Abstract: A {100} indium phosphide (InP) wafer with pits distributed on the back side thereof, a method and an etching solution for manufacturing thereof are provided, wherein the pits on the back side have an elongated shape with a maximum dimension of the long axis of 65 ?m, and the pits have a maximum depth of 6.0 ?m. The {100} indium phosphide (InP) wafer has controllable pits distribution on the back side, thus provide a controllable emissivity of the wafer back side surface for better control of wafer back side heating during the epitaxial growth.

Abstract: A copper pillar bump semiconductor packaging method patterns an organic insulation layer formed under the copper pillar bumps to areas surrounding and in the vicinity of the copper pillar bumps only. The organic insulation layer, typically a thin film polymer layer, acts as a barrier layer for the copper pillar bumps to protect the semiconductor wafer during the copper pillar flip chip bonding process. The copper pillar bump semiconductor packaging method limits the areas where the organic insulation layer is applied to reduce the stress introduced to the semiconductor wafer by the organic insulation layer. In another embodiment, a copper pillar bump semiconductor packaging method patterns an organic insulation layer formed under the copper pillar bumps to areas surrounding the copper pillar bumps and along the path of a redistribution layer without using a large and continuous organic insulation layer.

Abstract: A copper pillar bump semiconductor packaging method patterns an organic insulation layer formed under the copper pillar bumps to areas surrounding and in the vicinity of the copper pillar bumps only. The organic insulation layer, typically a thin film polymer layer, acts as a barrier layer for the copper pillar bumps to protect the semiconductor wafer during the copper pillar flip chip bonding process. The copper pillar bump semiconductor packaging method limits the areas where the organic insulation layer is applied to reduce the stress introduced to the semiconductor wafer by the organic insulation layer. In another embodiment, a copper pillar bump semiconductor packaging method patterns an organic insulation layer formed under the copper pillar bumps to areas surrounding the copper pillar bumps and along the path of a redistribution layer without using a large and continuous organic insulation layer.

Abstract: Methods of sterilizing dermal fillers and injectable collagen material have been developed which reduce the level of active biological contaminants or pathogens without adversely affecting the material, i.e., wherein the dermal fillers and injectable collagen material retain their same properties before and after its terminal sterilization. In one embodiment the method for sterilizing the dermal filler or injectable collagen material that is sensitive to radiation contains the steps of protecting the filler or material from radiation, and irradiating the filler or material with a suitable dose of radiation for a time and at a rate effective to sterilize the filler or injectable material. In a preferred embodiment the method for sterilizing the dermal filler or injectable collagen material that is sensitive to radiation includes the steps of a) freezing the filler or material at a temperature below its freezing temperature, which is generally below 0° C.

Abstract: A torque sensing and control device for tools comprises: a torque sensing and transmitting adapter fabricated with rib structure and mounted on or built in a fastening tool; at least a torque sensor secured on at least a rib evenly spaced and formed on the adapter and operatively sensing a torque signal when applying a torque on a work or object when rotatably operating the fastening tool; and a digital display control module operatively receiving the torque signal, displaying a torque data and generating an audio or visual warning signal for reminding the user for stopping operation of the fastening tool, or for switching off power or air supply to the fastening tool, and or actuating a delay control to restart a next fastening operation in a pre-determined time interval.

Abstract: A torque sensing and control device for tools comprises: a torque sensing and transmitting adapter fabricated with rib structure and mounted on or built in a fastening tool; at least a torque sensor secured on at least a rib evenly spaced and formed on the adapter and operatively sensing a torque signal when applying a torque on a work or object when rotatably operating the fastening tool; and a digital display control module operatively receiving the torque signal, displaying a torque data and generating an audio or visual warning signal for reminding the user for stopping operation of the fastening tool, or for switching off power or air supply to the fastening tool, and or actuating a delay control to restart a next fastening operation in a pre-determined time interval.

Abstract: The present invention generally relates to an air control module unit for a portable pneumatic tool, more particularly, to an air control module unit that actuates a valve stem inside an air inlet block of the air inlet module by a correspondent air bleed valve in the air actuation module. The air control module unit for a portable pneumatic tool comprising: an air inlet module, which has at least one valve stem inside an air inlet block, the air inlet block having plug screws on both ends towards the valve stem and one plug screw on the intersectional direction of the valve stem with at least one air inlet port opening for hooking up the compressed air; an air actuation module having a bleed valve inside the valve block; a plurality of flexible air hoses with a plurality of dimensions and being prepared for connecting the air inlet module and air actuation module; and a plurality of hose connectors and rubber seats with a plurality of types for connecting the air inlet module and the air operation module.

Abstract: A low dropout (LDO) regulator device includes an LDO regulator integrated circuit housed in a 4-pin quad flat no-lead (QFN) package where the exposed die paddle is used as the ground terminal. The LDO regulator integrated circuit is formed on a semiconductor substrate. The 4-pin QFN package includes four perimeter lands connected to the input terminal, the output terminal, the enable terminal and the bypass terminal of the LDO regulator integrated circuit. The die paddle is to be electrically connected to a ground potential to allow the ground current of the LDO regulator integrated circuit to flow through the substrate and the die paddle of the 4-pin QFN package.

Abstract: The present invention generally relates to an air control module unit for a portable pneumatic tool, more particularly, to an air control module unit that actuates a valve stem inside an air inlet block of the air inlet module by a correspondent air bleed valve in the air actuation module. The air control module unit for a portable pneumatic tool comprising: an air inlet module, which has at least one valve stem inside an air inlet block, the air inlet block having plug screws on both ends towards the valve stem and one plug screw on the intersectional direction of the valve stem with at least one air inlet port opening for hooking up the compressed air; an air actuation module having a bleed valve inside the valve block; a plurality of flexible air hoses with a plurality of dimensions and being prepared for connecting the air inlet module and air actuation module; and a plurality of hose connectors and rubber seats with a plurality of types for connecting the air inlet module and the air operation module.

Abstract: A low dropout (LDO) regulator device includes an LDO regulator integrated circuit housed in a 4-pin quad flat no-lead (QFN) package where the exposed die paddle is used as the ground terminal. The LDO regulator integrated circuit is formed on a semiconductor substrate. The 4-pin QFN package includes four perimeter lands connected to the input terminal, the output terminal, the enable terminal and the bypass terminal of the LDO regulator integrated circuit. The die paddle is to be electrically connected to a ground potential to allow the ground current of the LDO regulator integrated circuit to flow through the substrate and the die paddle of the 4-pin QFN package.

Abstract: Software running on a desktop device determines whether or not binaries (executables) need to be pushed to a remote device. If binaries need to be pushed to the remote device, the desktop determines which particular binaries need to be pushed to the remote device, and pushes the needed binaries to the remote device. Once all needed binaries are loaded onto the remote device, functions on the remote device can be executed via remote procedure calls.

Abstract: Methods of sterilizing dermal fillers and injectable collagen material have been developed which reduce the level of active biological contaminants or pathogens without adversely affecting the material, i.e., wherein the dermal fillers and injectable collagen material retain their same properties before and after its terminal sterilization. In one embodiment the method for sterilizing the dermal filler or injectable collagen material that is sensitive to radiation contains the steps of protecting the filler or material from radiation, and irradiating the filler or material with a suitable dose of radiation for a time and at a rate effective to sterilize the filler or injectable material. In a preferred embodiment the method for sterilizing the dermal filler or injectable collagen material that is sensitive to radiation includes the steps of a) freezing the filler or material at a temperature below its freezing temperature, which is generally below 0° C.

Abstract: Crosslinkable compositions are provided that readily crosslink in situ to provide biocompatible, nonimmunogenic crosslinked materials that may be used as adhesive compositions. The compositions comprise collagen and a plurality of crosslinkable components having reactive functional groups thereon, with the functional groups selected so as to enable inter-reaction between the components, i.e., crosslinking. Methods for preparing and using the compositions are also provided. Exemplary uses include tissue augmentation, biologically active agent delivery, bioadhesion, prevention of adhesions following surgery or injury, and coating of surgically acceptable patches and solid implants, the latter including sutures.

Abstract: Software running on a desktop device determines whether or not binaries (executables) need to be pushed to a remote device. If binaries need to be pushed to the remote device, the desktop determines which particular binaries need to be pushed to the remote device, and pushes the needed binaries to the remote device. Once all needed binaries are loaded onto the remote device, functions on the remote device can be executed via remote procedure calls.

Abstract: A method of tissue repair is provided using a biocompatible nonimmunogenic adhesive composition. The adhesive composition comprises collagen and a plurality of crosslinkable components having reactive functional groups thereon, with the functional groups selected so as to enable inter-reaction between the components, i.e., crosslinking. Kits for use in carrying out the method of the invention are also provided, as are pretreated surgically acceptable patches that have been coated with the aforementioned adhesive composition.

Abstract: The invention relates to anastomosis stents and plugs comprised of a non-polyglycolic acid material that is resorbable by the patient in about a few minutes up to about 90 days. Such stents and plugs may be employed in surgical techniques wherein tissue is joined at an interface without need for sutures, optionally through use of a tissue sealant. As a result, interfacial tensile strengths of at least about 1.3N/cm2 may be achieved.

Abstract: A process evaluates an aging property of a distributed Bragg reflector (DBR) laser. The process includes illuminating a Bragg grating of the distributed Bragg reflector (DBR) laser with light while the DBR laser is both supplied a tuning current and not lasing. The process also includes performing an action to the DBR laser responsive to a wavelength of a Bragg peak in a portion of the light reflected by the Bragg grating and a value of the tuning current supplied during the illuminating.

Abstract: The RT regions of an ISB light emitter comprise pre-biased SLs and a multiplicity of split quantum wells (SPQWs). A SPQW is a quantum well that is divided into a multiplicity of sub-wells by a first barrier layer sufficiently thin that the upper and lower energy states are split beyond their natural broadening and contribute to different minibands in each RT region. In contrast, adjacent SPQWs are coupled to one another by second barrier layers. The thicknesses of the latter layers are chosen so that minibands are created across each RT region. In one embodiment, the emitter includes an I/R region between adjacent RT regions, and in another embodiment the I/R regions are omitted.

Abstract: An intersubband (ISB) optical device comprises first quantum well (QW) interior regions having upper and lower energy states between which ISB transitions take place; and superlattice (SL) barrier regions interposed between the first QW interior regions. The SL barrier regions include second barriers and second QW interior regions, with the second QW interior regions being interposed between the second barrier regions. The first QW interior regions and the SL barrier regions are configured to produce an energy gap between the upper and lower states that is larger than the energy of a 1.7 &mgr;m wavelength photon. In accordance with another aspect of our invention, an intersubband optical device comprises a core region that includes a multiplicity of repeat units (RUs), each RU including a first barrier region and a QW active region disposed adjacent thereto, characterized in that (1) each of the QWs has upper and lower energy states separated by an energy greater than that of a 1.

Abstract: An article comprising a QC-DFB laser is disclosed. In the QC-DFB laser, an overlying grating structure achieves relatively strong coupling of the guided mode to the grating, and is thus highly effective in inducing single-mode operation even under cw operating conditions. The grating structure includes grooves etched in a plasmon-enhanced confinement layer (PECL) disposed adjacent and in contact with an upper metallic electrode. The grating structure and the PECL are designed such that in the grooves, the laser mode travelling in the waveguide can couple efficiently to the surface-plasmon at the electrode interface. This results in strong modulation of the laser mode, leading to strong modulation of, inter alia, the effective refractive index.