Abstract: Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such front end system includes a low noise amplifier in a receive path and a multi-mode power amplifier circuit in a transmit path. The low noise amplifier includes a first inductor, an amplification circuit, and a second inductor magnetically coupled to the first inductor to provide negative feedback to linearize the low noise amplifier. The multi-mode power amplifier circuit includes a stacked output stage including a transistor stack of two or more transistors. The multi-mode power amplifier circuit also includes a bias circuit configured to control a bias of at least one transistor of the transistor stack based on a mode of the multi-mode power amplifier circuit. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.

Abstract: Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such packaged module includes a multi-mode power amplifier circuit in an interior of a radio frequency shielding structure and an antenna external to the radio frequency shielding structure. The multi-mode power amplifier circuit includes a stacked output stage including a transistor stack of two or more transistors. The multi-mode power amplifier circuit also includes a bias circuit configured to control a bias of at least one transistor of the transistor stack based on a mode of the multi-mode power amplifier circuit. The radio frequency shielding structure can extend above a package substrate. The antenna can be on the package substrate. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.

Abstract: A device for bone regeneration intended to form a barrier for protecting a space above a surface of a bone, for example a tooth, to allow, after insertion of a biomaterial, which, while mineralising, will form new bone above existing bone, includes a self-supporting barrier-forming element in the shape of a dome (1) or a shell, and means for attaching the barrier-forming element above the bone surface in order thus to form a volume where the biomaterial can be arranged to mineralise and form new bone grafting itself onto the previously present bone, is characterised in that the barrier-forming element in the shape of a dome (1) or shell is made of a material, specifically a non-resorbing material, such that the barrier-forming element is radiotransparent

Abstract: Packaged modules for use in wireless devices are disclosed. A substrate supports integrated circuit die including at least a portion of a baseband system and a front end system, an oscillator assembly, and an antenna. The oscillator assembly includes an enclosure to enclose the oscillator and conductive pillars formed at least partially within a side of the enclosure to conduct signals between the top and bottom surfaces of the oscillator assembly. Components can be vertically integrated to save space and reduce trace length. Vertical integration provides an overhang volume that can include discrete components. Radio frequency shielding and ground planes within the substrate shield the front end system and antenna from radio frequency interference. Stacked filter assemblies include passive surface mount devices to filter radio frequency signals.

Abstract: Aspects of this disclosure relate to a shielded radio frequency component with an integrated antenna. An antenna can be on a first side of a multi-layer substrate and a radio frequency component can be disposed on a second side of the multi-layer substrate such that a ground plane of the multi-layer substrate is positioned between the antenna and the radio frequency component. Conductive features can be disposed around the radio frequency component and electrically connected to the ground plane. The conductive features and the ground plane can provide shielding for the radio frequency component. In certain embodiments, the conductive features can include bumps, such as solder bumps and/or copper pillars.

Abstract: Aspects of this disclosure relate to methods of radio frequency signal processing. A radio frequency signal is received at an antenna on a first side of a multi-layer substrate and a low noise amplifier is disposed on a second side of the multi-layer substrate such that a ground plane of the multi-layer substrate is positioned between the antenna and the low noise amplifier. The radio frequency signal is provided to and amplified by the low noise amplifier.

Abstract: Methods for building models that estimate compositional properties of a process may include (a) receiving data relating to a process; (b) cleaning the data by identifying and removing outlying data points from the data; and conditioning the data; (c) identifying inferential model parameters comprising a parameter selected from the group consisting of: a compositional property of the process as a model output that is not part of the data, operational constraints of the process, interactions between process variables of the chemical process, and any combination thereof; (d) building one or more inferential models based on the cleaned data and the inferential model parameters; and (e) outputting the one or more models and the corresponding validation metric.

Abstract: A method for identifying sensor drift can include: setting an autocorrelation threshold for a sensor in a long-short term memory (LSTM) model developed based on historical process measurements from an analogous sensor to a sensor; collecting measured data from the sensor; applying the LSTM model to the measured data from the sensor, wherein applying the LSTM model comprises: applying the LSTM model to the measured data from the sensor to yield LSTM predicted data; calculating key performance indicators (KPIs) of the LSTM data based on an accumulated slow drift error (ASDE) model, wherein the KPIs comprise an error, an accumulated prediction error, an accumulated slow-drift error, and an estimated autocorrelation; and identifying sensor drift when the estimated autocorrelation violates the autocorrelation threshold.

Abstract: Systems and methods for instituting redistribution of wireless clients to improve service, comprising via access point (AP), multiple APs acting in concert, and/or a central entity, in connection with a network, allowing a client to associate; deciding that an associated client should be redistributed based on a connection metric, wherein the decision is based on at least one of, a probability calculation, network metric and a threshold comparison; and via the AP, sending the associated client a trigger, wherein the trigger is at least one of, a redistribution request and a disconnect message.

Abstract: Systems and methods for instituting redistribution of wireless clients to improve service, comprising via access point (AP), multiple APs acting in concert, and/or a central entity, in connection with a network, allowing a client to associate; deciding that an associated client should be redistributed based on a connection metric, wherein the decision is based on at least one of, a probability calculation, network metric and a threshold comparison; and via the AP, sending the associated client a trigger, wherein the trigger is at least one of, a redistribution request and a disconnect message.

Abstract: Packaged modules for use in wireless devices are disclosed. A substrate supports integrated circuit die including at least a portion of a baseband system and a front end system, an oscillator assembly, and an antenna. The oscillator assembly includes an enclosure to enclose the oscillator and conductive pillars formed at least partially within a side of the enclosure to conduct signals between the top and bottom surfaces of the oscillator assembly. Components can be vertically integrated to save space and reduce trace length. Vertical integration provides an overhang volume that can include discrete components. Radio frequency shielding and ground planes within the substrate shield the front end system and antenna from radio frequency interference. Stacked filter assemblies include passive surface mount devices to filter radio frequency signals.

Abstract: The present invention provides compounds for modulating protein kinase enzymatic activity for modulating cellular activities such as proliferation, differentiation, programmed cell death, migration and chemoinvasion. More specifically, the invention provides quinazolines and quinolines which inhibit, regulate and/or modulate kinase receptor, particularly c-Met, KDR, c-Kit, flt-3 and flt-4, signal transduction pathways related to the changes in cellular activities as mentioned above, compositions which contain these compounds, and methods of using them to treat kinase-dependent diseases and conditions. The present invention also provides methods for making compounds as mentioned above, and compositions which contain these compounds.

Abstract: Aspects of this disclosure relate to methods of radio frequency signal processing. A radio frequency signal is received at an antenna on a first side of a multi-layer substrate and a low noise amplifier is disposed on a second side of the multi-layer substrate such that a ground plane of the multi-layer substrate is positioned between the antenna and the low noise amplifier. The radio frequency signal is provided to and amplified by the low noise amplifier.

Abstract: The present invention provides compounds for modulating protein kinase enzymatic activity for modulating cellular activities such as proliferation, differentiation, programmed cell death, migration and chemoinvasion. More specifically, the invention provides quinazolines and quinolines which inhibit, regulate and/or modulate kinase receptor, particularly c-Met, KDR, c-Kit, flt-3 and flt-4, signal transduction pathways related to the changes in cellular activities as mentioned above, compositions which contain these compounds, and methods of using them to treat kinase-dependent diseases and conditions. The present invention also provides methods for making compounds as mentioned above, and compositions which contain these compounds.

Abstract: A packaged module for use in a wireless communication device has a substrate supporting a crystal and a first die that includes at least a microprocessor and one or more of radio frequency transmitter circuitry and radio frequency receiver circuitry. The first die is disposed between the crystal and the substrate. An overmold encloses the first die and the crystal. The substrate also supports a second die that includes at least a power amplifier for amplifying a radio frequency input signal, where the second die is disposed on an opposite side of the substrate from the first die and the crystal.

Abstract: A method for operating a processing/manufacturing facility (e.g., processing/manufacturing facility) may comprise: collecting operational conditions in a processing/manufacturing facility from one or more automated systems and/or sensors; communicating the operational conditions to one or more of a plurality of agents that comprise an adaptive analytical model, wherein the plurality of agents comprises an agent selected from the group consisting of: a software sensor agent, a base control stability agent, an alarm agent, a transient process agent, an advanced control optimization agent, a computer vision agent, a display agent, an integrator/orchestrator agent, and any combination thereof; and deriving data, instructions for changing operational parameters of a process of the processing/manufacturing facility, and/or recommendations for changing operational parameters of the process of the processing/manufacturing facility using the adaptive analytical models of the agents.

Abstract: Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such packaged module includes a multi-mode power amplifier circuit in an interior of a radio frequency shielding structure and an antenna external to the radio frequency shielding structure. The multi-mode power amplifier circuit includes a stacked output stage including a transistor stack of two or more transistors. The multi-mode power amplifier circuit also includes a bias circuit configured to control a bias of at least one transistor of the transistor stack based on a mode of the multi-mode power amplifier circuit. The radio frequency shielding structure can extend above a package substrate. The antenna can be on the package substrate. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.

Abstract: Packaged modules for use in wireless devices are disclosed. A substrate supports integrated circuit die including at least a portion of a baseband system and a front end system, an oscillator assembly, and an antenna. The oscillator assembly includes an enclosure to enclose the oscillator and conductive pillars formed at least partially within a side of the enclosure to conduct signals between the top and bottom surfaces of the oscillator assembly. Components can be vertically integrated to save space and reduce trace length. Vertical integration provides an overhang volume that can include discrete components. Radio frequency shielding and ground planes within the substrate shield the front end system and antenna from radio frequency interference. Stacked filter assemblies include passive surface mount devices to filter radio frequency signals.

Abstract: Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such packaged module includes a low noise amplifier in an interior of a radio frequency shielding structure and an antenna external to the radio frequency shielding structure. The low noise amplifier includes a first inductor, an amplification circuit, and a second inductor magnetically coupled to the first inductor to provide negative feedback to linearize the low noise amplifier. The radio frequency shielding structure can extend above a package substrate. The antenna can be on the package substrate. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.