nanoparticles are incorporated in the 3D printed object in a predetermined arrangement that forms a detectable marker in the 3D printed object.
    Type: Application
    Filed: December 11, 2019
    Publication date: January 19, 2023
    Inventors: AJA HARTMAN, JOHN SAMUEL DILIP JANGAM, WEI HUANG, THOMAS CRAIG ANTHONY, GARY J DISPOTO, LIHUA ZHAO
  • Publication number: 20230020856
    Abstract: In one example in accordance with the present disclosure, a method is described. According to the method, a characteristic of each of multiple three-dimensional (3D) objects to be printed is determined. 3D objects to be printed are grouped based on characteristic similarity. For a group of 3D objects to be printed, an additive manufacturing setting is altered based on the characteristics of the 3D objects to be printed that form the group.
    Type: Application
    Filed: January 13, 2020
    Publication date: January 19, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Wei Huang, Gary J. Dispoto
  • Publication number: 20220402204
    Abstract: In one example in accordance with the present disclosure, an additive manufacturing device is described. The additive manufacturing device includes a build material distributor to deposit layers of powdered build material onto a bed. At least one energy source selectively fuses portions of the layer of powdered build material to form a slice of a three-dimensional (3D) printed object. A detailing agent distributor of the additive manufacturing device generates a uniform property distribution across a portion of the layer of powdered build material by depositing a detailing agent.
    Type: Application
    Filed: November 25, 2019
    Publication date: December 22, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Wei Huang, Gary J Dispoto
  • Publication number: 20220388248
    Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a fracture channel controller to determine fracture channels for a three-dimensional (3D) printed object. Portions of the 3D printed object along fracture channels are to be solidified to a lesser degree as compared to non-channel portions of the 3D printed object. The system also includes an additive manufacturing controller to control an additive manufacturing device. The additive manufacturing controller controls the additive manufacturing device to 1) solidify portions of a layer of powdered build material to form a slice of the 3D printed object and 2) selectively solidify fracture channels in the slice, wherein the fracture channels are solidified to a lesser degree as compared to non-channel portions.
    Type: Application
    Filed: December 10, 2019
    Publication date: December 8, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Wei Huang, Gary J Dispoto
  • Patent number: 11511486
    Abstract: A system for detecting three-dimensional (3D) part drag includes an infrared image capture device to capture a plurality of thermal images of a 3D part build region of a 3D printing device on which a part is built, and an image analysis module to detect drag of the part based on a difference image produced by subtracting a first thermal image from a second thermal image.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: November 29, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sunil Kothari, Tod Heiles, Luke Bockman, Gary J. Dispoto, Md Abdullah Al Hafiz Khan, Todd Goyen