Patents by Inventor Gary Yama
Gary Yama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120261822Abstract: In one embodiment, a method of forming an out-of-plane electrode includes providing an oxide layer above an upper surface of a device layer, providing a first cap layer portion above an upper surface of the oxide layer, etching a first electrode perimeter defining trench extending through the first cap layer portion and stopping at the oxide layer, depositing a first material portion within the first electrode perimeter defining trench, depositing a second cap layer portion above the first material portion, vapor releasing a portion of the oxide layer, depositing a third cap layer portion above the second cap layer portion, etching a second electrode perimeter defining trench extending through the second cap layer portion and the third cap layer portion, and depositing a second material portion within the second electrode perimeter defining trench, such that a spacer including the first material portion and the second material portion define out-of-plane electrode.Type: ApplicationFiled: September 14, 2011Publication date: October 18, 2012Applicant: Robert Bosch GmbHInventors: Andrew B. Graham, Gary Yama, Gary O'Brien
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Patent number: 8232143Abstract: A method of etching a device in one embodiment includes providing a silicon carbide substrate, forming a silicon nitride layer on a surface of the silicon carbide substrate, forming a silicon carbide layer on a surface of the silicon nitride layer, forming a silicon dioxide layer on a surface of the silicon carbide layer, forming a photoresist mask on a surface of the silicon dioxide layer, and etching the silicon dioxide layer through the photoresist mask.Type: GrantFiled: June 28, 2011Date of Patent: July 31, 2012Assignee: Robert Bosch GmbHInventor: Gary Yama
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Patent number: 8187903Abstract: A method of forming a device with a piezoresistor is disclosed herein. In one embodiment, the method includes providing a substrate, etching a trench in the substrate to form a vertical wall, growing a piezoresistor layer epitaxially on the vertical wall, and separating the vertical wall from an underlying layer of the substrate that extends along a horizontal plane such that the piezoresistor layer is movable with respect to the underlying layer within the horizontal plane.Type: GrantFiled: January 13, 2009Date of Patent: May 29, 2012Assignee: Robert Bosch GmbHInventors: Gary Yama, Beth Pruitt, Arnoldus Alvin Barlian
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Publication number: 20110254020Abstract: A method of etching a device in one embodiment includes providing a silicon carbide substrate, forming a silicon nitride layer on a surface of the silicon carbide substrate, forming a silicon carbide layer on a surface of the silicon nitride layer, forming a silicon dioxide layer on a surface of the silicon carbide layer, forming a photoresist mask on a surface of the silicon dioxide layer, and etching the silicon dioxide layer through the photoresist mask.Type: ApplicationFiled: June 28, 2011Publication date: October 20, 2011Applicant: ROBERT BOSCH GMBHInventor: Gary Yama
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Patent number: 7981308Abstract: A method of etching a device in one embodiment includes providing a silicon carbide substrate, forming a silicon nitride layer on a surface of the silicon carbide substrate, forming a silicon carbide layer on a surface of the silicon nitride layer, forming a silicon dioxide layer on a surface of the silicon carbide layer, forming a photoresist mask on a surface of the silicon dioxide layer, and etching the silicon dioxide layer through the photoresist mask.Type: GrantFiled: December 31, 2007Date of Patent: July 19, 2011Assignee: Robert Bosch GmbHInventor: Gary Yama
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Patent number: 7956428Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes a buried polysilicon layer and a “protective layer” deposited over the buried polysilicon layer to prevent possible erosion of, or damage to the buried polysilicon layer during processing steps. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits.Type: GrantFiled: August 16, 2005Date of Patent: June 7, 2011Assignee: Robert Bosch GmbHInventor: Gary Yama
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Publication number: 20110019337Abstract: A method for fabricating a pair of large surface area planar electrodes. The method includes forming a first template above a first substrate, the first template having a first plurality of pores, coating the first plurality of pores of the first template with a first layer of conducting material to form a first electrode, placing the first plurality of pores of the first electrode in proximity to a second electrode, thereby forming a gap between the first plurality of pores and the second electrode, and filling the gap with an electrolyte material.Type: ApplicationFiled: July 24, 2009Publication date: January 27, 2011Applicant: Robert Bosch GmbHInventors: Po-Jui Chen, Gary Yama, Matthieu Liger, Matthias Illing
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Patent number: 7875482Abstract: A method of forming a device with multiple encapsulated pressures is disclosed herein. In accordance with one embodiment of the present invention, there is provided a method of forming a device with multiple encapsulated pressures, including providing a substrate, forming a functional layer on top of a surface of the substrate, the functional layer including a first device portion at a first location, and a second device portion at a second location adjacent to the first location, encapsulating the functional layer, forming at least one diffusion resistant layer above the encapsulated functional layer at a location above the first location and not above the second location, modifying an environment adjacent the at least one diffusion resistant layer, and diffusing a gas into the second location as a result of the modified environment.Type: GrantFiled: March 19, 2009Date of Patent: January 25, 2011Assignee: Robert Bosch GmbHInventors: Robert N. Candler, Gary Yama
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Publication number: 20100263447Abstract: A tri-axis accelerometer includes a proof mass, at least four anchor points arranged in at least two opposite pairs, a first pair of anchor points being arranged opposite one another along a first axis, a second pair of anchor points being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another, and at least four spring units to connect the proof mass to the at least four anchor points, the spring units each including a pair of identical springs, each spring including a sensing unit.Type: ApplicationFiled: June 28, 2010Publication date: October 21, 2010Inventors: Zhiyu Pan, Christoph Lang, Gary Yama, Matthias Metz, Markus Ulm
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Publication number: 20100240163Abstract: A method of forming a device with multiple encapsulated pressures is disclosed herein. In accordance with one embodiment of the present invention, there is provided a method of forming a device with multiple encapsulated pressures, including providing a substrate, forming a functional layer on top of a surface of the substrate, the functional layer including a first device portion at a first location, and a second device portion at a second location adjacent to the first location, encapsulating the functional layer, forming at least one diffusion resistant layer above the encapsulated functional layer at a location above the first location and not above the second location, modifying an environment adjacent the at least one diffusion resistant layer, and diffusing a gas into the second location as a result of the modified environment.Type: ApplicationFiled: March 19, 2009Publication date: September 23, 2010Applicant: Robert Bosch GmbHInventors: Robert N. Candler, Gary Yama
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Patent number: 7757555Abstract: A tri-axis accelerometer includes a proof mass, at least four anchor points arranged in at least two opposite pairs, a first pair of anchor points being arranged opposite one another along a first axis, a second pair of anchor points being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another, and at least four spring units to connect the proof mass to the at least four anchor points, the spring units each including a pair of identical springs, each spring including a sensing unit.Type: GrantFiled: August 30, 2006Date of Patent: July 20, 2010Assignee: Robert Bosch GmbHInventors: Zhiyu Pan, Christoph Lang, Gary Yama, Matthias Metz, Markus Ulm
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Publication number: 20100176465Abstract: A method of forming a device with a piezoresistor is disclosed herein. In one embodiment, the method includes providing a substrate, etching a trench in the substrate to form a vertical wall, growing a piezoresistor layer epitaxially on the vertical wall, and separating the vertical wall from an underlying layer of the substrate that extends along a horizontal plane such that the piezoresistor layer is movable with respect to the underlying layer within the horizontal plane.Type: ApplicationFiled: January 13, 2009Publication date: July 15, 2010Applicants: Stanford University, Robert Bosch GmbHInventors: Gary Yama, Beth Pruitt, Arnoldus Alvin Barlian
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Patent number: 7750758Abstract: A system and method are provided which includes ring resonator structures coupled together with beam structure(s). The ring resonators are configured to operate in the contour or breathe mode. The center of the coupling beam structure is used as a nodal anchor point for anchoring the ring resonators and the beam structures, and also provides a reflecting interface. In an embodiment, the coupling beam structure includes two quarter-wavelength matched beams and an anchor located at a nodal point for coupling the two quarter-wavelength matched beams and ring resonator structures. The symmetric ring design also provides a differential drive and sense configuration while balancing the driving forces about the anchor located at the center of the beam structure. The system exhibits low energy losses while providing large sensing signals and a high quality factor (Q) of about 186,000 at a resonant frequency of about twenty-nine (29) MHz.Type: GrantFiled: September 5, 2007Date of Patent: July 6, 2010Assignee: Robert Bosch GmbHInventors: Pan Zhiyu, Robert Candler, Markus Lutz, Aaron Partridge, Gary Yama
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Patent number: 7671515Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes location of a piezoelectric material as part of a semiconductor sensing structure. The semiconductor sensing structure, in conjunction with the piezoelectric material, can be used as a sensing device to provide an output signal associated with a sensed event.Type: GrantFiled: November 7, 2006Date of Patent: March 2, 2010Assignee: Robert Bosch, GmbHInventors: Matthias Metz, Zhiyu Pan, Brian Stark, Markus Ulm, Gary Yama
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Patent number: 7625773Abstract: A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure.Type: GrantFiled: November 4, 2008Date of Patent: December 1, 2009Assignee: Robert Bosch GmbHInventors: Markus Lutz, Aaron Partridge, Wilhelm Frey, Markus Ulm, Matthias Metz, Brian Stark, Gary Yama
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Publication number: 20090166330Abstract: A method of etching a device in one embodiment includes providing a silicon carbide substrate, forming a silicon nitride layer on a surface of the silicon carbide substrate, forming a silicon carbide layer on a surface of the silicon nitride layer, forming a silicon dioxide layer on a surface of the silicon carbide layer, forming a photoresist mask on a surface of the silicon dioxide layer, and etching the silicon dioxide layer through the photoresist mask.Type: ApplicationFiled: December 31, 2007Publication date: July 2, 2009Applicant: Robert Bosch GmbHInventor: Gary Yama
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Publication number: 20090065928Abstract: A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure.Type: ApplicationFiled: November 4, 2008Publication date: March 12, 2009Inventors: Markus Lutz, Aaron Partidge, Wilhelm Frey, Markus Ulm, Matthias Metz, Brian Stark, Gary Yama
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Publication number: 20090058561Abstract: A system and method are provided which includes ring resonator structures coupled together with beam structure(s). The ring resonators are configured to operate in the contour or breathe mode. The center of the coupling beam structure is used as a nodal anchor point for anchoring the ring resonators and the beam structures, and also provides a reflecting interface. In an embodiment, the coupling beam structure includes two quarter-wavelength matched beams and an anchor located at a nodal point for coupling the two quarter-wavelength matched beams and ring resonator structures. The symmetric ring design also provides a differential drive and sense configuration while balancing the driving forces about the anchor located at the center of the beam structure. The system exhibits low energy losses while providing large sensing signals and a high quality factor (Q) of about 186,000 at a resonant frequency of about twenty-nine (29) MHz.Type: ApplicationFiled: September 5, 2007Publication date: March 5, 2009Applicants: Robert Bosch GmbH, The Board of Trustees of the Leland Stanford Junior UniversityInventors: Zhiyu Pan, Robert Candler, Markus Lutz, Aaron Partridge, Gary Yama
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Patent number: 7449355Abstract: A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure.Type: GrantFiled: April 27, 2005Date of Patent: November 11, 2008Assignee: Robert Bosch GmbHInventors: Markus Lutz, Aaron Partridge, Wilhelm Frey, Markus Ulm, Matthias Metz, Brian Stark, Gary Yama
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Patent number: 7401517Abstract: A dual-axis tuning fork gyroscope includes four open-ended tuning forks arranged coplanarly in two opposite pairs, a first pair of open-ended tuning forks being arranged opposite one another along a first axis, a second pair of open-ended tuning forks being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another. The four open-ended tuning forks are mechanically coupled together so that all four tuning forks vibrate in the same manner in terms of frequency and phase.Type: GrantFiled: August 18, 2006Date of Patent: July 22, 2008Assignee: Robert Bosch GmbHInventors: Zhiyu Pan, Christoph Lang, Gary Yama