Abstract: A method for producing a laser-structurable component, wherein an extruded single- or multilayer molded part with at least one laser-structurable layer that forms an exposed surface of the molded part is applied onto the surface of a non-laser-structurable support element. Alternatively, the at least one laser-structurable layer may be back-molded with a non-laser-structurable thermoplastic support element so that at least one laser-structurable layer of the molded part forms at least one part of the surface of the laser-structurable component. The extruded single- or multilayer molded part is deep-drawn into the component. In the process, the laser-structurable layer of the molded part consists of a thermoplastic molding compound consisting of: (A) 30-99.9 wt. % of a thermoplastic consisting of polyamide; (B) 0.1-10 wt. % of an LDS additive; and (C) 0-60 wt. % of an additive material which is different from (A) and (B).

Abstract: The invention relates to polyamide sheet silicate compositions, containing an untreated clay mineral and a water-soluble polyamide, the concentration of the clay material being greater than 30% by weight. Furthermore the invention relates to nanocomposites which contain clay minerals distributed homogeneously in a water-insoluble thermoplastic matrix. These nanocomposites are produced by mixing the polyamide sheet silicate composition and a water-insoluble thermoplastic in the melt.

Abstract: Fillers are proposed, with the exception of layered silicates, which have a surface coating, which comprises a water-soluble polyamide or multiple water-soluble polyamides, wherein at least one of these water-soluble polyamides is produced by polycondensation from monomer components, which comprise at least one dicarboxylic acid and at least one selected ether diamine, preferably having linear oxypropyl amino end groups. Fillers coated in this manner are suitable for use in the production of filled and/or reinforced thermoplastic plastics molding materials. Thermoplastic plastics molding materials which contain fillers having such a surface coating have good mechanical properties and few emissions (low outgassing).

Abstract: The invention relates to a housing from a polyamide molding compound containing 70 to 99.5% by weight of at least one thermoplastic polyamide and 0.5 to 30% by weight of at least one polyamide oligomer with linear or branched chain structure with a number average molar mass of 800 to 5000 g/mol with basic end groups which are at least partially NH2 end groups, and carboxyl end groups, one of these end groups being present in excess and the concentration of the end group present in excess being at most 300 mmol/kg.

Abstract: A multilayer backsheet (1) for a photovoltaic module according to the invention comprises a first outside layer (2), a second outside layer (3) and at least one inside layer (4, 5) which is arranged between these outside layers (2, 3). This at least one inside layer (4, 5) forms a water-vapor barrier and/or oxygen barrier. All these layers (2, 3, 4, 5) are composed of polymers. The multilayer backsheet (1) for a photovoltaic module according to the invention is characterized in that at least one of the two outside layers (2, 3) comprises a polyamide, and that the at least one inside layer (4, 5) consists of polymers which are no fluoropolymers and do not comprise any polyethylene. Inside layers (4, 5) made of partly aromatic polyesters are used only in combination with at least one outside adhesion promoter layer (6) made of block copolyesteramide.

Abstract: The invention relates to thermoplastic polyamide moulding compositions containing: (A) at least 20% by wt. polyamide and/or at least one copolymer containing at least 20% by wt. polyamide structural units; (B) 0.01% by wt. to 2% by wt., relative to the polyamide portion and/or the portion of polyamide structural units, of the composition of a copper-containing stabiliser; and (C) 0.01% by wt. to 3% by wt., relative to the polyamide portion and/or the portion of polyamide structural units of the composition, of at least one organic compound containing metal complexing groups, so that the copper ions are present in complexed form through binding to the metal-complexing groups. These moulding compositions may be used as coating material for coolant lines.

Abstract: The present invention relates to reinforced polyamide molding materials with high notch impact strengths, comprising low viscous polyamides and flat glass fibers as a reinforcing medium, characterized in a polyamide matrix, comprising the following components: (A) 0 to 60 wt.-% of at least one aliphatic, partly crystalline polyamide with a solution viscosity, measured in m-cresol (0.5 wt-%), of ?rel less than 1.9, (B) 0 to 60 wt.-% of at least one amorphous or microcrystalline polyamide based on aliphatic, cycloaliphatic or aromatic diamines, dicarboxylic acids, lactams and/or aminocarboxylic acids, preferably with 6 to 36 carbon atoms, or a mixture of such homopolyamides and/or copolyamides, wherein the components (A) and (B) fulfill the condition: (A)+(B)=20 to 60 wt.-% and that, in the case of a mixture of components (A) and (B), at least 50 weight parts aliphatic blocks (A) are present in the mixture, and a filler component, comprising: (C) 40 to 80 wt.

Abstract: The invention relates to polyamide-elastomer mixtures with an improved hydrolysis resistance. In this case, the elastomer is present in particular in the form of a microgel. The polyamide-elastomer mixtures according to the invention can be processed into molded articles that are used, for example, in the automobile industry, in particular as media-conducting conduits.

Abstract: Moulded articles having reduced surface carbonization and longer retention of the mechanical properties and methods of producing same are presented. In an embodiment, the moulded article comprises polyamides with nanofillers, which can be produced by means of injection moulding or extrusion, in particular by extrusion blow moulding, coextrusion blow moulding or sequential blow moulding with and without 3D hose manipulation. For example, the polyamide moulding materials for the production of moulded articles have reduced surface carbonization in the moulded articles in subsequent long-term use at elevated temperatures.

Abstract: The invention relates to a polyamide moulding compound containing 70 to 99.5% by weight of at least one thermoplastic polyamide and 0.5 to 30% by weight of at least one polyamide oligomer with linear or branched chain structure with a number average molar mass of 800 to 5000 g/mol with basic end groups which are at least partially NH2 end groups, and carboxyl end groups, one of these end groups being present in excess and the concentration of the end group present in excess being at most 300 mmol/kg.

Abstract: Relates to mono-backsheets for photovoltaic modules. These mono-backsheets are produced or producible from a molding compound, this molding compound being based on at least one polyamide. The photovoltaic module mono-backsheet according to the invention is characterized in that the at least one polyamide is synthesized from linear and/or branched aliphatic and/or cycloaliphatic monomers, which have an average of at least 8 and at most 17 carbon atoms. The monomers are selected from the group which comprises diamines, dicarboxylic acids, lactams, and amino carboxylic acids, as well as mixtures thereof. The polyamides PA 610 and PA 612 are excluded from the present invention, and the polyamides based on lactams and amino carboxylic acids are cross-linked.

Abstract: The invention relates to polyamide sheet silicate compositions, containing an untreated clay mineral and a water-soluble polyamide, the concentration of the clay material being greater than 30% by weight. Furthermore the invention relates to nanocomposites which contain clay minerals distributed homogeneously in a water-insoluble thermoplastic matrix. These nanocomposites are produced by mixing the polyamide sheet silicate composition and a water-insoluble thermoplastic in the melt.

Abstract: Moulding compound, comprising 30 to 80% by weight of a polyamide as a thermoplastic matrix and of a cross-linked, disperse elastomer phase which is bonded to the thermoplastic matrix and contains 10 to 69% by weight of an ethylene copolymer and also 1 to 10% by weight of a compatibility agent, selected from the compounds obtained by means of grafting of ?, ?, ethylene-unsaturated mono- and/or dicarboxylic acids or derivatives thereof on an ethylene-copolymer-polymer backbone, respectively relative to the moulding compound.

Abstract: The invention relates to a housing from a polyamide moulding compound containing 70 to 99.5% by weight of at least one thermoplastic polyamide and 0.5 to 30% by weight of at least one polyamide oligomer with linear or branched chain structure with a number average molar mass of 800 to 5000 g/mol with basic end groups which are at least partially NH2 end groups, and carboxyl end groups, one of these end groups being present in excess and the concentration of the end group present in excess being at most 300 mmol/kg.

Abstract: The present invention relates to reinforced polyamide molding materials with high notch impact strengths, comprising low viscous polyamides and flat glass fibers as a reinforcing medium, characterized in a polyamide matrix, comprising the following components: (A) 0 to 60 wt.-% of at least one aliphatic, partly crystalline polyamide with a solution viscosity, measured in m-cresol (0.5 wt-%), of ?rel less than 1.9, (B) 0 to 60 wt.-% of at least one amorphous or microcrystalline polyamide based on aliphatic, cycloaliphatic or aromatic diamines, dicarboxylic acids, lactams and/or aminocarboxylic acids, preferably with 6 to 36 carbon atoms, or a mixture of such homopolyamides and/or copolyamides, wherein the components (A) and (B) fulfill the condition: (A)+(B)=20 to 60 wt.-% and that, in the case of a mixture of components (A) and (B), at least 50 weight parts aliphatic blocks (A) are present in the mixture, and a filler component, comprising: (C) 40 to 80 wt.

Abstract: Moulded articles having reduced surface carbonization and longer retention of the mechanical properties and methods of producing same are presented. In an embodiment, the moulded article comprises polyamides with nanofillers, which can be produced by means of injection moulding or extrusion, in particular by extrusion blow moulding, coextrusion blow moulding or sequential blow moulding with and without 3D hose manipulation. For example, the polyamide moulding materials for the production of moulded articles have reduced surface carbonization in the moulded articles in subsequent long-term use at elevated temperatures.

Abstract: The present invention relates to the use of thermoplastic polyamide moulding compositions with reduced or strongly reduced formation of solid deposits and/or coverings during a thermoplastic conversion into commodity goods in discontinuous processes in particular injection moulding, and continuous processes such as the extrusion of films, fibers, tubes and jacketings containing at least 20% by weight polyamide and/or at least one copolymer with at least 20% by weight polyamide components.

Abstract: Two-layered or three-layered polymer tubing for use as a pressurized fluid conduit in automobiles can be either walled or have walls continuously or partially corrugated. The tubing has an outer layer of a hard polymer molding material and an inner layer of a soft rubber-like polymer or a polymer mixture. The inner layer can be provided on the innerside with a layer of a thermoplastic adhesion-modified elastomer composition. The a materials are selected for the layers to provide a so-called “hard-soft-combination”. The rubber-like polymer composition has a hardness in the range of 30 Shore A to 60 Shore D, especially of about 30 Shore A to 90 Shore A, the compositions being selected so that they are processable by coextrusion or the so-called conex method and adhere directly to each other non-positively or positively fitted, i. e. without additional bonding agent, without delaminating.

Abstract: The invention relates to thermoplastic polyamide moulding compositions containing: (A) at least 20% by wt. polyamide and/or at least one copolymer containing at least 20% by wt. polyamide structural units; (B) 0.01% by wt. to 2% by wt., relative to the polyamide portion and/or the portion of polyamide structural units, of the composition of a copper-containing stabiliser; and (C) 0.01% by wt. to 3% by wt., relative to the polyamide portion and/or the portion of polyamide structural units of the composition, of at least one organic compound containing metal complexing groups, so that the copper ions are present in complexed form through binding to the metal-complexing groups. These moulding compositions may be used as coating material for coolant lines.

Abstract: The invention concerns anti-static, peroxide-stable molding compounds on the basis of polyamides and/or polyesters, whereby the molding compounds are modified with very pure conductive carbon black with a low specific surface area. These anti-static molding compounds can be used for the production of injection-molded or extruded parts and the production of sheets or multi-layer hoses and tubes.