Abstract: A method to improve the resolution of a photolithography system by using one or more coupling layers between a photo resist and an anti-reflective coating. The coupling layer(s) compensate for a mis-match in indexes of reflection between the photo resist and anti-reflective coating and minimize the amount of energy which is reflected back into the photo resist, thereby improving the quality of the resulting image which is formed on the photo resist during the process.

Abstract: A method of detecting contamination on a backside of a semiconductor wafer includes the steps of positioning the backside of the wafer in contact with a detection surface of a contaminant sensor, and detecting deformation of the detection surface of the contaminant sensor. The contaminant sensor may be incorporated into a fabrication device such as a wafer handling device, or can be utilized in the construction of a stand-alone device. An apparatus for detecting contamination on the backside of a semiconductor wafer is also disclosed.

Abstract: A cutting element is composed of a metal carbide stud having an outer hemispherical distal end which has a series of annular ridges. The tops of the annual ridges are substantially non-planar, i.e., curvilinear, such that the angle formed between the slope on either side is less than 120.degree.. There are no surfaces tangent to vertical on such ridges. A layer of polycrystalline superabrasive material is disposed over the annular ridges. This cutter is easily manufacturable as the metal stud can be pressed and extracted from the punch without further machining and the surface geometry of the metal stud allows for complete PCD compaction during diamond sintering.