Abstract: The invention pertains to heat transfer compositions, particularly to automobile refrigerants comprising a hydrofluoroalkene, an iodocarbon, a polyol ester and at least one compound comprising trifluoromethane, methyl iodide, heptafluorobutane or propene.

Abstract: A method for removing iodine from heat transfer compositions which contain a hydrofluoroalkene, an iodocarbon, and iodine. Iodine from such heat transfer compositions by contacting the composition with activated carbon.

Abstract: Present invention relates to a process for the manufacture of fluorinated alcohols as well as borates which are employed in the manufacture of the fluorinated alcohols. Fluorinated alcohols of the formulae HOCHRCF(CF3)CHFCF(CF3)2 and HOCHRCF(CF(CF3)2)CHFCF3, HOCHRCF(CF2CF3)CH(CF3)2 and HOCHRC(CF3)2CHFCF2CF3 are made by heating a mixture of a borate of the formula (RCH2O)3B, wherein R?H or a C1 to C7 alkyl group, with perfluoro-4-methyl-2-pentene or perfluoro-2-methyl-2-pentene and a free-radical initiator to form a mixture of borates, optionally separating the mixture of borates from any reactants, solvents, and by-products; hydrolyzing the mixture of borates to form a hydrolysis product mixture; and separating the alcohols from the hydrolysis product mixture.

Abstract: Provided are fluorine-containing compounds, and polymers derived therefrom, for use in compositions used for treating textile substrates. The present invention further provides methods of making fluorine-containing compounds and polymers derived therefrom, compositions comprising the compounds and/or polymers of the present invention, methods of treating substrates, and the treated products derived therefrom.

Abstract: Provided are fluorine-containing compounds, and polymers derived therefrom, for use in compositions used for treating textile substrates. The present invention further provides methods of making fluorine-containing compounds and polymers derived therefrom, compositions comprising the compounds and/or polymers of the present invention, methods of treating substrates, and the treated products derived therefrom.

Abstract: This invention relates to a friction composition comprising oxidized or phoisphotized metal fibers and to friction elements fabricated therefrom.

Abstract: A process for forming a blend comprising a poly(phenylene ether) domains dispersed in a polyamide matrix, said process comprising the steps of:(a) forming a reaction mixture comprising a substituted or unsubstituted poly(phenylene ether), preferably one or more compatibilizers and a polyamide precursor; and(b) polymerizing said precursor to form a blend comprised polyamide matrix having poly(phenylene ether) domains dispersed therein.

Abstract: This invention relates to electrical devices in which the electrical contact areas are plated with a nickel/indium/other metal alloy.

Abstract: This invention relates to a new and improved hermetically sealed container for semiconductor and other electronic devices, to a novel sealing cover for use in fabricating the above-referenced hermetically sealed container, and to novel processes for manufacturing said container and cover wherein the cover is plated with a nickel/indium alloy in which the weight percent indium in said alloy is less than about 10 weight percent.

Abstract: An improved method of manufacturing printed circuit boards of the type in which a metal clad substrate is covered with a photoresist, the photoresist is masked with a predetermined circuit image, the photoresist is exposed and the exposed photoresist is removed to provide a circuit image on the surface of the metal, the circuit image is electroplated with a metallic etch resist and the remaining photoresist and exposed metal cladding is removed to provide a board having a metal circuit covered by a metallic etch resist, the improvement comprising a metallic etch resist composed of a nickel/indium alloy containing from about 0.1 to about 10 weight percent indium based on the total weight of the alloy.

Abstract: This invention relates to electrical devices in which the electrical contact areas are plated with a nickel/indium alloy comprising 0.1-9 percent indium, balance nickel. The nickel/indium alloy layer may be coated with a precious metal such as gold.

Abstract: A novel plating bath for plating nickel/indium alloys, which bath contains one or more buffer/chelating agents such as citric acid and citrate salts, and alloys plated from such baths which have utility in electrical applications.

Abstract: The invention relates to a novel process of etching a metal clad substrate which comprises contacting said substrate with one or more reactive gases, as for example ozone, to form one or more reaction products on the surface of the said metal which are more friable than said metal, and striking said reaction products with a plurality of abrasive particles.

Abstract: Novel catalytic electrode in which the oxidation catalyst is protected from unfavorable redox potentials by an insulation/rectification matrix composed of a polymeric matrix containing an insulating and rectifying effective amount of a dispersed redox conductor.