Abstract: A low-cost and power-efficient communication system using digital frequency centering techniques suitable for millimeter-wave wide-bandwidth bands with mostly digital components. Significant circuitry in the frequency source can be switched-off, thus conserving power. With the use of non-coherent detection, power consumption can be further reduced as higher phase noise and lower frequency accuracy can be tolerated. In the first embodiment frequency centering is achieved with a multiple-state system which compares a frequency dependent unique state to a programmed or hardwired desired state. In an alternative embodiment this multiple-state system is implemented by means of a microcontroller through either software or hardware.

Abstract: A compact millimeter-wave transmitter and receiver make use of interconnections within a chip-containing package for providing an integrated antenna. Due to shorter wavelength of millimeter-waves, these interconnections can be used as antennas for radiation of electromagnetic waves. A dielectric cover or lens is provided within the package to increase the antenna's directivity and to provide a mechanical shield for the chip.

Abstract: A circuit topology in accordance with a system, method and device for an active power splitter with an input and at least two outputs which allows the use of negative feedback and thus improving stability and linearity without substantially increasing the noise figure of the system is provided.

Abstract: In wireless communication devices, internally matching impedance in millimeter wave packaging enables better signal retention at high frequencies in the range of 15 GHz and above. Through the use of differential wire bond signal transmission, the inherent inductance of a millimeter wave package can be matched by the capacitance of the package wire bonds if the capacitance is tailored. The capacitance can be tailored by calculating a suitable distance between wire bonds and tuning the dielectric constant of the over-mold material. A differential set of wire bonds act like a differential transmission line whose characteristic impedance can be tuned by configuring the dielectric constant of the over-mold of the millimeter wave package.

Abstract: Systems, devices and methods are disclosed for suppressing the 2LO frequency spur, output from a mixer. In various exemplary embodiments, a DC bias circuit is electrically connected to provide DC bias to one or more non-linear elements of the mixer. The biasing voltage is used to cause the current-voltage characteristics and/or junction capacitances between non-linear elements to be more symmetric and/or to suppress 2LO leakage currents that form 2LO frequency spurs at the output of the mixer. The non-linear elements may comprise one of: BJT's, diodes, and FET's. The mixer may be one of: a subharmonic mixer; a fundamental resistive mixer; a fundamental subharmonic transconductance mixer; and a fundamental transconductance mixer comprising an anti-parallel diode pair. The system may further be configured to automatically determine an appropriate DC bias voltage level that will improve one of the LO-IF isolation and the LO-RF isolation.

Abstract: Systems, devices, and methods are provided for actively biasing a multi-stage amplifier. A method for differentially actively biasing a multi-stage amplifier comprises the steps of: actively biasing, with a single active bias circuit, an amplifier comprising a plurality of amplification stages; and differentially applying the bias provided by the single active bias circuit by biasing at least one amplification stage at a different bias level than another of the plurality of amplification stages. An active bias circuit for a multi-stage amplifier comprises: a single active bias circuit that is configured to actively bias a plurality of amplification stages via at least two gates; and a differential device configured to cause the active biasing provided to one gate to be different from the bias provided to another gate.

Abstract: A MMIC (microwave monolithic integrated circuit) driver amplifier having a zig-zag RF signal flow and method for the same is provided. A smaller die size and higher output gain are realized with the improved amplification stage geometry provided herein. In particular, the stages are configured in a “stacked” topology permitting a zig-zag RF signal flow through the stages. Additionally, the DC bias circuitry may be centralized and adjacent stages may share vias. In particular, transistors, such as FETs (field effect transistors) are displaced from a conventional FET geometry with alternating FETs being rotated in opposite directions. The inputs (gate pads) and outputs (drain pads) of two adjacent FETs may be “shared.” In a shared input configuration, a compensation network may be coupled to the input. The improved amplifier configuration provides a multi-sectional configuration wherein one section may be the mirrored image of another. In a two section amplifier, the amplifier appears to be “folded.

Abstract: A MMIC (microwave monolithic integrated circuit) driver amplifier having a zig-zag RF signal flow and method for the same is provided. A smaller die size and higher output gain are realized with the improved amplification stage geometry provided herein. In particular, the stages are configured in a “stacked” topology permitting a zig-zag RF signal flow through the stages. Additionally, the DC bias circuitry may be centralized and adjacent stages may share vias. In particular, transistors, such as FETs (field effect transistors) are displaced from a conventional FET geometry with alternating FETs being rotated in opposite directions. The inputs (gate pads) and outputs (drain pads) of two adjacent FETs may be “shared.” In a shared input configuration, a compensation network may be coupled to the input. The improved amplifier configuration provides a multi-sectional configuration wherein one section may be the mirrored image of another.