Abstract: The air-cooled thermal management of a fuel cell stack is disclosed. One disclosed embodiment comprises a cooling plate apparatus for an air-cooled fuel cell stack, where the cooling plate comprises a body configured to receive heat from one or more fuel cells in thermal communication with the body, and airflow channels formed in the body and configured to allow a flow of a cooling air to pass across the body. An insulating structure is disposed in the airflow channels, wherein the insulating structure has decreasing thickness from a cooling air inlet toward a cooling air outlet.

Abstract: The air-cooled thermal management of a fuel cell stack is disclosed. One disclosed embodiment comprises a cooling plate apparatus for an air-cooled fuel cell stack, where the cooling plate comprises a body configured to receive heat from one or more fuel cells in thermal communication with the body, and airflow channels formed in the body and configured to allow a flow of a cooling air to pass across the body. An insulating structure is disposed in the airflow channels, wherein the insulating structure has decreasing thickness from a cooling air inlet toward a cooling air outlet.

Abstract: Reactant supply and effluent storage cartridges adapted for use with a closed liquid feed fuel cell system, as well as closed liquid feed fuel cell systems. The cartridge includes at least first and second volumes and comprises: a first reactant reservoir for holding a first reactant, the first reactant reservoir being configured to occupy substantially all of the first volume when filled with the first reactant; a second reactant reservoir for holding a second reactant, the second reactant reservoir being configured to occupy substantially all of the second volume when filled with the second reactant; and an effluent reservoir for holding effluent produced by the fuel cell system, the effluent reservoir being configured to occupy, when filled with the effluent produced by the fuel cell system, a portion of the first volume, a portion of the second volume, or a portion of the first and second volumes. The reactant supply cartridge of may further comprise an electrolyte reservoir for holding an electrolyte.

Abstract: Reactant supply and effluent storage cartridges adapted for use with a closed liquid feed fuel cell system, as well as closed liquid feed fuel cell systems. The cartridge includes at least first and second volumes and comprises: a first reactant reservoir for holding a first reactant, the first reactant reservoir being configured to occupy substantially all of the first volume when filled with the first reactant; a second reactant reservoir for holding a second reactant, the second reactant reservoir being configured to occupy substantially all of the second volume when filled with the second reactant; and an effluent reservoir for holding effluent produced by the fuel cell system, the effluent reservoir being configured to occupy, when filled with the effluent produced by the fuel cell system, a portion of the first volume, a portion of the second volume, or a portion of the first and second volumes. The reactant supply cartridge of may further comprise an electrolyte reservoir for holding an electrolyte.

Abstract: The present invention provides an apparatus for performing biological reactions on a substrate layer having a multiplicity of oligonucleotide binding sites disposed thereon. The invention provides a hybridization chamber wherein nucleic acid hybridization is performed by reacting biological material on a biochip comprising a substrate having an array of oligonucleotide binding sites. The binding sites are associated with an array of 3-dimensional polyacrylamide pads for anchoring the reactants. The arrays are covered with a flexible layer that permits mixing of the hybridization solution on the biochip and detection of hybridization in situ. Fluid inlet and outlet ports in the chamber provide for control of fluid flow into and out of the chamber.

Abstract: The present invention provides a method and an improved apparatus for removing gas bubbles from a reaction chamber comprising a flexible layer removably affixed to a substrate layer having a multiplicity of oligonucleotide binding sites disposed thereon, in which biological reactions are performed. The invention specifically relates to methods and apparatus for removing gas bubbles from a reaction chamber wherein target molecules contained in a sample fluid are reacted with probe molecules immobilized on a substrate having an array of oligonucleotide binding sites. The arrays are covered with a flexible, gas permeable layer that permits mixing of the sample fluid on the biochip and removal of gas bubbles from the fluid by use of a means for facilitating diffusion of gas bubbles across the flexible, gas permeable layer.

Abstract: The present invention relates to an apparatus for performing biological reactions. Specifically, the invention relates to an apparatus for performing nucleic acid hybridization reactions on a substrate layer having a multiplicity of oligonucleotide binding sites disposed thereon, using substrates with flexible covers.

Abstract: The present invention relates to an apparatus for performing biological reactions. Specifically, the invention relates to an apparatus for performing nucleic acid hybridization reactions on a substrate layer having a multiplicity of oligonucleotide binding sites disposed thereon, using substrates with flexible covers.

Abstract: The present invention provides an apparatus for performing biological reactions on a substrate layer having a multiplicity of oligonucleotide binding sites disposed thereon. The invention provides a hybridization chamber wherein nucleic acid hybridization is performed by reacting biological material on a biochip comprising a substrate having an array of oligonucleotide binding sites. The binding sites are associated with an array of 3-dimensional polyacrylamide pads for anchoring the reactants. The arrays are covered with a flexible layer that permits mixing of the hybridization solution on the biochip and detection of hybridization in situ. Fluid inlet and outlet ports in the chamber provide for control of fluid flow into and out of the chamber.

Abstract: The present invention provides a method and an improved apparatus for removing gas bubbles from a reaction chamber comprising a flexible layer removably affixed to a substrate layer having a multiplicity of oligonucleotide binding sites disposed thereon, in which biological reactions are performed. The invention specifically relates to methods and apparatus for removing gas bubbles from a reaction chamber wherein target molecules contained in a sample fluid are reacted with probe molecules immobilized on a substrate having an array of oligonucleotide binding sites. The arrays are covered with a flexible, gas permeable layer that permits mixing of the sample fluid on the biochip and removal of gas bubbles from the fluid by use of a means for facilitating diffusion of gas bubbles across the flexible, gas permeable layer.

Abstract: A semiconductor component includes a semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501) having first and second surfaces opposite each other, a semiconductor device (301) in the semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501), and a flexible substrate (120, 401, 510, 610, 710, 1000, 1050, 1300, 1401, 1510, 1520) packaging the semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501).

Abstract: An electronic component includes a substrate (11) having a device surface (13) and opposite ends (14, 15) adjacent to the device surface (13), an electronic device (16) supported by the device surface (13), and an interconnect substrate (30) overlying a first end (14) of the substrate (11) and electrically coupled to the electronic device (16). The electronic component can be manufactured by inserting the second end (15) of the substrate (11) into one of a plurality of holes (23) in a carrier (20) wherein the device surface (13) and the carrier (20) form an angle greater than approximately five degrees.

Abstract: A method for making moisture resistant semiconductor devices having organic substrates targets each of the potentially critical interfaces within a semiconductor device having the potential for delamination and cracking. An organic substrate (110) is designed to include a solid pad (116) having a chemically created oxide layer (118) formed thereon. A silicone-based die attach material (108) is dispensed and gelled very soon after dispensing to prevent excessive bleed. A semiconductor die (102) is mounted to the substrate after undergoing a cleaning operation to remove contaminants from the backside of the die. Prior to molding compound encapsulation and subsequent to die attach material cure, the substrate is cleaned to improve adhesion to the die attach material fillet (122).

Abstract: An electronic component includes a substrate (11) having a device surface (13) and opposite ends (14, 15) adjacent to the device surface (13), an electronic device (16) supported by the device surface (13), and an interconnect substrate (30) overlying a first end (14) of the substrate (11) and electrically coupled to the electronic device (16). The electronic component can be manufactured by inserting the second end (15) of the substrate (11) into one of a plurality of holes (23) in a carrier (20) wherein the device surface (13) and the carrier (20) form an angle greater than approximately five degrees.

Abstract: A method for gettering metallic impurities from a semiconductor substrate (25). A gettering structure is fabricated in inactive areas of a semiconductor chip (31). The gettering structure is manufactured by forming an oxide (30) having a bird's head structure contacting a heavily doped region (28). The combination creates precipitation nuclei to which the metallic impurities migrate. The metallic impurities are sequestered by the precipitation nuclei or trap sites and rendered incapable of degrading the electrical characteristics of a semiconductor device.

Abstract: A semiconductor chip is flip chip bonded to a substrate having a cavity or a through hole formed therein. The cavity or through hole is preferably large enough to substantially remove the narrow gap which is formed between the portion of the substrate which does not have the cavity or through hole formed therein. This allows for use of mold processes to encapsulate and underfill the semiconductor chip and for line of sight cleaning of the semiconductor chip after bonding.

Abstract: A container such as a jerry can can be produced with one or more handles molded with the blow molded body of the container. This invention eliminates the need for separate injection molded inserts. A first pair of molds, and a second pair of molds having a lower and upper section, are used in the apparatus to close a top portion and a bottom and/or draped portions of a standard parison.

Abstract: An improved semiconductor die for plastic encapsulated semiconductor device packages which impedes the inherent delamination caused by the differing expansion coefficients of the semiconductor die and plastic encapsulation. Rounded or tapered die corners and die edges decrease the stress from the plastic encapsulation that acts upon the semiconductor die. This reduced stress slows the delamination progression and leaves the operational circuitry unaffected for an increased period of time thereby increasing device lifetime.

Abstract: Method of reducing the viscosity of a fracturing fluid containing a polymer by introducing both delayed breaker and nondelayed breaker into the fracturing fluid. Preferably, the relative amounts of delayed and undelayed breaker are determined by first determining the concentration of polymer in the fracture, determining the relationship of breaker concentration for a polymer concentration to proppant pack permeability, picking a desired proppant pack permeability, calculating the amount of breaker necessary to lessen the viscosity of the polymer concentration in the fracture to the desired permeability. This amount of breaker is X. Next, the minimum viscosity of the fracturing fluid which maintains the proppant in suspension in the fracture is determined. The amount of breaker Y which lessens the viscosity of the fracturing fluid no lower than this minimum viscosity is calculated for the bottom hole static temperature and an interval of time.

Abstract: A semiconductor package wherein a semiconductor die is disposed in packaging material and electrically coupled to leads having portions extending from the packaging material. The portions of the leads that extend from the packaging material are adhered to the outside of the packaging material and release therefrom when subjected to a predetermined amount thermal stress. The invention disclosed herein allows consistent alignment of flexible leads while adequately reducing stress caused by the differing coefficients of thermal expansion of the semiconductor package and a printed circuit or the like on which the package is mounted.