Abstract: Warpage reduction through laminate glass cloth design modification is described herein. In one example, a substrate for a microelectronic assembly, includes one or more glass-cloth containing layers. At least one of the glass-cloth containing layers includes a glass cloth having a weave including: a first plurality of parallel glass fibers, a second plurality of parallel glass fibers, and a third plurality of parallel glass fibers interwoven with one another in a plane. The second plurality of parallel glass fibers crosses the first plurality of glass fibers at a first angle, and the third plurality of parallel glass fibers crosses the first plurality of glass fibers at a second angle and crosses the second plurality of glass fibers at a third angle. In one example, the glass cloth weave includes a hexagonal pattern.

Abstract: In one arrangement, there is provided a delivery system for deploying a self-expanding tube into a blood vessel, comprising a tubular member configured for insertion into the blood vessel, an elongate body extending within a lumen of the tubular member, and a self-expanding tube positioned radially between the tubular member and the elongate body. The delivery system is configured to operate in a deployment mode in which there is relative movement longitudinally between the elongate body and a portion of the self-expanding tube that remains in engagement with the elongate body during retraction of the elongate body in use after at least a portion of the self-expanding tube has been deployed, retraction of the elongate body comprising longitudinal movement towards a proximal end of the delivery system of the elongate body relative to the tubular member.

Abstract: Delivery systems for deploying a self-expanding tube into a blood vessel are disclosed. In one arrangement, a tubular member is provided that is configured for insertion into the blood vessel. An elongate body extends within a lumen of the tubular member. A self-expanding tube is positioned radially between the tubular member and the elongate body. Over at least 50% of the length of the self-expanding tube, at least a portion of the self-expanding tube engages outwardly with the tubular member and inwardly with the elongate body.

Abstract: An apparatus and a method are provided for an air box configured to cool an engine control unit (ECU) by way of an airstream being communicated to an air intake system of an internal combustion engine of a vehicle. The air box is comprised of a housing to support an air filter within an interior of the housing. An opening in the housing fixedly receives at least one surface of the ECU to transfer heat from the ECU to the airstream. A mount portion within the housing receives the air filter. A conduit to a clean side of the air filter is configured to be coupled with the air intake system. An inlet to the housing is configured to couple with an air inlet duct of the vehicle so as to direct the airstream into the interior of the housing.

Abstract: Delivery systems for deploying a self-expanding tube into a blood vessel are disclosed. In one arrangement, a tubular member is provided that is configured for insertion into the blood vessel. An elongate body extends within a lumen of the tubular member. A self-expanding tube is positioned radially between the tubular member and the elongate body. Over at least 50% of the length of the self-expanding tube, at least a portion of the self-expanding tube engages outwardly with the tubular member and inwardly with the elongate body.

Abstract: A method of separating a strengthened glass sheet includes positioning a serrated scribing wheel at a position spaced apart from a first edge of the glass sheet and offset below a top surface of the glass sheet, where the glass sheet comprises a surface compression layer of layer depth DOL and a central region. The method also includes translating the serrated scribing wheel in a first direction at an initiation speed such that the serrated scribing wheel forms a crack initiation site comprising surface indentations extending into the surface compression layer, accelerating the serrated scribing wheel in the first direction from the initiation speed to a scoring speed to scribe a score line extending into the glass sheet to a median crack depth greater than DOL, and stopping the serrated scribing wheel in the first direction before the score line reaches a second edge of the glass sheet.

Abstract: Electronic device heat transfer technology is disclosed. In an example, an electronic device package can include a substrate. The electronic device package can also include a heat transfer component. The electronic device package can further include a heat-generating electronic component coupled to the substrate between the substrate and the heat transfer component. The electronic device package can also include a viscous thermal interface material (TIM) providing a heat transfer pathway between the electronic component and the heat transfer component. In addition, the electronic device package can include a barrier about at least a portion of a periphery of the viscous TIM to maintain the viscous TIM within a confined location in proximity to the electronic component. The TIM is uninterrupted by the barrier within the periphery.

Abstract: Electronic device heat transfer technology is disclosed. In an example, an electronic device package can include a substrate. The electronic device package can also include a heat transfer component. The electronic device package can further include a heat-generating electronic component coupled to the substrate between the substrate and the heat transfer component. The electronic device package can also include a viscous thermal interface material (TIM) providing a heat transfer pathway between the electronic component and the heat transfer component. In addition, the electronic device package can include a barrier about at least a portion of a periphery of the viscous TIM to maintain the viscous TIM within a confined location in proximity to the electronic component. The TIM is uninterrupted by the barrier within the periphery.

Abstract: Electronic device heat transfer technology is disclosed. In an example, an electronic device package can include a substrate. The electronic device package can also include a heat transfer component. The electronic device package can further include a heat-generating electronic component coupled to the substrate between the substrate and the heat transfer component. The electronic device package can also include a viscous thermal interface material (TIM) providing a heat transfer pathway between the electronic component and the heat transfer component. In addition, the electronic device package can include a barrier about at least a portion of a periphery of the viscous TIM to maintain the viscous TIM within a confined location in proximity to the electronic component. The TIM is uninterrupted by the barrier within the periphery.

Abstract: In some embodiments, a computer implemented method, a system, and/or a non-transitory computer readable medium can receive an actionable rule that represents user intent to share media data. The actionable rule can be analyzed to determine a set of conditions and a set of actions included in the actionable rule. The actionable rule, including the set of conditions and the set of actions, can be stored in a rule database. Context data can be acquired from a context database. Whether or not the set of conditions is satisfied based on the acquired context data can be determined. The set of actions can be executed when the set of conditions is satisfied based on the acquired context data. In some cases, executing the set of actions can include, at least in part, initiating a sharing of the media data with at least one target system.

Abstract: A method of separating a strengthened glass sheet includes positioning a serrated scribing wheel at a position spaced apart from a first edge of the glass sheet and offset below a top surface of the glass sheet, where the glass sheet comprises a surface compression layer of layer depth DOL and a central region. The method also includes translating the serrated scribing wheel in a first direction at an initiation speed such that the serrated scribing wheel forms a crack initiation site comprising surface indentations extending into the surface compression layer, accelerating the serrated scribing wheel in the first direction from the initiation speed to a scoring speed to scribe a score line extending into the glass sheet to a median crack depth greater than DOL, and stopping the serrated scribing wheel in the first direction before the score line reaches a second edge of the glass sheet.

Abstract: A electronic device and method for extracting heat from a heat producing component having front and back sides, the front side is disposed across from the back side, and the front side is attached to a substrate including multiple holes. A thermal interface material is disposed over the back side of the heat producing component. A heat sink including multiple pins corresponding to the multiple holes in the substrate is disposed over the thermal interface material such that the pins are disposed through the holes. The thermal interface material melts and wets to form a thermal coupling between the back side and the heat sink when passed over pre-heaters of a wave soldering machine. Further, the pins are soldered to form solder joints between the respective pins and the substrate when passed over a solder wave in the wave soldering machine to lock-in the thermal coupling formed during the preheating of the thermal interface material to provide a low-cost thermal solution.

Abstract: A electronic device and method for extracting heat from a heat producing component having front and back sides, the front side is disposed across from the back side, and the front side is attached to a substrate including multiple holes. A thermal interface material is disposed over the back side of the heat producing component. A heat sink including multiple pins corresponding to the multiple holes in the substrate is disposed over the thermal interface material such that the pins are disposed through the holes. The thermal interface material melts and wets to form a thermal coupling between the back side and the heat sink when passed over pre-heaters of a wave soldering machine. Further, the pins are soldered to form solder joints between the respective pins and the substrate when passed over a solder wave in the wave soldering machine to lock-in the thermal coupling formed during the preheating of the thermal interface material to provide a low-cost thermal solution.

Abstract: A electronic device and method for extracting heat from a heat producing component having front and back sides, the front side is disposed across from the back side, and the front side is attached to a substrate including multiple holes. A thermal interface material is disposed over the back side of the heat producing component. A heat sink including multiple pins corresponding to the multiple holes in the substrate is disposed over the thermal interface material such that the pins are disposed through the holes. The thermal interface material melts and wets to form a thermal coupling between the back side and the heat sink when passed over pre-heaters of a wave soldering machine. Further, the pins are soldered to form solder joints between the respective pins and the substrate when passed over a solder wave in the wave soldering machine to lock-in the thermal coupling formed during the preheating of the thermal interface material to provide a low-cost thermal solution.

Abstract: Embodiments of stiffening members in accordance with the present invention provide a mechanical support that is wave soldered to the frontside of the system substrate simultaneously with other wave soldered components. The stiffening member comprises a flat plate with a plurality of mounting pins. The number of mounting pins are predetermined to provide the plate with sufficient support to resist expected loading conditions when wave soldered in plated through holes on a system substrate. The mounting pins are adapted for insertion into plated through holes on the system substrate. The length of the mounting pins are predetermined to account for the height of the SMT component upon which it is attached, the thickness of the system substrate, and the desired amount of mounting pin protrusion from the backside of the system substrate. The stiffening members consume very little system substrate space while retaining a platform for heat dissipation.

Abstract: Apparatus and methods for secure attachment of a heat sink to its respective retention clip as well as attachment to an electronic device are presented. One embodiment of a retention clip retention apparatus consists of a protruding hip depending from a side of a heat sink protrusion adapted to capture the retention clip between the hip and the heat sink body. One embodiment of a method for forming the hip consists of using a tool to deform the heat sink protrusion. One embodiment of heat sink lateral retention apparatus consists of one or more split bobbins adapted to attach to the retention clip to prevent lateral motion of the heat sink with respect to the clip.

Abstract: An integrated circuit (IC) has logic and timing circuits that are coupled to discrete circuitry to provide protection and indications whenever an AC adapter that is faulty or has improper voltage levels or polarity are plugged into a system. In particular, the IC device provides over-voltage, under-voltage, and reversed-polarity protections to an electronic system to keep the electronic system from being damaged by an alternating current (AC) adapter having an improper voltage range or voltage polarity. It also provides a protection that prevents an adapter from powering a host system that has a short-circuit fault.

Abstract: Apparatus and methods are presented for reinforcing and stiffening a printed circuit board (PCB) in selected locations by utilizing preferentially oriented fibers. Selected fibers within the polymeric material matrix of the PCB fiber-matrix layer are removed and replaced with a similar quantity of fibers in a preferential orientation. Various combinations of layering of modified fiber-matrix layer material with conventional fiber-matrix layer material are presented to achieve the desired PCB stiffening. Printed circuit boards, under the weight of heavy attached electronic components, may deflect or flex along an axis, defined as the characteristic fold. This flexing is exasperated with manufacturing and handling loading, particularly when mounted in a chassis. Preferentially orientated fibers laid transverse to the characteristic fold reinforces the area to resist flexure within the area surrounding the characteristic fold.

Abstract: A electronic device and method for extracting heat from a heat producing component having front and back sides, the front side is disposed across from the back side, and the front side is attached to a substrate including multiple holes. A thermal interface material is disposed over the back side of the heat producing component. A heat sink including multiple pins corresponding to the multiple holes in the substrate is disposed over the thermal interface material such that the pins are disposed through the holes. The thermal interface material melts and wets to form a thermal coupling between the back side and the heat sink when passed over pre-heaters of a wave soldering machine. Further, the pins are soldered to form solder joints between the respective pins and the substrate when passed over a solder wave in the wave soldering machine to lock-in the thermal coupling formed during the preheating of the thermal interface material to provide a low-cost thermal solution.

Abstract: Apparatus and methods for secure attachment of a heat sink to its respective retention clip as well as attachment to an electronic device are presented. One embodiment of a retention clip retention apparatus consists of a protruding hip depending from a side of a heat sink protrusion adapted to capture the retention clip between the hip and the heat sink body. One embodiment of a method for forming the hip consists of using a tool to deform the heat sink protrusion. One embodiment of heat sink lateral retention apparatus consists of one or more split bobbins adapted to attach to the retention clip to prevent lateral motion of the heat sink with respect to the clip.