Abstract: A combination of a fastener and a thermal-conducting member is mounted on an electronic heat-generating member. The fastener includes a plate provided with an opening for allowing the electronic heat-generating element to be disposed therein; posts connected to the plate and formed around the opening; and clamping arms extending from the plate opposite to the posts. The thermal-conducting member is disposed on the plate to span the opening. The clamping arms are bent to press in the thermal-conducting member, thereby forming on the surface of the thermal-conducting member with a plurality of positioning notches for allowing the clamping arms to be inserted therein. With this arrangement, the fastener can be combined with the thermal-conducting member tightly. Thus, the heat generated by the electronic heat-generating element can be continuously conducted to the outside, so that the temperature of the electronic heat-generating element can be kept in a normal range.

Abstract: A heat pipe includes a metal pipe, a flexible structure, a woven mesh, a working fluid, and a support element. The flexible structure is formed on the metal pipe, and the woven mesh is disposed inside the metal pipe, and the working fluid is filled into the metal pipe and attached onto the woven mesh, and the support element is passed into the woven mesh, such that the heat pipe can be bent into a desired shape manually by an easy way according to actual using requirements.

Abstract: A buckling device for electronic heating element, inter-assembled with a thermally conductive body, includes a cooling plate, a pair of fixing legs bent-and-extended from the cooling plate and formed under the cooling plate and a fixing arm bent-and-extended from the cooling plate and formed under the cooling plate. On the cooling plate, a plurality of slots are stamped, one side of each of which is bent and configured into a cooling piece. The thermally conductive body is fixed by being sandwiched between the fixing arm and the cooling plate. Thereby, the buckling device can be used in a thin electronic device to reduce its assembly and machining costs on a large scale.

Abstract: The heat dissipation module includes a heat dissipation assembly and a heat conducting element. The heat dissipation assembly includes a cylinder provided with a central hole. The central hole tapers off inwards to form two corresponding inclined surfaces. The heat conducting element, which is accommodated in the central hole, has a heat-absorbing section and two heat-releasing sections extending from the heat-absorbing section and being in contact with the inclined surfaces.

Abstract: The planar heat pipe includes a metallic tube composed of two flat extensions and a shrinked intermediate structure, a wick structure, a working fluid and a support element. The flat extensions are separately located at two ends of the metallic tube. The intermediate structure connects between the flat extensions. The wick structure is arranged in the metallic tube. The working fluid is injected in the metallic tube and attached in the wick structure. The support element is disposed in the metallic tube for supporting the wick structure.

Abstract: A heat sink includes a frame, a vapor chamber fixed to the frame, and a heat-dissipating plate adhered to one surface of the vapor chamber. The heat-dissipating plate has a first heat-dissipating fins region and a second heat-dissipating fins region. The first heat-dissipating fins region and the second heat-dissipating fins region are composed of a plurality of first heat-dissipating fins and a plurality of second heat-dissipating fins that are arranged at intervals, respectively. The pitch of the first heat-dissipating fins in the first heat-dissipating fins region is smaller than that of the second heat-dissipating fins in the second heat-dissipating fins region. By this arrangement, airflow can flow freely among the respective heat-dissipating fins. The first heat-dissipating fins region is used to dissipate a great amount of heat, while the second heat-dissipating fins region is used to exhaust the air rapidly. Thus, the heat-dissipating efficiency can be increased.

Abstract: A vapor chamber having supporting structure with height difference, includes a shell, tissue wick structure, working fluid filled into the shell and supporting structure with height difference, disposed over inner walls of the shell, accommodated in the shell, abutted against the wick structure, and including first corrugated piece and second corrugated piece, both of which are connected to each other. The longitudinal distance between top and bottom of the first corrugated piece is a first amplitude. The longitudinal distance between top and bottom of the second corrugated piece is a second amplitude larger than the first amplitude. Since the second amplitude provides the shell with greater supporting force, when the shell is pressed to make heating element and the shell contact closely, a recessing phenomenon won't occur to the shell, thereby, increasing the contact tightness and promoting the thermally conductive efficiency.

Abstract: A thermally conductive structure of a light emitting diode (LED) includes a vapor chamber, an insulating layer, an electrically conductive layer and a plurality of LEDs. In the invention, the insulating layer is plated over a surface of the vapor chamber; the electrically conductive layer disposed on the insulating layer is electrically separated from the vapor chamber and has a first electrode and a second electrode; and the LEDs arranged on the insulating layer respectively have a first leg connected to the first electrode and a second leg connected to the second electrode; thereby, the invention has an excellent performance of thermal conduction and heat dissipation, which is capable of prolonging the lifespan of LED.

Abstract: A vapor chamber with separator includes shell, capillary tissue, separator, supporting structure and working fluid. The shell includes inter-sealed lower and upper shell plates. Partial section of the lower shell plate projects downwardly and forms accommodating room therein. The capillary tissue is arranged by distributing over inner wall of the lower shell plate. The separator overlapped the capillary tissue is arranged penetrating trough corresponding to the accommodating room. Liquid passage is formed between the lower shell plate and the separator. The supporting structure is accommodated in the shell with upper and lower sides respectively inter-abutted against the upper shell plate and the separator. Vapor passage formed between the upper shell plate and the separator is communicated to the liquid passage. The working fluid is filled into the shell. Since the vapor and liquid working fluids are separated by the separator to avoid interference, the cooling performance is thus boosted.

Abstract: A heat dissipating module embedded into an LED lamp house for dissipating heat of an LED light emitting element includes two flat heat pipes, a heat dissipating body and a conducting base. The heat dissipating body includes a cylindrical pillar, heat sinks radially formed around the cylindrical pillar, two longitudinal through grooves at the cylindrical pillar for passing a condensation section of the flat heat pipe. The conducting base includes corresponding first and second surfaces, and the first surface is attached to an evaporation section of the flat heat pipe, and the second surface is attached to the LED light emitting element. The conducting base perpendicular to an axis of the cylindrical pillar includes an embedding slot for embedding the heat dissipating module into an internal wall of the lamp house, such that the heat dissipating module can quickly dissipate the heat generated by the LED light emitting element.

Abstract: A tower type heat dissipating structure is applied to dissipate the heat of a solar power system. The solar power system is provided with a reflector having a hemispheric surface for reflecting the sunlight to a solar cell. The heat dissipating structure comprises a heat-conducting plate, a plate type heat pipe and a plurality of heat dissipating fins. One side of the heat-conducting plate is connected with the solar cell, and the other side is provided with a groove for being embedded an end of the plate type heat pipe. The heat dissipating fins is arranged with an inclination angle against the plate type heat pipe that can promote the heated air within the gaps to rise. The heat is rapidly conduced to prevent the solar cell from being destroyed by overheating for reducing the repairing costs.

Abstract: A heat dissipating structure is capable of dissipating heat quickly in a high power LED projector lamp to improve the heat dissipating efficiency. The structure includes a heat-conducting plate, a plate type heat pipe and a plurality of heat dissipating fins. One side of the heat-conducting plate provides a plurality of grooves for mounting one end of the plate type heat pipe, wherein those two are perpendicular to each other. Furthermore, the heat dissipating fins having a plurality of slots are stacked and arranged at intervals for disposing the plate type heat pipe with an inclined angle. Hence, the heat generated from the high power LED will be conducted quickly and the heat dissipating efficiency will be improved.

Abstract: A non-flat vapor chamber includes a casing, a capillary tissue, a stiffening plate, a support structure and a working fluid. The casing includes a lower case plate and an upper case plate sealed with the lower case plate. The lower case plate has a partial area protruded downward to form a chamber and a retaining portion formed within the chamber. A capillary tissue is installed on internal walls of the upper and lower case plates. The stiffening plate with a through hole is installed onto the retaining portion, and the casing contains a support structure. Upper and lower ends of the support structure abut the capillary tissue and the stiffening plate. A working fluid is filled into the casing, such that a support action is provided by pressing the stiffening plate at the retaining portion for stiffening the upper case plate of a vacuumed vapor chamber.

Abstract: A vapor chamber with a wick structure of different thickness includes a casing, a wick structure, a supporting body and a working fluid. The casing has a chamber. The wick structure is adhered to the inner wall of the chamber. The wick structure has a first wick section and a second wick section extending from the first wick structure. The thickness of the first wick section is larger than that of the second wick section. The supporting body is received within the wick structure. The working fluid is filled within the chamber. Via the above arrangement, the heat-conducting efficiency can be increased while the cost can be reduced.

Abstract: A thermally conductive structure of a light emitting diode (LED) includes a vapor chamber, an insulating layer, an electrically conductive layer and a plurality of LEDs. In the invention, the insulating layer is plated over a surface of the vapor chamber; the electrically conductive layer disposed on the insulating layer is electrically separated from the vapor chamber and has a first electrode and a second electrode; and the LEDs arranged on the insulating layer respectively have a first leg connected to the first electrode and a second leg connected to the second electrode; thereby, the invention has an excellent performance of thermal conduction and heat dissipation, which is capable of prolonging the lifespan of LED.

Abstract: A vapor chamber is provided to include shell, capillary tissue, working fluid, heat-absorbing section and heat-releasing section. A hollow chamber is formed in the shell. The capillary tissue is arranged and accommodated in the hollow chamber. The working fluid is injected into and filled in the hollow chamber. Two corresponding surfaces of the shell at the heat-releasing section are respectively a non-planar shape. Because the two corresponding surfaces of the shell at the heat-releasing section are respectively a non-planar shape, the structure strength of the vapor chamber is higher and the anti-deforming ability is superior, thereby the using life of the vapor chamber being prolonged. In addition, the vapor chamber can be combined with cooling fins to become a cooling device.

Abstract: A memory heat dissipating structure clamped on a surface of a memory module includes two heat dissipating plates and two uniform temperature plates. The uniform temperature plate includes first and second surfaces. The first surface of the uniform temperature plate is attached to an internal side of the heat dissipating plate, and the second surface of the uniform temperature plate is attached to the memory module. At least one heat dissipating body is installed on the memory module and clamped between the two heat dissipating plates and the two uniform temperature plates. The heat dissipating body includes a base and heat dissipating fins extended from the base. The base forms a straight section attached onto the second surface of the uniform temperature plate. The two heat dissipating plates are clamped and fixed by fixing elements. The structure of the invention can improve the heat dissipating effect of the memory module.

Abstract: A heat dissipation device includes a vapor chamber, a heat dissipating fins assembly, a cover and a fan. The vapor chamber is configured to a bent shape. The heat dissipating fins assembly is adhered to a partial surface of the vapor chamber. The cover is connected to the vapor camber. A flow passage is defined between the vapor chamber and the cover. The heat dissipating fins assembly is positioned in the flow passage. The cover defines an opening communicating to the flow passage. The fan is arranged facing to the opening of the cover and other partial surface of the vapor chamber. Therefore, the heat dissipating efficiency can be greatly improved.

Abstract: A cooling mechanism for cooling a enclosed cabinet of electronic device, which comprises a heat-conducting plate having accommodating grooves at one side. Vapor chambers disposed within accommodating grooves of the heat-conducting plate. And a cooling fin set which is arranged on an arbitrary side of the heat-conducting plate to compose a heat exchanger. Part of the heat exchanger is disposed outside of the cabinet to conduct heat inside of the cabinet to outside.

Abstract: A heat dissipation device includes a vapor chamber, a heat dissipating fins assembly, a cover and a fan. The vapor chamber is configured to a bent shape. The heat dissipating fins assembly is adhered to a partial surface of the vapor chamber. The cover is connected to the vapor camber. A flow passage is defined between the vapor chamber and the cover. The heat dissipating fins assembly is positioned in the flow passage. The cover defines an opening communicating to the flow passage. The fan is arranged facing to the opening of the cover and other partial surface of the vapor chamber. Therefore, the heat dissipating efficiency can be greatly improved.