Abstract: An improved semiconductor die for plastic encapsulated semiconductor devices which impedes the inherent delamination caused by the differing expansion coefficients of the semiconductor die and plastic encapsulation. Topological configurations are processed in the die corners of the semiconductor die which are void of circuitry. The topological configurations act as barriers and slow the delamination progression. This leaves the operational circuitry unaffected for an increased time thereby increasing device lifetime.

Abstract: A molded semiconductor package having a flagless leadframe wherein a semiconductor die is disposed in or above a die opening of a leadframe. This allows for thin, symmetrical packages and packages having a minimum number of material interfaces to be manufactured because no leadframe flags and minimal die bond material are employed. The present invention further includes guard rings to protect high stress areas of the semiconductor die from damage and heat spreaders to more effectively spread heat dissipated by the semiconductor die.

Abstract: A modular packaging structure consisting of a plurality of modules, each capable of performing different functions, coupled to a central core. The modules are comprised of a pair of half semiconductor wafers bonded together. Each wafer contains a plurality of semiconductor devices inset in the wafer and having interconnect lines connecting the devices to the wafer. The module has a plurality of contacts along the straight edge to allow coupling. The straight edge of the module is inserted into a core of the modular computer. The core acts as a power and signal bus to the modules and serves to clamp the modules in place. A slot in the core is left for the external electrical connections. A cooling manifold can be disposed about the modules to provide air cooling. The structure is then placed in a housing having a fan to pump air through the cooling manifold.

Abstract: A semiconductor die for plastic encapsulation having an adhesion promoter selectively disposed on an outer surface enabling better adhesion between the semiconductor die and a plastic encapsulation. The improved adhesion allows for less relative motion between the semiconductor die and the plastic encapsulation. The reduction of relative motion significantly decreases the delamination progression throughout the semiconductor device and allows for an increased semiconductor device lifetime.

Abstract: A leadframe including a plurality of rails connected directly to input leads and output leads. A plurality of chips can be mounted directly to the plurality of rails forming a rail bonded multi-chip device. Wire bonding can occur directly from the chips to the plurality of rails which function as a heat sink. The resultant multi-chip device is simple, inexpensive, and easy to manufacture.