Abstract: Aspects of regional vehicle assembly are disclosed. A system of regional vehicle assembly includes a regional site, an assembly point-of-sale, and a sales/service point-of-sale. A method comprises aggregating confirmed vehicle orders from the points-of sale; arranging the manufacturing and assembling of a primary vehicle structure and an exterior and interior component at the regional site, based in part on the type of the confirmed vehicle orders, and arranging the delivery of the primary vehicle structure and exterior and interior components to the assembly point-of sale. The method can further include coordinating the assembly point-of-sale to assemble the confirmed vehicle orders.

Abstract: A lithographic apparatus includes a clamp (406) configured to receive an object (402). The clamp defines at least one channel (408) configured to pass a fluid at a first fluid temperature. The lithographic apparatus also includes a chuck (404) coupled to the clamp. The chuck (404) defines at least one void (464) configured to thermally insulate the chuck from the clamp.

Abstract: A lithographic apparatus includes a clamp (406) configured to receive an object (402). The clamp defines at least one channel (408) configured to pass a fluid at a first fluid temperature. The lithographic apparatus also includes a chuck (404) coupled to the clamp. The chuck (404) defines at least one void (464) configured to thermally insulate the chuck from the clamp.

Abstract: A system and method for regional manufacture and assembly of vehicles and vehicle structures. The method includes manufacturing a vehicle structure (BIW) at regional locations, delivery of vehicle structure to points of sale (POS), delivery of remainder of vehicle parts and components to POS, installing vehicle structure into a production vehicle, completing assembly of production vehicle, and final testing of production vehicle for sale.

Abstract: A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.

Abstract: A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.

Abstract: A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.

Abstract: A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.

Abstract: A formulation for anaesthetic use is described. The formulation contains propofol, and may be used to induce and/or maintain anaesthesia or sedation in a vertebrae. The formulation additionally contains a solvent or a combination of solvents and is suitable for mixing with commonly used infusion fluids prior to injection in to a patient. The formulation may be terminally sterilised using moist heat in order to assure sterility, and contains no lipid, thereby avoiding complications associated with administration over prolonged periods of time, or to patients with disorders of fat metabolism.

Abstract: An electromagnetic sub-stage and an electromagnetic monolithic stage coupled such that one follows the other having a single reference surface positioned therebetween. A sub-stage having linear motors for movement in the X-Y direction is mounted by a U bracket to a monolithic stage. The monolithic stage is suspended by flat electromagnetic coils providing precise motion of the body of the monolithic stage in X, Y, Z, and rotation about the Z axis or .theta.. Follow control means links or tracks the movement of the monolithic stage to the sub-stage such that the monolithic stage positioning coils are centered in their respective magnetic structure. Adjustable mechanical stops attached the monolithic stage in combination with air bearings riding on the reference surface limit travel of the monolithic stage in the focus or Z direction. The single reference surface extends over the entire range of motion of the monolithic stage. This improves position accuracy, and cleaning and servicing of the apparatus.

Abstract: Method and apparatus are disclosed for speeding up reticle changes during the production of semiconductor wafers under those circumstances wherein three reticles are employed, one (C) having a substantially longer exposure period than the others (A, B). The wafer is exposed to the reticles in the sequence ACB-BCA-ACB, etc.

Abstract: A lithographic apparatus includes a clamp (406) configured to receive an object (402). The clamp defines at least one channel (408) configured to pass a fluid at a first fluid temperature. The lithographic apparatus also includes a chuck (404) coupled to the clamp. The chuck (404) defines at least one void (464) configured to thermally insulate the chuck from the clamp.