Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.

Abstract: The invention is the technology of providing a packaging intermediate product that can serve as an interface substrate that is to be positioned between different circuitry types where the dimensions are approaching the sub 100 micrometer range. The invention involves a dielectric wafer structure where the first and second area surfaces of the wafer are separated by a distance that is of the order of the electrical via design length, and an array of spaced vias through the wafer arranged with each via filled with metal surrounded by a chemical metal deposition promoting layer with each via terminating flush with a wafer surface.

Abstract: Particulate compositions are described comprising an intimate mixture of a coal and a gasification catalyst in the presence of steam to yield a plurality of gases including methane and at least one or more of hydrogen, carbon monoxide, carbon dioxide, hydrogen sulfide, ammonia and other higher hydrocarbons are formed. Processes are also provided for the preparation of the particulate compositions and converting the particulate composition into a plurality of gaseous products.

Abstract: Particulate compositions are described comprising an intimate mixture of a coal and a gasification catalyst. The particulate compositions are gasified in the presence of steam to yield a plurality of gases including methane and at least one or more of hydrogen, carbon monoxide, carbon dioxide, hydrogen sulfide, ammonia and other higher hydrocarbons. Processes are also provided for the preparation of the particulate compositions and converting the particulate composition into a plurality of gaseous products.

Abstract: Disclosed are improved methods for the synthesis of N-(8-[2-hydroxybenzoyl]-amino)caprylic acid. Certain compounds have been found useful for preventing the formation of a colored impurity when included in an ester hydrolysis reaction. Conducting ester hydrolysis in anaerobic conditions has also been found to minimize the formation of the color impurity. Also disclosed are improved methods for synthesizing the sodium salt of N-(8-[2-hydroxybenzoyl]-amino)caprylic acid.

Abstract: A high density test probe which provides an apparatus for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer.

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.

Abstract: The sensor includes an optical waveguide defined in a light-transmitting medium. The waveguide includes a sensing portion and an non-sensing portion. The light-transmitting medium included in the sensing portion has defects that provide the light-transmitting medium with a deep band gap level between a valence band of the light-transmitting medium and a conduction band of the light-transmitting medium. The deep band gap level is configured such that the waveguide guiding light signals through the light-transmitting medium in the sensing portion causes free carriers to be generated in the light-transmitting medium. A detector is configured to detect the free carriers in the sensing region of the waveguide.

Abstract: A sling for industrial lifting made of a load-bearing core and a cover. The cover protects the plurality of yarns that make-up the core. Each core yarn is made of a number of core threads twisted together. The core yarns are twisted together where the twist is in the same direction as the individual core strands and a different direction than the twist of the cover. The present invention describes the method of twisting the core yarns together by inserting core yarns substantially parallel into a cover that has a twist opposite of each core strand. As the core strands are inserted into the cover, the twists of the individual core yarns interact with the twist of the cove, resulting in the core yarns twisting together.

Abstract: The present invention relates to catalyst-loaded coal compositions having a moisture content of less than about 6 wt %, a process for the preparation of catalyst-loaded coal compositions, and an integrated process for the gasification of the catalyst-loaded coal compositions. The catalyst-loaded coal compositions can be prepared by a diffusive catalyst loading process that provides for a highly dispersed catalyst that is predominantly associated with the coal matrix, such as by ion-exchange.

Abstract: A smoker's requisite embodies a substance selected from pharmaceutical products, food supplements, natural products and combinations thereof. The substance is embodied in the requisite such that, when the requisite is lit and smoked by a smoker, a quantity of the substance is ingested by the smoker.

Abstract: A microspheroidal support for the manufacture of a vinyl acetate catalyst which support comprises substantially inert microspheroidal particles of a mixture of silica and 0.5 to 5 wt % (based on the total weight of the support) of aluminium oxide. A vinyl acetate catalyst comprising the microspheroidal support, palladium, at least one metal, M, selected from the group consisting of gold, cerium, copper and mixtures thereof and at least one metal. A, selected from the group consisting of Group I, Group II, lanthanide and transition metal promoters.

Abstract: The invention comprises a polymerizable monomer composition for application to the nail surface and polymerization thereon to yield an artificial nail structure, comprising at least one multicarbonyl-vinyl containing monomer; a polymerized artificial nail structure having a thickness of about 10-60 mils, and a modulus of elasticity of about 550-800 N/m2, comprising a copolymer of at least one ethylenically unsaturated monomer and a multicarbonyl vinyl-containing monomer; a method for reducing, ameliorating, or eliminating delamination of an artificial nail structure from the natural nail surface; a method for improving adhesion of an artificial nail structure to the nail surface; and a method for reducing premature gelation of a liquid monomer composition.

Abstract: A computer software based and driven sports training methodological process which is both more systematic and comprehensive than any previously utilized sports training paradigms, and thereby produces better players/trainees at a faster rate as determined by objective, quantifiable computer software based and driven data, and thus serves to not only elevate the activity or profession of coaching by enhancing the efficacy of same, but by also elevating the enterprise of coaching from the realm of the subjective to that of the objective in terms of the attainment of a comprehensive skill set within a given sport or athletic endeavor, with the aforementioned data recorded and presented electronically to trainees on a predetermined and regularly scheduled semi-annual basis.

Abstract: An integrated optical waveguide (1) having an in-line light sensor (2) integrally formed therewith for tapping off a small proportion of the signal transmitted along the waveguide (1). A first part (1A) of the waveguide leads to a photodiode portion (2) and a second part (1B) of the waveguide leads away from the photodiode portion (2), the photodiode portion (2) comprising one or more regions (14) of light absorbing material within the waveguide (1) arranged to absorb a minor proportion of light transmitted along the waveguide (1) and thereby to generate free charge carriers within the waveguide (1). Deep band gap levels (21) are introduced into photodiode portion by ion implantation to enable it to absorb selected wavelengths. The free charge carriers are detected by a p-i-n diode formed across the waveguide (1). Wavelength selective reflectors (11, 12) may be provided either side of the photodiode portion (2) so light passes repeatedly through the photodiode portion (2).

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.