Abstract: A base layer architecture (BLA) infrastructure device comprises a power base layer (PBL) to supply power to a cartridge, a cold thermal base layer (cold TBL) to cool the cartridge, a hot thermal base layer (hot TBL) to remove heat from the cartridge, an optical base layer (OBL) to transmit an optical signal to the cartridge and a radio frequency base layer (RBL) to transmit a radio frequency signal to the cartridge. Each base layer comprises a rack interface to couple the base layer to a rack and a number of cartridge interfaces to couple the base layers to the cartridge. A BLA infrastructure system comprises a BLA infrastructure device comprising a number of base layers. The number of base layers are removably coupled to a rack and a system management device to manage the number of base layers.

Abstract: A module connectivity device includes a stationary pivot plenum, a number of rocker-arm assemblies movably coupled to the stationary pivot plenum in which the rocker-arm assemblies move between an open position and a closed position, and a number of module connectors movably coupled to the rocker-arm assemblies, in which the module connectors move between a disengaged position and an engaged position with respect to the connectors on system modules. A module connectivity system includes a number of rocker-arm assemblies and a number of module connectors movably coupled to the number of rocker-arm assemblies. The system also includes a module connectivity manager to manage the connectivity of the module connectors.

Abstract: A plurality of connector modules are mounted to a support frame. The connector modules have respective optical connectors to optically connect with respective electronic devices, where the optical connectors are moveable between a retracted position and an extended position. The optical connector of a first of the connector modules is retractable and extendable independently of a second of the connector modules.

Abstract: A socket (130) employs a substrate (310) including a conductive network. As array of first contacts (136) is on a top surface of the substrate (310) and arranged to engage an integrated circuit (110). An array of second contacts (138) is on a bottom surface of the substrate (310) and arranged to engage a circuit board (120). The conductive network electrically connects the first contacts (136) respectively to the second contacts (138), and the first contacts (136) include a roused first contact (136?) that the conductive network routes horizontally in or on the substrate (310).

Abstract: A modular connector infrastructure includes device connector modules having optical connectors to optically connect to respective subsets of electronic devices in a system. The device connector modules are removably connected to the electronic devices.

Abstract: A multi-chip socket including multiple cavities. The multiple cavities include support surfaces. The support surfaces may be disposed at different heights relative to a reference plane. A first thermal interface is to thermally contact a top surface of the first component, and a second thermal interface is to thermally contact a top surface of the second component.

Abstract: A multi-chip socket includes a first cavity having a first support surface to support a first component including a first chip, the first support surface arranged to contact and support the first chip. A second cavity has a second support surface to support a second component including a second chip, the second support surface arranged to contact and support the second chip. The first support surface is in a first plane, and the second support surface is in a second plane, where the first plane is angled with respect to the second plane.

Abstract: A plurality of connector modules is disclosed. The connector modules have respective various indicia including topside indicia to indicate orientation and ferrule indicia to indicate ferrule position. Ferrules may be removably inserted into the connector modules, and may include seated indicia that indicate if the ferrules are seated.

Abstract: A modular connector infrastructure includes device connector modules having optical connectors to optically connect to respective subsets of electronic devices in a system. The device connector modules are removably connected to the electronic devices.

Abstract: An optical connector includes a lens assembly that has at least one lens and a surface. A cleaning element is provided to clean the surface or a surface of another optical connector.

Abstract: An optical base layer (OBL) (102) comprises a number of waveguides (124) disposed inside the OBL (102), and a number of socket connectors (116, 120) formed on the optical base layer and extending through a motherboard (104) to optically couple the OBL (102) to a number of components disposed on the motherboard (104). An optical base layer (OBL) (102) comprises a number of adjustable arms (1105), and a number of waveguides disposed within the adjustable arms (1105), in which the position of the adjustable arms (1105) are altered to accommodate different motherboard (104) configurations.

Abstract: An optical blind-mate connector can include a housing that holds a ferrule block, a carrier coupled to the housing, a reversibly retractable sleeve including a sleeve tab extending therefrom, to receive a force to transition the reversibly retractable sleeve from an extended position to a retracted position, and a door coupled to the reversibly retractable sleeve, the door having a closed position and an open position, wherein in the extended position the door is in the closed position to cover a portion of the ferrule block and in the retracted position the door is in the open position to uncover the portion of the ferrule block.

Abstract: A rack frame includes a first plenum to serve as a first structural member and to supply air based on a blind-mate supply interface. A second plenum is to serve as a second structural member and to exhaust air based on a blind-mate exhaust interface. The first plenum is to structurally support and supply air for a removable module, and the second plenum is to structurally support and exhaust air from the removable module.

Abstract: An optical/electrical signal transmission system (100) comprises a number of processing devices (106) mounted on a motherboard (104), and a number of transceiver modules (102) comprising a number of e/o engines (304), in which the transceiver modules (102) electrically couple to the processing devices (106) without interrupting the processes of the system (100).

Abstract: Enclosures and systems that can control airflow and signal connectivity in a blade enclosure are provided. Some examples include a front section including a number of blade server modules, a rear section including a number of switch modules; and a middle section having a number of openings and a number of connectors, wherein the middle section controls airflow between the front section and the rear section in the blade enclosure with the number of openings and the middle section controls signal connectivity between a number of blades in the number of blade server modules and a number of switches in the number of switch modules with the number of connectors.

Abstract: An optical communication module has an attachment feature for attachment to a chip package having an electrical-optical converter, the optical communication module to pass light communicated with an electrical-optical converter of the chip package. The optical communication module has an alignment feature to achieve a level of alignment with a system-side optical connector.

Abstract: A socket (130) employs a substrate (310) including a conductive network. As array of first contacts (136) is on a top surface of the substrate (310) and arranged to engage an integrated circuit (110). An array of second contacts (138) is on a bottom surface of the substrate (310) and arranged to engage a circuit board (120). The conductive network electrically connects the first contacts (136) respectively to the second contacts (138) and the first contacts (136) include a roused first contact (136?) that the conductive network routes horizontally in or on the substrate (310).

Abstract: Embodiments provide methods, apparatuses, and systems for providing a cooling flow to a component. In various examples, a chip socket may include a cavity configured to couple to the component. The chip socket may include a first channel and a second channel. The first channel may act as an ingress channel while the second channel may act as an egress channel. The ingress and egress channels may be configured to facilitate cooling of the component.

Abstract: A diagnostic module may include an inspection device, a cleaning device, and in various other examples, a verification device. The inspection device may inspect an optical fiber end-face of an optical fiber. The cleaning device may clean the optical fiber end-face of the optical fiber. The diagnostic module may automatically move from an optical connector to another optical connector.

Abstract: An electrical/optical connector system can include a first circuit board with a floating optical connector and a first electrical contact and a second circuit board with a second optical connector to blind mate with the floating optical connector and a second electrical contact to blind mate with the first electrical contact.