Abstract: A composition and method for removing copper-containing post-etch and/or post-ash residue from patterned microelectronic devices is described. The removal composition includes water, a water-miscible organic solvent, an amine compound, an organic acid, and a fluoride ion source. The compositions effectively remove the copper-containing post-etch residue from the microelectronic device without damaging exposed low-k dielectric and metal interconnect materials.

Abstract: The present invention relates to an oral care composition comprising catechins. We have found that the catechins tend to darken the color of the chalk based toothpaste due to its oxidation which happens at the high pH of the toothpaste. Once the catechins are oxidized and darken the color of the toothpaste it is no longer available as such for providing anti-inflammatory benefits. It is an object of the invention to provide a chalk based toothpaste formulation which does not turn substantially dark due to oxidation of catechins. The present inventors while working with oral care compositions comprising catechins preferably green tea catechins for providing anti-inflammatory benefits, surprisingly found that some selected zinc salts when added in particular quantities do not result in darkening the color of the toothpaste, and also, when stored, are able to deliver green tea catechins.

Abstract: The present invention provides relates to an edible composition for anti-diabetic benefit. Diabetes is one of the major and commonly occurring health problems in today's world. Pharmaceuticals companies are very active in this field to develop new medicines for preventing and controlling diabetes. There are several medicines available in the market for the treatment of type 2 diabetes. There are also prior arts which describes composition for the prevention of glucose intolerance and/or diabetes. We have found that though prior that discloses compositions for prevention of glucose intolerance and/or diabetes, it is not that effective for preventing diabetes. The present inventors while working extensively for providing an edible composition for preventing diabetes have surprisingly found that a particular combination of Inula racemosa and theobromine is effective for controlling and/or preventive diabetes thereby satisfying one or more of the aforesaid objects.

Abstract: The present invention provides anti-diabetic composition comprising Inula racemosa extract and sitagliptin and a process for preparing the composition. The composition lowers blood sugar level and at the same time alleviates the negative allelo pathic effects resulting from the medication.

Abstract: A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equal or greater than 4. The solution can further comprise, a chelating agent, a defoaming agent, or a dispersing agent.

Abstract: Edible composition comprising theanine and an extract of inula racemosa, e.g. for stimulating adiponectin release in humans.

Abstract: The present invention provides relates to an edible composition for anti-diabetic benefit. Diabetes is one of the major and commonly occurring health problems in today's world. Pharmaceuticals companies are very active in this field to develop new medicines for preventing and controlling diabetes. There are several medicines available in the market for the treatment of type 2 diabetes. There are prior arts which describes composition and/or therapies for the prevention of glucose intolerance and/or diabetes. We have found that, though prior art discloses compositions and therapies for treating diabetes, there is not disclose any food composition which is effectively controls GLP-1 activity thereby control diabetes.

Abstract: The present invention relates to water-rich formulations and the method using same, to remove bulk photoresists, post-etched and post-ashed residues, residues from Al back-end-of-the-line interconnect structures, as well as contaminations. The formulation comprises: hydroxylamine; corrosion inhibitor containing a mixture of alkyl dihydroxybenzene and hydroxyquinoline; an alkanolamine, a water-soluble solvent or the combination of the two; and at least 50% by weight of water.

Abstract: A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition contains an abrasive, benzenesulfonic acid compound, a per-compound oxidizing agent, and water. The composition affords tunability of removal rates for metal, barrier layer materials, and dielectric layer materials in metal CMP processes. The composition is particularly useful in conjunction with the associated method for metal CMP applications (e.g., step 2 copper CMP processes).

Abstract: The present invention provides relates to an edible composition for anti-diabetic benefit. Diabetes is one of the major and commonly occurring health problems in today's world. Pharmaceuticals companies are very active in this field to develop new medicines for preventing and controlling diabetes. There are several medicines available in the market for the treatment of type 2 diabetes. There are also prior arts which describes composition for the prevention of glucose intolerance and/or diabetes. We have found that though prior that discloses compositions for prevention of glucose intolerance and/or diabetes, it is not that effective for preventing diabetes. The present inventors while working extensively for providing an edible composition for preventing diabetes have surprisingly found that a particular combination of Inula racemosa and theobromine is effective for controlling and/or preventive diabetes thereby satisfying one or more of the aforesaid objects.

Abstract: A water-rich hydroxylamine formulation for photoresist and post-etch/post-ash residue removal in applications wherein a semiconductor substrate comprises aluminum. The cleaning composition comprises from about 2 to about 15% by wt. of hydroxylamine; from about 50 to about 80% by wt. of water; from about 0.01 to about 5.0% by wt. of a corrosion inhibitor; from about 5 to about 45% by wt. of a component selected from the group consisting of: an alkanolamine having a pKa<9.0, a water-miscible solvent, and a mixture thereof. Employment of such composition exhibits efficient cleaning capability for Al substrates, minimal silicon etch while protecting aluminum for substrates comprising both materials.

Abstract: A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equal or greater than 4. The solution can further comprise, a chelating agent, a defoaming agent, or a dispersing agent.

Abstract: The present invention is a method of cleaning to removal residue in semiconductor manufacturing processing, comprising contacting a surface to be cleaned with an aqueous formulation having a polymer selected from the group consisting of acrylamido-methyl-propane sulfonate) polymers, acrylic acid-2-acrylamido-2-methylpropane sulfonic acid copolymer and mixtures thereof and a quaternary ammonium hydroxide having greater than 4 carbon atoms or choline hydroxide with a non-acetylinic surfactant. The present invention is also a post-CMP cleaning formulation having the components set forth in the method above.

Abstract: A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equal or greater than 4. The solution can further comprise, a chelating agent, a defoaming agent, or a dispersing agent.

Abstract: The present invention relates to an oral care composition comprising catechins. We have found that the catechins tend to darken the colour of the chalk based toothpaste due to its oxidation which happens at the high pH of the toothpaste. Once the catechins are oxidized and darken the colour of the toothpaste it is no longer available as such for providing anti-inflammatory benefits. It is an object of the invention to provide a chalk based toothpaste formulation which does not turn substantially dark due to ox illation of catechins. The present inventors while working with oral care compositions comprising catechins preferably green tea catechins for providing anti-inflammatory benefits, surprisingly found that some selected zinc salts when added in particular quantities do not result in darkening the colour of the toothpaste, and also, when stored, are able to deliver green tea catechins.

Abstract: A composition and method for removing copper-containing post-etch and/or post-ash residue from patterned microelectronic devices is described. The removal composition includes water, a water-miscible organic solvent, an amine compound, an organic acid, and a fluoride ion source. The compositions effectively remove the copper-containing post-etch residue from the microelectronic device without damaging exposed low-k dielectric and metal interconnect materials.

Abstract: The present invention relates to water-rich formulations and the method using same, to remove bulk photoresists, post-etched and post-ashed residues, residues from Al back-end-of-the-line interconnect structures, as well as contaminations. The formulation comprises: hydroxylamine; corrosion inhibitor containing a mixture of alkyl dihydroxybenzene and hydroxyquinoline; an alkanolamine, a water-soluble solvent or the combination of the two; and at least 50% by weight of water.

Abstract: The present invention relates to water-rich formulations and the method using same, to remove bulk photoresists, post-etched and post-ashed residues, residues from Al back-end-of-the-line interconnect structures, as well as contaminations. The formulation comprises: hydroxylamine; corrosion inhibitor containing a mixture of alkyl dihydroxybenzene and hydroxyquinoline; an alkanolamine, a water-soluble solvent or the combination of the two; and at least 50% by weight of water.

Abstract: A water-rich hydroxylamine formulation for photoresist and post-etch/post-ash residue removal in applications wherein a semiconductor substrate comprises aluminum. The cleaning composition comprises from about 2 to about 15% by wt. of hydroxylamine; from about 50 to about 80% by wt. of water; from about 0.01 to about 5.0% by wt. of a corrosion inhibitor; from about 5 to about 45% by wt. of a component selected from the group consisting of: an alkanolamine having a pKa<9.0, a water-miscible solvent, and a mixture thereof. Employment of such composition exhibits efficient cleaning capability for Al substrates, minimal silicon etch while protecting aluminum for substrates comprising both materials.

Abstract: The present invention provides for use of a composition comprising black tea flavonoids as a prebiotic and/or for the treatment or prevention of conditions associated with poor gut health or low immunity. The flavonoids comprise thearubigin in an amount of at least 82% by weight of the tea flavonoids. Also provided is an edible product comprising the black tea flavonoids.