Abstract: Non-volatile memory cells store a level of charge corresponding to the data being stored in a dielectric material storage element that is sandwiched between a control gate and the semiconductor substrate surface over channel regions of the memory cells. More than two memory states are provided by one of more than two levels of charge being stored in a common region of the dielectric material. More than one such common region may be included in each cell. In one form, two such regions are provided adjacent source and drain diffusions in a cell that also includes a select transistor positioned between them.

Abstract: Steering and bit lines (of a flash EEPROM system, for example) are segmented along columns of a memory cell array. In one embodiment, the steering and bit lines of one of their segments are connected at a time to respective global steering and bit lines. The number of rows of memory cells included in individual steering gate segments is a multiple of the number of rows included in individual bit line segments in order to have fewer steering gate segments. This saves considerable circuit area by reducing the number of segment selecting transistors necessary for the steering gates, since these transistors must be larger than those used to select bit line segments in order to handle higher voltages. In another embodiment, local steering gate line segments are combined in order to reduce their number, and the reduced number of each segment is then connected directly with an address decoder, without the necessity of a multiplicity of large switching transistors outside of the decoder to select the segment.

Abstract: Steering and bit lines (of a flash EEPROM system, for example) are segmented along columns of a memory cell array. In one embodiment, the steering and bit lines of one of their segments are connected at a time to respective global steering and bit lines. The number of rows of memory cells included in individual steering gate segments is a multiple of the number of rows included in individual bit line segments in order to have fewer steering gate segments. This saves considerable circuit area by reducing the number of segment selecting transistors necessary for the steering gates, since these transistors must be larger than those used to select bit line segments in order to handle higher voltages. In another embodiment, local steering gate line segments are combined in order to reduce their number, and the reduced number of each segment is then connected directly with an address decoder, without the necessity of a multiplicity of large switching transistors outside of the decoder to select the segment.

Abstract: An EEPROM system having an array of memory cells that individually include two floating gates, bit line source and drain diffusions extending along columns, steering gates also extending along columns and select gates forming word lines along rows of floating gates. The dual gate cell increases the density of data that can be stored. Rather than providing a separate steering gate for each column of floating gates, an individual steering gate is shared by two adjacent columns of floating gates that have a diffusion between them. Processing methods of forming such a cell array include two etching steps to separate strips of conductive material into individual floating gates that are self-aligned with source/drain diffusions and other gate elements. In one embodiment, this is accomplished by two etching steps with separate masks.

Abstract: In a non-volatile memory, the displacement current generated in non-selected word lines that results when the voltage levels on an array's bit lines are changed can result in disturbs. Techniques for reducing these currents are presented. In a first aspect, the number of cells being simultaneously programmed on a word line is reduced. In a non-volatile memory where an array of memory cells is composed of a number of units, and the units are combined into planes that share common word lines, the simultaneous programming of units within the same plane is avoided. Multiple units may be programmed in parallel, but these are arranged to be in separate planes. This is done by selecting the number of units to be programmed in parallel and their order such that all the units programmed together are from distinct planes, by comparing the units to be programmed to see if any are from the same plane, or a combination of these.

Abstract: An EEPROM system having an array of memory cells that individually include two floating gates, bit line source and drain diffusions extending along columns, steering gates also extending along columns and select gates forming word lines along rows of floating gates. The dual gate cell increases the density of data that can be stored. Rather than providing a separate steering gate for each column of floating gates, an individual steering gate is shared by two adjacent columns of floating gates that have a diffusion between them. The steering gate is thus shared by two floating gates of different but adjacent memory cells.

Abstract: An EEPROM system having an array of memory cells that individually include two floating gates, bit line source and drain diffusions extending along columns, steering gates also extending along columns and select gates forming word lines along rows of floating gates. The dual gate cell increases the density of data that can be stored. Rather than providing a separate steering gate for each column of floating gates, an individual steering gate is shared by two adjacent columns of floating gates that have a diffusion between them. The steering gate is thus shared by two floating gates of different but adjacent memory cells.

Abstract: An EEPROM system having an array of memory cells that individually include two floating gates, bit line source and drain diffusions extending along columns, steering gates also extending along columns and select gates forming word lines along rows of floating gates. The dual gate cell increases the density of data that can be stored. Rather than providing a separate steering gate for each column of floating gates, an individual steering gate is shared by two adjacent columns of floating gates that have a diffusion between them. The steering gate is thus shared by two floating gates of different but adjacent memory cells.

Abstract: An EEPROM system having an array of memory cells that individually include two floating gates, bit line source and drain diffusions extending along columns, steering gates also extending along columns and select gates forming word lines along rows of floating gates. The dual gate cell increases the density of data that can be stored. Rather than providing a separate steering gate for each column of floating gates, an individual steering gate is shared by two adjacent columns of floating gates that have a diffusion between them. Processing methods of forming such a cell array include two etching steps to separate strips of conductive material into individual floating gates that are self-aligned with source/drain diffusions and other gate elements. In one embodiment, this is accomplished by two etching steps with separate masks.

Abstract: As a specific application of a new memory architecture, an array of non-volatile dual floating gate memory cells is arranged on a semiconductor substrate with global bit lines extending in a column direction that are either permanently connected, or connectable through transistor switches, to short source and drain diffusions that are oriented in the row direction between the global bit lines. Multiple columns of memory cells are positioned between the global bit lines. Bit selection lines oriented in the column direction are connected to the gates of select transistors within the memory cells. Word lines individually extend over one or two rows of floating gates. This arrangement provides a very small array that allows for future scaling. It also enables the use of metal lines strapped to the global bit line diffusions, and to polysilicon word lines to reduce their resistance, without imposing their larger pitch on other array elements.

Abstract: A flash EEPROM is organized on an integrated circuit with individual erase gates being shared by two adjacent blocks (sectors) of memory cells. This reduces the number of erase gates and the complexity of the driving erase circuitry. Each of the two adjacent blocks are individually addressable for erasing. The control gates of the cells within the block that is not to be erased are held at a voltage close to that of the common erase gate, thus preventing their storage states from being disturbed. At the same time, the control gates of the block to be erased are held at a voltage that differs sufficiently from that of the erase gate to cause the erasure. In order to minimize the magnitude of the erase voltages, voltages applied to the common erase gate and the control gates of the block to be erased are substantially equal and of opposite polarities.

Abstract: A memory system having a two dimensional array of EEPROM or Flash EEPROM cells is addressable by rows and columns. A word line is connected to the control gates of all the cells in each row, an erase line is connected to all the erase gates of each sector of cells, and a pair of bit lines are connected respectively to all the sources and drains of each column of cells. The memory system incorporates a word line current detector and an erase line current detector in addition to the usual bit line current detectors. The leakage current of each of the lines are measured after predetermined memory events such as program or erase operations. When a defective row or column is detected, it is electrically isolated from other columns by programming and is mapped out and replaced. Data recovery schemes include reading a defective column by a switched-memory-source-drain technique.

Abstract: A flash EEPROM is organized on an integrated circuit with individual erase gates being shared by two adjacent blocks (sectors) of memory cells. This reduces the number of erase gates and the complexity of the driving erase circuitry. Each of the two adjacent blocks are individually addressable for erasing. The control gates of the cells within the block that is not to be erased are held at a voltage close to that of the common erase gate, thus preventing their storage states from being disturbed. At the same time, the control gates of the block to be erased are held at a voltage that differs sufficiently from that of the erase gate to cause the erasure. In order to minimize the magnitude of the erase voltages, voltages applied to the common erase gate and the control gates of the block to be erased are substantially equal and of opposite polarities.

Abstract: A memory system having a two dimensional array of EEPROM or Flash EEPROM cells is addressable by rows and columns. A word line is connected to the control gates of all the cells in each row, an erase line is connected to all the erase gates of each sector of cells, and a pair of bit lines are connected respectively to all the sources and drains of each column of cells. The memory system incorporates a word line current detector and an erase line current detector in addition to the usual bit line current detectors. The leakage current of each of the lines are measured after predetermined memory events such as program or erase operations. When a defective row or column is detected, it is electrically isolated from other columns by programming and is mapped out and replaced. Data recovery schemes include reading a defective column by a switched-memory-source-drain technique.