COOLING MECHANISM FOR ELECTRONIC DEVICES

Abstract

A cooling mechanism for cooling a enclosed cabinet of electronic device, which comprises a heat-conducting plate having accommodating grooves at one side. Vapor chambers disposed within accommodating grooves of the heat-conducting plate. And a cooling fin set which is arranged on an arbitrary side of the heat-conducting plate to compose a heat exchanger. Part of the heat exchanger is disposed outside of the cabinet to conduct heat inside of the cabinet to outside.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to a cooling device, in particular, to a passive cooling device with a heat exchanger.

2. Description of Prior Art

There currently are many electronic communication devices that operate in an enclosed cabinet. Those devices will generate heat when operating. The reliability and durability of the electronic devices will be disadvantageously affected while the heat gathers cumulatively in the cabinet without effectively dissipating. Therefore, industries invest in a great deal of time and efforts to solve the heat problem.

A conventional heat dissipating arrangement for electronic communication devices is shown in FIG. 1. The electronic communication devices 1 are arranged in an enclosed cabinet 2 with an air-conditioning heat exchanger 3 disposed in the side of the cabinet 2. The air-conditioning heat exchanger 3 disposed half inside the cabinet 2 and half outside the cabinet 2. The heat generated while the electronic communication devices 1 are operated. Hence, the heat can be dissipated to outside of the cabinet 2 by the air-conditioning heat exchanger 3 to maintain the temperature in the cabinet 2 not to be too high. Besides, a backup battery 4 is often placed in the cabinet 2 to provide electricity for the electronic communication devices 1 when power is halted.

However, the electronic communication devices 1 in the cabinet 2 are often operated all day long. Accordingly, the air-conditioning heat exchanger 3 must also run all day for cooling. Because the air-conditioning heat exchanger 3 need additional power to run, it will make a huge power consuming and cost for using the air-conditioning heat exchanger 3 all the time. In addition, the size of the air-conditioning heat exchanger 3 is not small, it can not be installed in a compact cabinet. Furthermore, though the backup battery 4 can maintain the operation of the electronic communication devices 1 when power is halted, it cannot provide electricity for the air-conditioning heat exchanger 3 at the same time. The heat inside of the cabinet 2 cannot be dissipated to outside this moment.

SUMMARY OF THE INVENTION

Accordingly, an object of the present invention is to provide a cooling mechanism for electronic device to dissipate heat of electronic communication devices inside the cabinet without additional power that can save power consuming and electricity cost.

Another object of the present invention is to provide a cooling mechanism for electronic device to dissipate heat inside the cabinet of electronic communication devices stably and continuously.

In order to achieve objects mentioned above, the present invention provides a cooling mechanism for electronic device to dispose a heat exchanger set on a side of a cabinet. The heat exchanger set includes a heat-conducting plate having accommodating grooves on one side and a plurality of vapor chambers that are disposed in the accommodating grooves of the heat-conducting plate. Each of the vapor chambers has a working fluid and capillary wick arranged therein. A cooling fin set is arranged on an arbitrary side of the heat-conducting plate. And part of the heat exchanger set is disposed outside of the cabinet, and part of the heat exchanger set is disposed inside of the cabinet to let the heat exchanger conduct the heat inside of the cabinet to the outside.

BRIEF DESCRIPTION OF DRAWING

The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself, however, may be best understood by reference to the following detailed description of the invention, which describes a number of exemplary embodiments of the invention, taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a schematic view showing a conventional heat-dissipating device for electronic communication devices;

FIG. 2 is a perspective view of a cooling mechanism for an electronic device according to the present invention;

FIG. 3 is an assembled perspective view of a heat exchanger set according to the present invention;

FIG. 4 is a cross section view of the heat exchanger set according to the present invention; and

FIG. 5 is a schematic view of the heat exchanger set according to the present invention is conjugated to a cabinet of electronic communication devices.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

In cooperation with attached drawings, the technical contents and detailed description of the invention are described thereinafter according to a number of preferable embodiments, being not used to limit its executing scope. Any equivalent variation and modification made according to appended claims is all covered by the claims claimed by the present invention.

With refer to FIG. 2, a perspective view of the present invention is shown. The invention is a kind of cooling mechanism for electronic devices. According to a preferable embodiment of the invention, a heat exchanger set 20 is disposed to dissipate the heat inside of a cabinet 10. The cabinet 10 is established to have an accommodating space 11 in which the heat exchanger set 20 is disposed, and the heat exchanger set 20 is partially exposed outside of the cabinet 10.

Please refer to FIG. 3 and FIG. 4, an assembled perspective view and an assembled cross section view of a heat exchanger set 20 of the present invention are shown. The heat exchanger set 20 can be made up by continuously stacking a number of heat exchangers 30. The heat exchanger 30 includes a heat-conducting plate 31. One side of the heat-conducting plate 31 is arranged a plurality of accommodating grooves 311 whose cross sections are configured as a “U” shape with a flat bottom. A plurality of vapor chambers, which contain a working fluid and capillary wick 32, are separately received in the accommodating grooves 311. After the vapor chambers 32 are disposed within the accommodating grooves 11, the top surfaces of vapor chambers 32 are coplanar with the heat-conducting plate 31. At last, a cooling fin set 33 with aluminum-extruding type is installed on the heat-conducting plate 31 and the vapor chambers 32, wherein the bottom of the cooling fin set 33 contacts with the surfaces of the vapor chambers 32.

In this embodiment, the heat exchanger set 20 is made up by stacking two heat exchangers 30. A heat exchanger 30 is stacked up by another set of heat-conducting plate 31 and vapor chambers 32. In the embodiment, there are three paths of accommodating grooves 311 on the top surface of the heat-conducting plate 31, and each of the accommodating grooves 311 receives a vapor chamber 32. In practice, the number of the heat exchanger 30, the accommodating grooves 311 on the heat-conducting plate 31 and the vapor chamber 32 can be adjusted as demanded.

With refer to FIG. 5, a schematic view of the cooling mechanism of the present invention is conjugated to a cabinet of electronic communication devices. When in use, the heat exchanger set 20 is disposed in the accommodating space 11 of the cabinet 10, and the heat exchanger set 20 is disposed partially inside of the cabinet 10 and partially exposed outside of the cabinet 10. There is a heat-generating device 50 in the cabinet 10. When the heat inside of the cabinet 10 is conducted with the heat exchanger set 20, most of the heat will be conducted to the heat-conducting plate 31 and vapor chambers 32. The heat is fast conducted to the cooling fin set 33 having large dissipating area by the heat-conducting plate 31 and vapor chambers 32. The heat is dissipated out of the cabinet 10. In this manner, heat inside of the cabinet 10 can be transferred outside repeatedly.

Hence, the present invention is using a heat exchanger 30 having vapor chambers 32 to dissipate the heat inside of a cabinet 10. Because the present invention is a passive cooling device, it is to dissipate heat of electronic communication devices inside the cabinet 10 stably and continuously without additional power, so that power consuming and electricity cost can be saved.

Although the present invention has been described with reference to the preferred embodiment thereof, it will be understood that the invention is not limited to the details thereof. Various substitutions and improvements have been suggested in the foregoing description, and others will occur to those of ordinary skill in the art. Therefore, all such substitutions and improvements are intended to be embraced within the scope of the invention as defined in the appended claims.

Claims

1. A cooling mechanism for an electronic device, which disposed a heat exchanger on a side of a cabinet, the heat exchanger comprising:

a heat-conducting plate having an accommodating groove on one side thereof,

a vapor chamber disposed in the accommodating groove, and comprising a working fluid and capillary wick therein; and

a cooling fin set arranged on one side of the heat-conducting plate;

wherein a part of the heat exchanger is disposed outside of the cabinet, and an another part of the heat exchanger set is disposed inside of the cabinet.

2. The cooling mechanism according to claim 1, wherein a cross section of the accommodating groove is configured as a “U” shape with a flat bottom.

3. The cooling mechanism according to claim 1, wherein a top surface of the vapor chamber is coplanar with that of the heat-conducting plate, and a bottom of the cooling fin set planarly contacts with the top surfaces of the vapor chamber and the heat-conducting plate.

4. The cooling mechanism according to claim 1, wherein the cooling fin set is a cooling fin set with aluminum-extruding type.

5. The cooling mechanism according to claim 1, wherein a plurality of the heat exchangers are stacked as a heat exchanger set.