Abstract: Embodiments include a high temperature electrode connection assembly for a wafer-processing pedestal. The high temperature electrode connection assembly includes an electrode rod having a cup that mounts to a stud embedded in the pedestal and a plate adapter portion. The assembly also includes a floating plate having an outer surface and an aperture for receiving the electrode rod. The floating plate contacts an inner surface of the pedestal to resist lateral movement of the electrode rods. The assembly also includes an anti-rotation retainer ring that frictionally engages the electrode rod and an anti-rotation post extending from the outer surface of the floating plate. The anti-rotation post limits rotation of the electrode rod with respect to the floating plate.

Abstract: An airborne component extraction system includes a source of a positive pressure air stream and a source of a negative pressure air stream. The air streams are directed through conduits to a hood that distributes the positive pressure air stream into a work area, and that draws the negative pressure air stream from the work area to remove airborne components within the work area. Aspects of the hood offer greatly enhanced performance in creating a controlled region for component removal and for drawing and removing the components for the work area.

Abstract: A extraction system is designed for metal working and other applications. The system may comprise a cart-type base or may be incorporated into a fixed or semi-fixed installation. A blower delivers a positive pressure airflow to a hood that creates an air region by directing the air through an annular space between inner and outer shrouds, impacting the air against a single generally perpendicular flange. Return air from the operation may be mixed with fresh air, both of which may be filtered, to supply the positive pressure air. Both air streams to and from the hood may be adjusted to optimize operation. Adjustments may be made at the base unit or remotely.

Abstract: The present disclosure relates to a packaging system for compressible goods utilizing pre-punched alignment apertures on wicketed and/or chain-linked open bottom bags. The disclosure relates to a bag transport and indexing system through the form fill compress and seal system. The disclosure further relates to the use of sprocket pins spaced accordingly on either a horizontal linear or rotary machine so that the sprockets correspond to the pre-punched apertures on the wicketed and/or chain-linked open bottom bags.

Abstract: A substrate processing system includes a pedestal including a substrate supporting surface having a diameter that is greater than a diameter of a substrate to be processed by the substrate processing system. A first surface extends a first distance above the substrate supporting surface in a direction substantially perpendicular to the substrate supporting surface. The first distance is greater than or equal to one-half of a thickness of the substrate. A gap is defined between the first surface and an outer diameter of the substrate. A second surface extends a second distance from the first surface at an angle with respect to the first surface. The angle is greater than zero and less than ninety degrees. A third surface extends from the second surface and is substantially parallel to the substrate supporting surface. An etchant source directs etchant onto the substrate to etch the substrate.

Abstract: A heat shield employed in semiconductor processing apparatus comprises a high performance insulation that has low thermal conductivity, such as, below the thermal conductivity of still air over a wide range of temperatures utilized in operation of the apparatus. As an example, the thermal conductivity of the insulation may be in the range of about 0.004 W/m·h to about 0.4 W/m·h over a temperature range of about 0° C. to about 600° C. or more. The deployment of the high performance heat shield reduces the power consumption necessary for the heater by as much as 20% to reach a desired processing temperature as compared to a case of heater power consumption required to reach the same desired temperature without the shield.

Abstract: An apparatus and method for sealing and unsealing a chemical deposition apparatus in a chemical deposition process chamber includes a microvolume that has dual sealing elements at its periphery. One seal, the outer seal, is used to seal the inside of the microvolume from the main process chamber. The second (inner) seal is used to seal the inside of the microvolume from a vacuum source. The apparatus and process of the present invention has several advantages for enhanced chamber performance.

Abstract: The orientation of a wafer with respect to the surface of an electrolyte is controlled during an electroplating process. The wafer is delivered to an electrolyte bath along a trajectory normal to the surface of the electrolyte. Along this trajectory, the wafer is angled before entry into the electrolyte for angled immersion. A wafer can be plated in an angled orientation or not, depending on what is optimal for a given situation. Also, in some designs, the wafer's orientation can be adjusted actively during immersion or during electroplating, providing flexibility in various electroplating scenarios.

Abstract: Uniform fluid delivery to a substrate is provider using a diffuser. The diffuser is designed with a series of fluid (gas and/or liquid) passages of equal effective length/flow resistance, such that as the fluid passes through the diffuser, the gas exits all areas at the same time and with the same mass flux. These passages may not be physically the same, however they have the same effective length and flow resistance. The diffuser can be implemented using single or multiple stacked layers, and from several to many passages. The net effect is a uniform gas curtain to the wafer. Since the passages through the diffuser are effectively the same, the uniform gas curtain to the wafer is not sensitive to the quantity of gas, the gas flow rate or the gas pressure. Additionally, a faceplate can optionally be used to smooth out any jet effects of the diffuser exit holes.

Abstract: The orientation of a wafer with respect to the surface of an electrolyte is controlled during an electroplating process. The wafer is delivered to an electrolyte bath along a trajectory normal to the surface of the electrolyte. Along this trajectory, the wafer is angled before entry into the electrolyte for angled immersion. A wafer can be plated in an angled orientation or not, depending on what is optimal for a given situation. Also, in some designs, the wafer's orientation can be adjusted actively during immersion or during electroplating, providing flexibility in various electroplating scenarios.

Abstract: This invention provides a showerhead and method for allowing reaction gases to immediately mix upon release from gas outlets and minimize deposits of unwanted contaminants on the tip of a gas outlet and faceplate of the showerhead. A post having a central opening extends into the faceplate for emitting a first gas and is directly and circumferentially surrounded by an annular opening for emitting a second gas. The post may be recessed from, flush with or extend a distance past a frontal surface of the faceplate. A plurality of apertures, for emitting the second gas, may circumferentially surround the annular opening. The annular opening releases the second gas at a pressure and velocity sufficient to intermix with first gas released from the post while simultaneously forcing any unreacted gas and gaseous mixtures away from the tip of the post and frontal surface of the faceplate, thereby avoiding depositing contaminants thereon.

Abstract: The orientation of a wafer with respect to the surface of an electrolyte is controlled during an electroplating process. The wafer is delivered to an electrolyte bath along a trajectory normal to the surface of the electrolyte. Along this trajectory, the wafer is angled before entry into the electrolyte for angled immersion. A wafer can be plated in an angled orientation or not, depending on what is optimal for a given situation. Also, in some designs, the wafer's orientation can be adjusted actively during immersion or during electroplating, providing flexibility in various electroplating scenarios.