Abstract: An electronic device includes a substrate and a first gallium nitride (GaN) transistor formed on a first semiconductor die that is electrically coupled to the substrate. A second GaN transistor is formed on a second semiconductor die and is also electrically coupled to the substrate. An integral heat spreader is thermally coupled to the first and the second gallium nitride semiconductor dies and is electrically coupled to the substrate. A first bias voltage is applied to the first GaN transistor via the integral heat spreader and a second bias voltage is applied to the second GaN transistor via the integral heat spreader.

Abstract: An electronic device includes a substrate and a first gallium nitride (GaN) transistor formed on a first semiconductor die that is electrically coupled to the substrate. A second GaN transistor is formed on a second semiconductor die and is also electrically coupled to the substrate. An integral heat spreader is thermally coupled to the first and the second gallium nitride semiconductor dies and is electrically coupled to the substrate. A first bias voltage is applied to the first GaN transistor via the integral heat spreader and a second bias voltage is applied to the second GaN transistor via the integral heat spreader.

Abstract: Structures and related techniques for singulating GaN-on-Si wafers are disclosed. In one aspect, a semiconductor wafer includes a silicon layer, and a gallium nitride (GaN) layer disposed on the silicon layer and defining a plurality of trenches that each extend to the silicon layer. In another aspect, the GaN layer includes one or more gallium nitride layers of different compositions. In yet another aspect, the wafer includes a plurality of dielectric layers disposed on the GaN layer. In yet another aspect, each of the plurality of trenches has a depth that is equal to a sum of a thickness of the GaN layer and a thickness of the plurality of the dielectric layers.

Abstract: An electronic device includes a substrate and a first gallium nitride (GaN) transistor formed on a first semiconductor die that is electrically coupled to the substrate. A second GaN transistor is formed on a second semiconductor die and is also electrically coupled to the substrate. An integral heat spreader is thermally coupled to the first and the second gallium nitride semiconductor dies and is electrically coupled to the substrate. A first bias voltage is applied to the first GaN transistor via the integral heat spreader and a second bias voltage is applied to the second GaN transistor via the integral heat spreader.

Abstract: An electronic device includes a substrate and a first gallium nitride (GaN) transistor formed on a first semiconductor die that is electrically coupled to the substrate. A second GaN transistor is formed on a second semiconductor die and is also electrically coupled to the substrate. An integral heat spreader is thermally coupled to the first and the second gallium nitride semiconductor dies and is electrically coupled to the substrate. A first bias voltage is applied to the first GaN transistor via the integral heat spreader and a second bias voltage is applied to the second GaN transistor via the integral heat spreader.

Abstract: A copper pillar bump semiconductor packaging method patterns an organic insulation layer formed under the copper pillar bumps to areas surrounding and in the vicinity of the copper pillar bumps only. The organic insulation layer, typically a thin film polymer layer, acts as a barrier layer for the copper pillar bumps to protect the semiconductor wafer during the copper pillar flip chip bonding process. The copper pillar bump semiconductor packaging method limits the areas where the organic insulation layer is applied to reduce the stress introduced to the semiconductor wafer by the organic insulation layer. In another embodiment, a copper pillar bump semiconductor packaging method patterns an organic insulation layer formed under the copper pillar bumps to areas surrounding the copper pillar bumps and along the path of a redistribution layer without using a large and continuous organic insulation layer.

Abstract: A copper pillar bump semiconductor packaging method patterns an organic insulation layer formed under the copper pillar bumps to areas surrounding and in the vicinity of the copper pillar bumps only. The organic insulation layer, typically a thin film polymer layer, acts as a barrier layer for the copper pillar bumps to protect the semiconductor wafer during the copper pillar flip chip bonding process. The copper pillar bump semiconductor packaging method limits the areas where the organic insulation layer is applied to reduce the stress introduced to the semiconductor wafer by the organic insulation layer. In another embodiment, a copper pillar bump semiconductor packaging method patterns an organic insulation layer formed under the copper pillar bumps to areas surrounding the copper pillar bumps and along the path of a redistribution layer without using a large and continuous organic insulation layer.

Abstract: Methods of sterilizing dermal fillers and injectable collagen material have been developed which reduce the level of active biological contaminants or pathogens without adversely affecting the material, i.e., wherein the dermal fillers and injectable collagen material retain their same properties before and after its terminal sterilization. In one embodiment the method for sterilizing the dermal filler or injectable collagen material that is sensitive to radiation contains the steps of protecting the filler or material from radiation, and irradiating the filler or material with a suitable dose of radiation for a time and at a rate effective to sterilize the filler or injectable material. In a preferred embodiment the method for sterilizing the dermal filler or injectable collagen material that is sensitive to radiation includes the steps of a) freezing the filler or material at a temperature below its freezing temperature, which is generally below 0° C.

Abstract: A torque sensing and control device for tools comprises: a torque sensing and transmitting adapter fabricated with rib structure and mounted on or built in a fastening tool; at least a torque sensor secured on at least a rib evenly spaced and formed on the adapter and operatively sensing a torque signal when applying a torque on a work or object when rotatably operating the fastening tool; and a digital display control module operatively receiving the torque signal, displaying a torque data and generating an audio or visual warning signal for reminding the user for stopping operation of the fastening tool, or for switching off power or air supply to the fastening tool, and or actuating a delay control to restart a next fastening operation in a pre-determined time interval.

Abstract: A torque sensing and control device for tools comprises: a torque sensing and transmitting adapter fabricated with rib structure and mounted on or built in a fastening tool; at least a torque sensor secured on at least a rib evenly spaced and formed on the adapter and operatively sensing a torque signal when applying a torque on a work or object when rotatably operating the fastening tool; and a digital display control module operatively receiving the torque signal, displaying a torque data and generating an audio or visual warning signal for reminding the user for stopping operation of the fastening tool, or for switching off power or air supply to the fastening tool, and or actuating a delay control to restart a next fastening operation in a pre-determined time interval.

Abstract: The present invention generally relates to an air control module unit for a portable pneumatic tool, more particularly, to an air control module unit that actuates a valve stem inside an air inlet block of the air inlet module by a correspondent air bleed valve in the air actuation module. The air control module unit for a portable pneumatic tool comprising: an air inlet module, which has at least one valve stem inside an air inlet block, the air inlet block having plug screws on both ends towards the valve stem and one plug screw on the intersectional direction of the valve stem with at least one air inlet port opening for hooking up the compressed air; an air actuation module having a bleed valve inside the valve block; a plurality of flexible air hoses with a plurality of dimensions and being prepared for connecting the air inlet module and air actuation module; and a plurality of hose connectors and rubber seats with a plurality of types for connecting the air inlet module and the air operation module.

Abstract: A low dropout (LDO) regulator device includes an LDO regulator integrated circuit housed in a 4-pin quad flat no-lead (QFN) package where the exposed die paddle is used as the ground terminal. The LDO regulator integrated circuit is formed on a semiconductor substrate. The 4-pin QFN package includes four perimeter lands connected to the input terminal, the output terminal, the enable terminal and the bypass terminal of the LDO regulator integrated circuit. The die paddle is to be electrically connected to a ground potential to allow the ground current of the LDO regulator integrated circuit to flow through the substrate and the die paddle of the 4-pin QFN package.

Abstract: The present invention generally relates to an air control module unit for a portable pneumatic tool, more particularly, to an air control module unit that actuates a valve stem inside an air inlet block of the air inlet module by a correspondent air bleed valve in the air actuation module. The air control module unit for a portable pneumatic tool comprising: an air inlet module, which has at least one valve stem inside an air inlet block, the air inlet block having plug screws on both ends towards the valve stem and one plug screw on the intersectional direction of the valve stem with at least one air inlet port opening for hooking up the compressed air; an air actuation module having a bleed valve inside the valve block; a plurality of flexible air hoses with a plurality of dimensions and being prepared for connecting the air inlet module and air actuation module; and a plurality of hose connectors and rubber seats with a plurality of types for connecting the air inlet module and the air operation module.

Abstract: A low dropout (LDO) regulator device includes an LDO regulator integrated circuit housed in a 4-pin quad flat no-lead (QFN) package where the exposed die paddle is used as the ground terminal. The LDO regulator integrated circuit is formed on a semiconductor substrate. The 4-pin QFN package includes four perimeter lands connected to the input terminal, the output terminal, the enable terminal and the bypass terminal of the LDO regulator integrated circuit. The die paddle is to be electrically connected to a ground potential to allow the ground current of the LDO regulator integrated circuit to flow through the substrate and the die paddle of the 4-pin QFN package.

Abstract: Software running on a desktop device determines whether or not binaries (executables) need to be pushed to a remote device. If binaries need to be pushed to the remote device, the desktop determines which particular binaries need to be pushed to the remote device, and pushes the needed binaries to the remote device. Once all needed binaries are loaded onto the remote device, functions on the remote device can be executed via remote procedure calls.

Abstract: Methods of sterilizing dermal fillers and injectable collagen material have been developed which reduce the level of active biological contaminants or pathogens without adversely affecting the material, i.e., wherein the dermal fillers and injectable collagen material retain their same properties before and after its terminal sterilization. In one embodiment the method for sterilizing the dermal filler or injectable collagen material that is sensitive to radiation contains the steps of protecting the filler or material from radiation, and irradiating the filler or material with a suitable dose of radiation for a time and at a rate effective to sterilize the filler or injectable material. In a preferred embodiment the method for sterilizing the dermal filler or injectable collagen material that is sensitive to radiation includes the steps of a) freezing the filler or material at a temperature below its freezing temperature, which is generally below 0° C.

Abstract: Crosslinkable compositions are provided that readily crosslink in situ to provide biocompatible, nonimmunogenic crosslinked materials that may be used as adhesive compositions. The compositions comprise collagen and a plurality of crosslinkable components having reactive functional groups thereon, with the functional groups selected so as to enable inter-reaction between the components, i.e., crosslinking. Methods for preparing and using the compositions are also provided. Exemplary uses include tissue augmentation, biologically active agent delivery, bioadhesion, prevention of adhesions following surgery or injury, and coating of surgically acceptable patches and solid implants, the latter including sutures.

Abstract: Software running on a desktop device determines whether or not binaries (executables) need to be pushed to a remote device. If binaries need to be pushed to the remote device, the desktop determines which particular binaries need to be pushed to the remote device, and pushes the needed binaries to the remote device. Once all needed binaries are loaded onto the remote device, functions on the remote device can be executed via remote procedure calls.

Abstract: A method of tissue repair is provided using a biocompatible nonimmunogenic adhesive composition. The adhesive composition comprises collagen and a plurality of crosslinkable components having reactive functional groups thereon, with the functional groups selected so as to enable inter-reaction between the components, i.e., crosslinking. Kits for use in carrying out the method of the invention are also provided, as are pretreated surgically acceptable patches that have been coated with the aforementioned adhesive composition.

Abstract: The invention relates to anastomosis stents and plugs comprised of a non-polyglycolic acid material that is resorbable by the patient in about a few minutes up to about 90 days. Such stents and plugs may be employed in surgical techniques wherein tissue is joined at an interface without need for sutures, optionally through use of a tissue sealant. As a result, interfacial tensile strengths of at least about 1.3N/cm2 may be achieved.