Abstract: A wirebond-less packaged semiconductor device includes a plurality of I/O contacts, at least one semiconductor die, the semiconductor die having a bottom major surface and a top major surface, the top major surface having at least two electrically isolated electrodes, and a conductive clip system disposed over the top major surface, the clip system comprising at least two electrically isolated sections coupling the electrodes to respective I/O contacts.

Abstract: A wirebond-less packaged semiconductor device includes a plurality of I/O contacts, at least one semiconductor die, the semiconductor die having a bottom major surface and a top major surface, the top major surface having at least two electrically isolated electrodes, and a conductive clip system disposed over the top major surface, the clip system comprising at least two electrically isolated sections coupling the electrodes to respective I/O contacts.

Abstract: A wirebond-less packaged semiconductor device includes a plurality of I/O contacts, at least one semiconductor die, the semiconductor die having a bottom major surface and a top major surface, the top major surface having at least two electrically isolated electrodes, and a conductive clip system disposed over the top major surface, the clip system comprising at least two electrically isolated sections coupling the electrodes to respective I/O contacts.

Abstract: The present invention provides an optoelectronic device and a method of manufacture thereof. In one embodiment, the method of manufacturing the optoelectronic device may include creating a multilayered optical substrate and then forming a self aligned dual mask over the multilayered optical substrate. The method may further include etching the multilayered optical substrate through the self aligned dual mask to form a mesa structure.

Abstract: Laser wavelength stabilization is achieved by locating a low selectivity reference filter in a reference path of a laser beam. The low selectivity reference filter, with a periodicity greater than the control filter, is used together with a lookup table for the reference filter to resolve the uncertainty associated with the multivalued control filter. After the wavelength uncertainty for the control filter is resolved, the laser beam is stabilized based on the response of the control filter, as if the reference filter was not present.

Abstract: The present invention provides an optoelectronic device and a method of manufacture thereof. In one embodiment, the method of manufacturing the optoelectronic device may include creating a multilayered optical substrate and then forming a self aligned dual mask over the multilayered optical substrate. The method may further include etching the multilayered optical substrate through the self aligned dual mask to form a mesa structure.

Abstract: The present invention provides an optoelectronic device and a method of manufacture thereof. In one embodiment, the method of manufacturing the optoelectronic device may include creating a multilayered optical substrate and then forming a self aligned dual mask over the multilayered optical substrate. The method may further include etching the multilayered optical substrate through the self aligned dual mask to form a mesa structure.

Abstract: The present invention provides an optoelectronic device and a method of manufacture thereof. In one embodiment, the method of manufacturing the optoelectronic device may include creating a multilayered optical substrate and then forming a self aligned dual mask over the multilayered optical substrate. The method may further include etching the multilayered optical substrate through the self aligned dual mask to form a mesa structure.

Abstract: A method for electrically coupling thermoelectric cooling (TEC) elements together is described. The TEC elements are encased within an encapsulating material, such as epoxy, and a resist layer is laid on either end of the encapsulating material, covering the ends of the TEC elements. The resist layers are selectively developed to open locations in the resist layers in between adjacent elements. Conductive material, such as gold, is sputter deposited into the locations to provide electrical coupling of the elements.

Abstract: Laser wavelength stabilization is achieved by locating a low selectivity reference filter in a reference path of a laser beam. The low selectivity reference filter, with a periodicity greater than the control filter, is used together with a lookup table for the reference filter to resolve the uncertainty associated with the multivalued control filter. After the wavelength uncertainty for the control filter is resolved, the laser beam is stabilized based on the response of the control filter, as if the reference filter was not present.

Abstract: A system and method for fabricating a thermoelectric cooling (TEC) device and a semiconductor device using such a TEC device are described. Adhesive-containing support structures are used to secure, respectively, positively-doped and negatively-doped TEC elements. The elements are intermeshed and an encapsulating material is applied to the intermeshed array. The support structures are then released and the ends of the encapsulated elements are smoothed and electrically coupled together. If desired, panels are secured to the ends of the elements and a heat sink may also be provided. The TEC device may be used to control and/or tune a laser device.

Abstract: A method and apparatus are disclosed for supporting semiconductor devices on a flexible support which includes one or more thermoelectric cooling devices. The thermoelectric cooling devices, which include at least one pair of positively-doped and negatively-doped elements electrically coupled together, are positioned between a pair of flex panels. Each panel has connector sites at which connectors such as solder balls are located. The thermoelectric cooling devices may be arranged between the panels to create two or more device support areas having different temperature regimes. The thermoelectric cooling devices may be connected to the panels by placing the panels, connectors and thermoelectric cooling devices in a reflow chamber, exposing them to a reducing atmosphere, and heating to a temperature sufficient to reflow the connectors.

Abstract: A method and apparatus are disclosed for supporting semiconductor devices on a flexible support which includes one or more thermoelectric cooling devices. The thermoelectric cooling devices, which include at least one pair of positively-doped and negatively-doped elements electrically coupled together, are positioned between a pair of flex panels. Each panel has connector sites at which connectors such as solder balls are located. The thermoelectric cooling devices may be arranged between the panels to create two or more device support areas having different temperature regimes. The thermoelectric cooling devices may be connected to the panels by placing the panels, connectors and thermoelectric cooling devices in a reflow chamber, exposing them to a reducing atmosphere, and heating to a temperature sufficient to reflow the connectors.

Abstract: A system and method for fabricating a thermoelectric cooling (TEC) device and a semiconductor device using such a TEC device are described. Adhesive-containing support structures are used to secure, respectively, positively-doped and negatively-doped TEC elements. The elements are intermeshed and an encapsulating material is applied to the intermeshed array. The support structures are then released and the ends of the encapsulated elements are smoothed and electrically coupled together. If desired, panels are secured to the ends of the elements and a heat sink may also be provided. The TEC device may be used to control and/or tune a laser device.

Abstract: A method for testing the light emitted by a group of semiconductor light emitting devices arranged to emit light over a testing area, each light emitting device having a p-contact, the method including connecting a plurality of selectively connectable p-contact probes to the p-contacts of respective light emitting devices in the group of light emitting devices, selectively activating one of the light emitting devices in the group of light emitting devices to emit light over the testing area by selectively supplying a predetermined electrical current to the p-contact of the selected light emitting device via its respective p-contact probe, guiding the light emitted by the selected light emitting device via a light funnel having a collection end and a detection end, the collection end being in juxtaposition with all the light emitting devices in the group of light emitting devices, and detecting light exiting the detection end of the light funnel.

Abstract: A method for testing the light emitted by a group of semiconductor light emitting devices arranged to emit light over a testing area, each light emitting device having a p-contact, the method including connecting a plurality of selectively connectable p-contact probes to the p-contacts of respective light emitting devices in the group of light emitting devices, selectively activating one of the light emitting devices in the group of light emitting devices to emit light over the testing area by selectively supplying a predetermined electrical current to the p-contact of the selected light emitting device via its respective p-contact probe, guiding the light emitted by the selected light emitting device via a light funnel having a collection end and a detection end, the collection end being in juxtaposition with all the light emitting devices in the group of light emitting devices, and detecting light exiting the detection end of the light funnel.

Abstract: An apparatus and method for transferring a semiconductor die from an adhesive film to an output carrier is disclosed. The adhesive film and associated hoop assembly on which the die are secured are inverted so that die face downward, p-side down, from the film. And an output pack is positioned beneath the die. An ejector pin exerts a force on a side of the adhesive film opposite the side on which the semiconductor die is secured to release the die. A vacuum is provided through a port in the output pack, pulling the released die into the output pack. The transfer occurs in a single step and orients the die p-side down in the output pack, thus eliminating the control arm/vacuum collet assembly and associated handling steps of conventional transfer mechanisms.

Abstract: A system for handling semiconductor workpieces, by aligning a movable pick and place device and a movable optical control device, is disclosed. The system and method provide for the formation of an imprint by the pick and place device. The optical control device can then be aligned to that imprint, creating alignment between the pick and place device and the optical control device. Once alignment is complete the imprinted material may be replaced with one or more semiconductor workpieces. The system provides precise, repeatable alignment between the pickup point for the pick and place device and the optical control device.

Abstract: An apparatus and method for demounting parts from the adhesive upper surface of a film has a base with a tool mounted thereon. A portion of the tool has a fluted surface extending above the base upper surface. The film lower surface is positioned above the base with a part on the film overlying and opposite the fluted surface of the tool. A vacuum is supplied through at least one passage in the base to the film lower surface to draw the film around and over the tool flute and force the part to at least partially separate from the film adhesive upper surface. The part that has been separated from the adhesive upper surface of the film is stripped from the film adhesive upper surface such as by applying a vacuum force directly to the part through a collet and moving the collet and base relative to one another.

Abstract: A system is provided for trimming excess vinyl film from a hoop assembly. The hoop assembly may be used to manufacture semiconductor workpieces. The system uses a pressure applying member applied to the excess film with a bearing surface sufficient to receive such pressure on the opposite side of the excess film. The system may be rotated such that the film is trimmed around the entire hoop assembly at the position of the pressure applying member. The bearing surface may be part of the support for the system or incorporated into the hoops.