Abstract: Example implementations relate to an electronic device packaged on a wing board. For example, an implementation includes a base board having a planar signal interface to couple parallelly to a signal interface segment of a system board. The example implementation also includes a plurality of wing boards to scale in a direction perpendicular to a plane of the base board. An electronic device is packaged on each of the wing boards. A flexible circuit flexibly links at least one of the wing boards to the base board and has a signal path to communicatively couple the planar signal interface and an electronic device packaged the wing board.

Abstract: One example of a system includes a system board including first contacts, a cage attached to the system board over the first contacts, and a removable transceiver module including second contacts. The transceiver module is installable in the cage in response to a lateral movement of the transceiver module with respect to the cage to align the second contacts with the first contacts and a vertical movement of the transceiver module with respect to the cage to electrically connect the first contacts to the second contacts.

Abstract: Example implementations relate to an electronic device packaged on a wing board. For example, an implementation includes a base board having a planar signal interface to couple parallelly to a signal interface segment of a system board. The example implementation also includes a plurality of wing boards to scale in a direction perpendicular to a plane of the base board. An electronic device is packaged on each of the wing boards. A flexible circuit flexibly links at least one of the wing boards to the base board and has a signal path to communicatively couple the planar signal interface and an electronic device packaged the wing board.

Abstract: An example electro-optical connector may comprise an optical ferrule to optically engage with a complementary optical ferrule on a complementary electro-optical connector, a first conductive guide post disposed adjacent to the optical ferrule to electrically engage with a first guide pocket of the complementary electro-optical connector, and a second conductive guide post disposed on an opposite side of the optical ferrule from the first conductive guide post and to electrically engage with a second guide pocket of the complementary electro-optical connector. The first and second conductive guide posts may align the optical ferrule for engagement with the complementary optical ferrule when the guide posts are engaged with the respective guide pockets, and the first and second conductive guide posts may conduct an electrical signal or electrical power from the electro-optical connector to the complementary electro-optical connector.

Abstract: An example connector mount may comprise a bracket to receive a connector. The example connector mount may further comprise a first and second guide spring disposed on the bracket. Each of the first and second guide springs may be to engage with the connector and each provide resistance to movement of the connector in a horizontal, and a vertical direction.

Abstract: A base layer architecture (BLA) infrastructure device comprises a power base layer (PBL) to supply power to a cartridge, a cold thermal base layer (cold TBL) to cool the cartridge, a hot thermal base layer (hot TBL) to remove heat from the cartridge, an optical base layer (OBL) to transmit an optical signal to the cartridge and a radio frequency base layer (RBL) to transmit a radio frequency signal to the cartridge. Each base layer comprises a rack interface to couple the base layer to a rack and a number of cartridge interfaces to couple the base layers to the cartridge. A BLA infrastructure system comprises a BLA infrastructure device comprising a number of base layers. The number of base layers are removably coupled to a rack and a system management device to manage the number of base layers.

Abstract: An example device in accordance with an aspect of the present disclosure includes a first shield to provide thermal isolation between a first component and a heatsink of a second component, and to provide a cooling channel that is thermally isolated from the heatsink to receive an airflow for the first component. A second shield is to provide thermal isolation between the first shield and the heatsink, and to provide a thermal barrier region between the first shield and the second shield.

Abstract: Examples herein disclose a plenum. The plenum includes an enclosed structure to deliver cool air to multiple enclosures within a rack and multiple cables to route to the multiple enclosures within the rack. The plenum further includes a connector to attach the multiple cables in the plenum to one of the multiple enclosures.

Abstract: In one example, a system for a cage assembly for an optical module includes a receptacle coupled to an interposer card, a number of rails coupled to the interposer card to align an optical module with the receptacle, and a mezzanine card coupled to the interposer card, wherein the optical module is utilized via the mezzanine card.

Abstract: Examples relate to devices comprising a stationary pivot plenum and a rocker-arm assembly pivotally coupled to the stationary pivot plenum and wherein the rocker-arm assembly comprises an inner conduit having at least one connector bay in which a connector of a cable assembly is removably coupled to the connector bay. In such examples the inner conduit of the rocker-arm assembly is accessible from the outside of the rocker-arm assembly to independently engage/disengage the removable cable assembly to/from the at least one connector bay.

Abstract: An example semiconductor assembly can include a hingeably-coupled component that receives a semiconductor board. In some examples, the component can be hingeably rotated to an open position to receive the semiconductor board. In some examples, the component can be hingeably detached from the assembly to receive the semiconductor board.

Abstract: In one example, a system for a module board coupling includes a module bracket coupled to a plate, a module board coupled to the plate, a number of frame pins coupled to the module frame to slide under the plate when a back spring coupled to the module bracket is depressed, wherein the module board is engaged with a socket when the number of frame pins slide under the plate.

Abstract: One example of a system includes a receptacle including a plurality of bays. Each bay of the receptacle supports 1-lane of network communications. The receptacle is to connect to a multi-lane cable to provide a multi-lane port or connect to a plurality of 1-lane cables to provide a plurality of 1-lane ports.

Abstract: One example of a system includes a receptacle including a plurality of bays. Each bay of the receptacle supports 1-lane of network communications. The receptacle is to connect to a multi-lane optical cable to provide a multi-lane port or connect to a plurality of 1-lane optical cables to provide a plurality of 1-lane ports.

Abstract: An optoelectronic assembly for a printed circuit board (PCB) assembly is described herein. The optoelectronic assembly may include a component carrier for mounting an active component, and a connector assembly for achieving a coupling between the component carrier and PCB-side optical infrastructure on a printed circuit board (PCB). The connector assembly can include a plurality of optical fibers connected to the component carrier, a first optical connector connected to the optical fibers for coupling with the PCB-side optical infrastructure on the PCB, and a housing member for housing the optical fibers and the first optical connector.

Abstract: Examples herein disclose an apparatus. The apparatus includes a first socket nested in a second socket. The first socket includes a cavity, disposed in the first socket, to accept a chipset. The first socket includes an electrical contact, disposed in the cavity, to couple the chipset to a board. The chipset detects when a modular infrastructure is coupled to the second socket.

Abstract: According to an example, a socket to support a first board in a spaced relation to a second board may include a base section having openings to receive connectors that are to electrically connect the first board to the second board. The socket may also include a plurality of walls extending from the base section, in which each of the plurality of walls is angled with respect to the base section and in which the plurality of walls include air ducts to enable air to flow through the socket when the first board is positioned on the socket. The socket may further include socket alignment elements extending from the base section, in which the alignment elements are to be inserted into mating holes in the second board.

Abstract: An example heat exchanger may comprise a base to thermally conductively engage with a computing component, a plurality of fins that may extend from the base on the same side as the computing component, and an auxiliary fluid channel defined by the plurality of fins. The plurality of fins may transfer thermal energy from the computing component to a fluid medium surrounding the plurality of fins. The auxiliary fluid channel may facilitate the transfer of thermal energy from an electronic component, other than the computing component, disposed within the auxiliary fluid channel to a fluid medium flowing through the auxiliary fluid channel.

Abstract: One example of a system includes a system board including first contacts, a cage attached to the system board over the first contacts, and a removable transceiver module including second contacts. The transceiver module is installable in the cage in response to a lateral movement of the transceiver module with respect to the cage to align the second contacts with the first contacts and a vertical movement of the transceiver module with respect to the cage to electrically connect the first contacts to the second contacts.

Abstract: An example device in accordance with an aspect of the present disclosure includes a first shield to provide thermal isolation between a first component and a heatsink of a second component, and to provide a cooling channel that is thermally isolated from the heatsink to receive an airflow for the first component. A second shield is to provide thermal isolation between the first shield and the heatsink, and to provide a thermal barrier region between the first shield and the second shield.