Abstract: A technique for refurbishing nozzle diaphragm sections of a gas turbine replaces an eroded section of the nozzle diaphragm with a replacement part designed to engage a slot machined in the nozzle diaphragm. The replacement part is formed of a material with capable of sustained exposure to higher temperature than the original eroded section, and with a similar coefficient of expansion as the material used for manufacture the original nozzle diaphragm. The combination of the nozzle diaphragm and the replacement part conform to the original manufacturer's dimensional specifications for the nozzle diaphragm.

Abstract: A technique for refurbishing nozzle diaphragm sections of a gas turbine replaces an eroded section of the nozzle diaphragm with a replacement part designed to engage a slot machined in the nozzle diaphragm. The replacement part is formed of a material with capable of sustained exposure to higher temperature than the original eroded section, and with a similar coefficient of expansion as the material used for manufacture the original nozzle diaphragm. The combination of the nozzle diaphragm and the replacement part conform to the original manufacturer's dimensional specifications for the nozzle diaphragm.

Abstract: A technique for refurbishing nozzle diaphragm sections of a gas turbine replaces an eroded section of the nozzle diaphragm with a replacement part designed to engage a slot machined in the nozzle diaphragm. The replacement part is formed of a material with capable of sustained exposure to higher temperature than the original eroded section, and with a similar coefficient of expansion as the material used for manufacture the original nozzle diaphragm. The combination of the nozzle diaphragm and the replacement part conform to the original manufacturer's dimensional specifications for the nozzle diaphragm.

Abstract: A technique for refurbishing nozzle diaphragm sections of a gas turbine replaces an eroded section of the nozzle diaphragm with a replacement part designed to engage a slot machined in the nozzle diaphragm. The replacement part is formed of a material with capable of sustained exposure to higher temperature than the original eroded section, and with a similar coefficient of expansion as the material used for manufacture the original nozzle diaphragm. The combination of the nozzle diaphragm and the replacement part conform to the original manufacturer's dimensional specifications for the nozzle diaphragm.

Abstract: A method and apparatus are provided for providing an electro-optic signal processing device. The method includes the steps of providing an optically trasparent substrate having first and second planar elements with an abutting common edge, the planar elements lying at differing angles with respect to each other about the common edge and a plurality of alignment apertures formed in the substrate. A plurality of optical devices of an optical array are disposed on the first planar element of the substrate, with transmission paths of the optical devices passing directly through the substrate. A signal processor is also disposed on the first planar element of the substrate. An optical fiber holder comprising a plurality of respective optical fibers and guide pin apertures disposed on a first surface of the optical fiber holder is aligned to the optical array using the guide pins and guide pin apertures.

Abstract: A method and apparatus are provided for optically interlocking a plug and receptacle combination. The method includes the steps of disposing an optical source and receiver in a sidewall of the receptacle with an axis of transmission from the optical source to the receiver directed into and across a plug space of the receptacle substantially perpendicular to an axis of insertion of the plug and activating the optical interlock when an optical signal from the optical source is detected by the optical receiver.

Abstract: A method and apparatus are provided for providing an electro-optic signal processing device. The method includes the steps of providing an optically trasparent substrate having first and second planar elements with an abutting common edge, the planar elements lying at differing angles with respect to each other about the common edge and a plurality of alignment apertures formed in the substrate. A plurality of optical devices of an optical array are disposed on the first planar element of the substrate, with transmission paths of the optical devices passing directly through the substrate. A signal processor is also disposed on the first planar element of the substrate. An optical fiber holder comprising a plurality of respective optical fibers and guide pin apertures disposed on a first surface of the optical fiber holder is aligned to the optical array using the guide pins and guide pin apertures.

Abstract: A method and apparatus are provided for aligning a set of connector guide pins to an optical array, The method comprises the steps of disposing the optical array on a transparent substrate such that an axis of transmission of the optical array passes directly through the transparent substrate, disposing a heatsink with a set of alignment guide pins on a rear surface of the optical array with the set of alignment guide pins extending through the transparent substrate on either side of the optical array, and slotting a set of holes where the set of alignment guide pins extends through the transparent substrate to allow for thermal expansion.

Abstract: A method and apparatus are provided for aligning an array of optical devices with optical processing equipment. The method includes the steps of providing a transparent substrate with a plurality of optical transmission paths passing directly through the substrate, providing a plurality of alignment guides on the optical array, providing a complementary plurality of respective alignment guides on the transparent substrate and guiding the optical devices of the array into alignment with the substrate using respective pairs of the alignment guides on the optical array and transparent substrate.

Abstract: A method and apparatus are provided for providing an electro-optic signal processing assembly. The method includes the steps of providing an optically transparent substrate with a plurality of alignment apertures formed in the substrate, disposing a guide pin in each of the plurality of alignment apertures, providing an optical device with a transmission path of the optical device passing directly through the body of the optically transparent substrate, aligning an optical fiber holder to the optical device using the guide pins and guide pin apertures, and coupling an optical signal of the optical device of the optical array to a respective optical fiber of the aligned optical fiber holder.

Abstract: A method and apparatus are provided for aligning a set of connector guide pins to an optical array, The method comprises the steps of disposing the optical array on a transparent substrate such that an axis of transmission of the optical array passes directly through the transparent substrate, disposing a heatsink with a set of alignment guide pins on a rear surface of the optical array with the set of alignment guide pins extending through the transparent substrate on either side of the optical array, and slotting a set of holes where the set of alignment guide pins extends through the transparent substrate to allow for thermal expansion.

Abstract: A method and apparatus are provided for aligning an array of optical devices with optical processing equipment. The method includes the steps of providing a transparent substrate with a plurality of optical transmission paths passing directly through the substrate, providing a plurality of alignment guides on the optical array, providing a complementary plurality of respective alignment guides on the transparent substrate and guiding the optical devices of the array into alignment with the substrate using respective pairs of the alignment guides on the optical array and transparent substrate.

Abstract: A method and apparatus are provided for aligning an array of optical devices with optical processing equipment. The method includes the steps of providing a transparent substrate with a plurality of optical transmission paths passing directly through the substrate, providing a plurality of alignment guides on the optical array, providing a complementary plurality of respective alignment guides on the transparent substrate and guiding the optical devices of the array into alignment with the substrate using respective pairs of the alignment guides on the optical array and transparent substrate.

Abstract: A method and apparatus are provided for aligning a set of connector guide pins to an optical array, The method comprises the steps of disposing the optical array on a transparent substrate such that an axis of transmission of the optical array passes directly through the transparent substrate, disposing a heatsink with a set of alignment guide pins on a rear surface of the optical array with the set of alignment guide pins extending through the transparent substrate on either side of the optical array, and slotting a set of holes where the set of alignment guide pins extends through the transparent substrate to allow for thermal expansion.

Abstract: A method and apparatus are provided for coupling an optical signal between an optical array and a flexible optical waveguide. The method includes the steps of disposing the optical array on an optically transparent substrate with an axis of transmission of an optically active element of the optical array passing directly through a body of the substrate, aligning a set of guide pins to the optically active element of the optical array, securing the aligned guide pins to the substrate and detachably coupling the flexible optical waveguide to the guide pins so that the axis of transmission of the optically active element is aligned with an axis of transmission of the flexible optical waveguide.

Abstract: A method and apparatus are provided for providing an electro-optic signal processing device. The method includes the steps of providing an optically transparent substrate having first and second planar elements with an abutting common edge, the planar elements lying at differing angles with respect to each other about the common edge and a plurality of alignment apertures formed in the substrate. A plurality of optical devices of an optical array are disposed on the first planar element of the substrate, with transmission paths of the optical devices passing directly through the substrate. A signal processor is also disposed on the first planar element of the substrate. An optical fiber holder comprising a plurality of respective optical fibers and guide pin apertures disposed on a first surface of the optical fiber holder is aligned to the optical array using the guide pins and guide pin apertures.

Abstract: A method and apparatus are provided for aligning a set of connector guide pins to an optical array, The method comprises the steps of disposing the optical array on a transparent substrate such that an axis of transmission of the optical array passes directly through the transparent substrate, disposing a heatsink with a set of alignment guide pins on a rear surface of the optical array with the set of alignment guide pins extending through the transparent substrate on either side of the optical array, and slotting a set of holes where the set of alignment guide pins extends through the transparent substrate to allow for thermal expansion.

Abstract: A method and apparatus are provided for optically interlocking a plug and receptacle combination. The method includes the steps of disposing an optical source and receiver in a sidewall of the receptacle with an axis of transmission from the optical source to the receiver directed into and across a plug space of the receptacle substantially perpendicular to an axis of insertion of the plug and activating the optical interlock when an optical signal from the optical source is detected by the optical receiver.

Abstract: A method and apparatus are provided for monitoring an optical signal from a solid state laser. The method includes the steps of providing a planar substrate defined by opposing planar surfaces and a substrate edge that together define a substrate volume that is transparent to an optical signal from the solid state laser, disposing the solid state laser on one of the opposing planar surfaces the planar substrate such that a first portion of the optical signal travels directly through the planar substrate substantially orthogonal to the opposing planar surfaces and a second portion of the optical signal is reflected between the opposing planar surfaces of the planar substrate and passes out of the substrate through the substrate edge, and disposing an optical detector proximate the edge of the planar substrate to detect the second portion of the optical signal.

Abstract: A method and apparatus are provided for providing an electro-optic signal processing device. The method includes the steps of providing an optically transparent substrate having first and second planar elements with an abutting common edge, the planar elements lying at differing angles with respect to each other about the common edge and a plurality of alignment apertures formed in the substrate. A plurality of optical devices of an optical array are disposed on the first planar element of the substrate, with transmission paths of the optical devices passing directly through the substrate. A signal processor is also disposed on the first planar element of the substrate. An optical fiber holder comprising a plurality of respective optical fibers and guide pin apertures disposed on a first surface of the optical fiber holder is aligned to the optical array using the guide pins and guide pin apertures.