Abstract: A substrate, such as a printed circuit board (PCB), has pairs of pads to which terminals of electronic components, such as capacitors, can be mounted. The pads have perimeters, for example, in the shape of rectangles, circles, or ovals. In one embodiment, to reduce asymmetrical, lateral, surface-tension forces that can cause the components to tombstone due to uneven heating of solder fillets on the pads during solder reflow, the edge of the perimeter of each pad opposite the inter-pad region contains one or more notches or indentations. Also described are an electronic assembly, an electronic system, and various methods of fabrication.

Abstract: A heatsink which includes a body having a first arm and a second arm and having a mounting area between the first arm and the second arm. The mounting area is dimensioned to hold a heat generating electronic component. The mounting area is dimensioned so that when the component is located within the mounting area, the first arm and the second arm apply opposing forces against the component so that the component is held within the mounting area by the first arm and the second arm.

Abstract: A electronic device and method for extracting heat from a heat producing component having front and back sides, the front side is disposed across from the back side, and the front side is attached to a substrate including multiple holes. A thermal interface material is disposed over the back side of the heat producing component. A heat sink including multiple pins corresponding to the multiple holes in the substrate is disposed over the thermal interface material such that the pins are disposed through the holes. The thermal interface material melts and wets to form a thermal coupling between the back side and the heat sink when passed over pre-heaters of a wave soldering machine. Further, the pins are soldered to form solder joints between the respective pins and the substrate when passed over a solder wave in the wave soldering machine to lock-in the thermal coupling formed during the preheating of the thermal interface material to provide a low-cost thermal solution.

Abstract: A heatsink which includes a body having a first arm and a second arm and having a mounting area between the first arm and the second arm. The mounting area is dimensioned to hold a heat generating electronic component. The mounting area is dimensioned so that when the component is located within the mounting area, the first arm and the second arm apply opposing forces against the component so that the component is held within the mounting area by the first arm and the second arm.

Abstract: Apparatus and methods are presented for reinforcing and stiffening a printed circuit board (PCB) in selected locations by utilizing preferentially oriented fibers. Selected fibers within the polymeric material matrix of the PCB fiber-matrix layer are removed and replaced with a similar quantity of fibers in a preferential orientation. Various combinations of layering of modified fiber-matrix layer material with conventional fiber-matrix layer material are presented to achieve the desired PCB stiffening. Printed circuit boards, under the weight of heavy attached electronic components, may deflect or flex along an axis, defined as the characteristic fold. This flexing is exasperated with manufacturing and handling loading, particularly when mounted in a chassis. Preferentially orientated fibers laid transverse to the characteristic fold reinforces the area to resist flexure within the area surrounding the characteristic fold.

Abstract: A water-free dental cream or toothpaste composition comprising 6% to 90% by total weight of one or more hydrogenated vegeteable oils, 0.02% to 25% by total weight of one or more flavoring oils or extracts, 0.1% to 60% by total weight of glycerin, 0.5% to 25% by total weight of cornstarch, 10% to 90% by total weight of one or more inorganic salts selected from the group comprising sodium bicarbonate, magnesium sulfate and sodium chloride, 0.001% to 3.5% by total weight of more or more fluorides selected from the group comprising sodium fluoride, potassium fluoride and ammonium fluoride, 0.01% to 5% by total weight of saccharin or aspartame, and 0.01% to 5% by total weight of sodium lauryl sulfate.

Abstract: A water-free dental cream or toothpaste composition comprising 6% to 90% by total weight of one or more hydrogenated vegetable oils, 0.02% to 25% by total weight of one or more flavoring oils or extracts, 0.1% to 60% by total weight of glycerin, 0.2% to 25% by total weight of cornstarch, 10% to 90% by total weight of one or more inorganic salts selected from the group comprising sodium bicarbonate, magnesium sulfate and sodium chloride, 0.001% to 3.5% by total weight of one or more flourides selected from the group comprising sodium flouride, potassium flouride and ammonium flouride, 0.01% to 5% by total weight of sacchrin or aspartame, and 0.01% to 5% by total weight of sodium lauryl sulfate.