Abstract: The present invention relates to a thermoplastic molding composition comprising: A mixture of at least one polyamide A1, at least one polyphenylene ether A2 and optionally a compatibilizer A3 and optionally an olefinic and/or vinylaromatic polymer A4; B 10 to 60% by weight of glass filler, the glass composition of which comprises at least 10% by weight of boron oxide and at most 15% by weight for the sum of magnesium oxide and calcium oxide; C 1 to 8% by weight of LDS additive; D 0 to 5% by weight of additives other than components A, B and C; wherein 80 to 100% by weight of mixture A consists of a mixture M of components A1, A2 and A3 and 0 to 20% by weight of component A4, in each case based on the sum of components M and A4, and wherein the sum of components M and A4 gives 100% by weight of mixture A, and wherein 36 to 92% by weight of mixture M is of component A2, from 8 to 60% by weight of component A1 and from 0 to 4% by weight of component A3, based in each case on the sum of components A1 to A3, and

Abstract: A multi-layer composite in the form of a hollow body enclosing an interior space (2) is proposed, consisting of three or four layers: an inner layer (3) adjoining the interior space (2), a middle layer (4) adjoining the latter and an outer layer (5) adjoining the middle layer (4) and closing the multi-layer composite (1) to the outside. If necessary, there is a further innermost layer (8) which directly adjoins the said inner layer (3) and is equipped with a conductive finish. The inner layer (3) is based on polyamide 6, the middle layer (4) is based on EVOH, and the outer layer (5) is based on a mixture of (A) polyamide 6 and (B) at least one other polyamide selected from the following group: polyamide 612, polyamide 614, polyamide 616 and polyamide 618.

Abstract: The present invention relates to polyamide molding compounds which contain the following components (A) to (C) or consist of these components: (A) 50 to 98% by weight of at least one amorphous or microcrystalline specific polyamide; (B) 2 to 40% by weight of at least one semi-crystalline polyamide which is selected from the group consisting of PA 616, PA 516, PA 1016 and mixtures thereof; and (C) 0 to 16% by weight of at least one additive; the constituent amounts of the components (A) to (C) adding up to 100% by weight. The present invention also relates to molded articles made of these polyamide molding compounds and the use thereof.

Abstract: The present invention relates to a thermoplastic molding composition comprising: A mixture of at least one polyamide A1, at least one polyphenylene ether A2 and optionally a compatibilizer A3 and optionally an olefinic and/or vinylaromatic polymer A4; B 10 to 60% by weight of glass filler, the glass composition of which comprises at least 10% by weight of boron oxide and at most 15% by weight for the sum of magnesium oxide and calcium oxide; C 1 to 8% by weight of LDS additive; D 0 to 5% by weight of additives other than components A, B and C; wherein 80 to 100% by weight of mixture A consists of a mixture M of components A1, A2 and A3 and 0 to 20% by weight of component A4, in each case based on the sum of components M and A4, and wherein the sum of components M and A4 gives 100% by weight of mixture A, and wherein 36 to 92% by weight of mixture M is of component A2, from 8 to 60% by weight of component A1 and from 0 to 4% by weight of component A3, based in each case on the sum of components A1 to A3, and

Abstract: The invention relates to a polyamide moulding compound consisting of an amorphous, microcrystalline or partially crystalline polyamide or mixtures hereof, at least one impact modifier, hollow glass balls and also further additives. The invention likewise relates to moulded articles produced from this polyamide moulding compound.

Abstract: A plastics line (1) is described with at least one layer (5) consisting of the following components: (A) 70-94 weight percent of a polyamide selected from the following group: polyamide 516, polyamide 616, polyamide 1016 or mixtures thereof; (B) 4-20 weight percent impact modifier; (C) 2-15 weight percent of plasticiser; (D) 0-5 weight percent of additives different from (B) and (C), wherein the sum of (A)-(D) is 100 weight percent, and with the proviso that layer (5) does not contain polyamide 6, as well as a method of manufacturing such a plastic pipe and uses of such a plastic pipe.

Abstract: A plastics line (1) is described with at least one layer (5) consisting of the following components: (A) 70-94 weight percent of a polyamide selected from the following group: polyamide 516, polyamide 616, polyamide 1016 or mixtures thereof; (B) 4-20 weight percent impact modifier; (C) 2-15 weight percent of plasticiser; (D) 0-5 weight percent of additives different from (B) and (C), wherein the sum of (A)-(D) is 100 weight percent, and with the proviso that layer (5) does not contain polyamide 6, as well as a method of manufacturing such a plastic pipe and uses of such a plastic pipe.

Abstract: Disclosed are polyamide moulding compounds having a relative permittivity of no more than 3.5 at 2.45 GHz, and having the following components: (A) 25 to 80% by weight of a mixture made of at least one partially crystalline aliphatic polyamide and at least one amorphous or microcrystalline polyamide, (B) 20 to 65% by weight of at least one glass filler, and (C) 0 to 10% by weight of additives, the sum of components (A), (B) and (C) producing 100% by weight. The polyamide moulding compounds are for use in components of devices such as laptops and mobile phones.

Abstract: The invention relates to the use of thermoplastic polyamide molding compounds to reduce the formation of solid deposits and/or coatings on tools used in thermoplastic shaping to form useful objects in discontinuous processes, in particular in injection molding, and used in continuous processes such as extrusion to form films, fibers, tubes and casings. The molding compounds used are based on polyamides which are largely based on the polyamide units (616, 516) or (916). By virtue of the use of the polyamide molding compounds according to the invention, the solid deposits and/or coatings that otherwise commonly occur in the further processing of polyamide (12) during injection molding or during extrusion, are greatly reduced or prevented.

Abstract: The present invention relates to polyamide molding compounds which contain the following components (A) to (C) or consist of these components: (A) 50 to 98% by weight of at least one amorphous or microcrystalline specific polyamide; (B) 2 to 40% by weight of at least one semi-crystalline polyamide which is selected from the group consisting of PA 616, PA 516, PA 1016 and mixtures thereof; and (C) 0 to 16% by weight of at least one additive; the constituent amounts of the components (A) to (C) adding up to 100% by weight. The present invention also relates to molded articles made of these polyamide molding compounds and the use thereof.

Abstract: The invention relates to polyamide moulding compounds containing the following components (A) to (D) or consisting of these components: (A) between 50 and 98 wt. % of at least one polyamide selected from the group consisting of PA 516, PA 616, PA 1016 and mixtures thereof; (B) between 0 and 30 wt. % of at least one polyamide selected from the group consisting of PA 11, PA 12, PA 416, PA 516, PA 69, PA 610, PA 612, PA 614, PA 616, PA 618, PA 816, PA 1010, PA 1012, PA 1014, PA 1016, PA 1018, PA 1212, PA 1216, PA 1218 and mixtures thereof; (C) between 2 and 25 wt. % of at least one specific impact modifier; and (D) between 0 and 20 wt. % of at least one additive; the sum of the constituent amounts of the components (A) to (D) amounting to 100 wt. %.

Abstract: The present invention relates to polyketone molding compounds based on partially crystalline, aliphatic polyketones. In particular, it relates to halogen-free, flameproof molding compounds based on aliphatic polyketones which preferably comprise salts of phosphinic acids as flame retardant. The molding compounds fulfill the fire protection classification V0 according to UL94 and display good mechanical properties. These molding compounds are suitable for the production of in particular thin-walled molded articles for the electrical and electronics industry, such as for example housings, housing components or connectors.

Abstract: A multi-layer composite in the form of a hollow body enclosing an interior space (2) is proposed, consisting of three or four layers: an inner layer (3) adjoining the interior space (2), a middle layer (4) adjoining the latter and an outer layer (5) adjoining the middle layer (4) and closing the multi-layer composite (1) to the outside. If necessary, there is a further innermost layer (8) which directly adjoins the said inner layer (3) and is equipped with a conductive finish. The inner layer (3) is based on polyamide 6, the middle layer (4) is based on EVOH, and the outer layer (5) is based on a mixture of (A) polyamide 6 and (B) at least one other polyamide selected from the following group: polyamide 612, polyamide 614, polyamide 616 and polyamide 618.

Abstract: Disclosed are polyamide moulding compounds having a relative permittivity of no more than 3.5 at 2.45 GHz, and having the following components: (A) 25 to 80% by weight of a mixture made of at least one partially crystalline aliphatic polyamide and at least one amorphous or microcrystalline polyamide, (B) 20 to 65% by weight of at least one glass filler, and (C) 0 to 10% by weight of additives, the sum of components (A), (B) and (C) producing 100% by weight. The polyamide moulding compounds are for use in components of devices such as laptops and mobile phones.

Abstract: A method for producing a laser-structurable component, wherein an extruded single- or multilayer molded part with at least one laser-structurable layer that forms an exposed surface of the molded part is applied onto the surface of a non-laser-structurable support element. Alternatively, the at least one laser-structurable layer may be back-molded with a non-laser-structurable thermoplastic support element so that at least one laser-structurable layer of the molded part forms at least one part of the surface of the laser-structurable component. The extruded single- or multilayer molded part is deep-drawn into the component. In the process, the laser-structurable layer of the molded part consists of a thermoplastic molding compound consisting of: (A) 30-99.9 wt. % of a thermoplastic consisting of polyamide; (B) 0.1-10 wt. % of an LDS additive; and (C) 0-60 wt. % of an additive material which is different from (A) and (B).

Abstract: Disclosed are polyamide moulding compounds having a relative permittivity of no more than 3.5 at 2.45 GHz, and having the following components: (A) 25 to 80% by weight of a mixture made of at least one partially crystalline aliphatic polyamide and at least one amorphous or microcrystalline polyamide, (B) 20 to 65% by weight of at least one glass filler, and (C) 0 to 10% by weight of additives, the sum of components (A), (B) and (C) producing 100% by weight. The polyamide moulding compounds are for use in components of devices such as laptops and mobile phones.

Abstract: The present invention relates to polyketone moulding compounds based on partially crystalline, aliphatic polyketones. In particular, it relates to halogen-free, flameproof moulding compounds based on aliphatic polyketones which preferably comprise salts of phosphinic acids as flame retardant. The moulding compounds fulfil the fire protection classification V0 according to UL94 and display good mechanical properties. These moulding compounds are suitable for the production of in particular thin-walled moulded articles for the electrical and electronics industry, such as for example housings, housing components or connectors.

Abstract: The present invention relates to polyketone moulding compounds based on partially crystalline, aliphatic polyketones. In particular, it relates to fibre-reinforced moulding compounds based on aliphatic polyketones which preferably comprise small quantities of phosphinic acid or the salts thereof. The moulding compounds are distinguished by improved mechanical properties and good processability in injection moulding. These moulding compounds are suitable for the production of in particular thin-walled moulded articles for the electrical and electronics industry, such as for example housings, housing components or connectors.

Abstract: Fillers are proposed, with the exception of layered silicates, which have a surface coating, which comprises a water-soluble polyamide or multiple water-soluble polyamides, wherein at least one of these water-soluble polyamides is produced by polycondensation from monomer components, which comprise at least one dicarboxylic acid and at least one selected ether diamine, preferably having linear oxypropyl amino end groups. Fillers coated in this manner are suitable for use in the production of filled and/or reinforced thermoplastic plastics molding materials. Thermoplastic plastics molding materials which contain fillers having such a surface coating have good mechanical properties and few emissions (low outgassing).

Abstract: The invention relates to a polyamide moulding compound consisting of an amorphous, microcrystalline or partially crystalline polyamide or mixtures hereof, at least one impact modifier, hollow glass balls and also further additives. The invention likewise relates to moulded articles produced from this polyamide moulding compound.