Patents by Inventor George Wayne Nation

George Wayne Nation has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8924779
    Abstract: An apparatus for handling anomalies in a hardware system including a master device and at least one slave device coupled with the master device through an interconnect device is provided. The apparatus includes at least one controller operative to receive status information relating to the slave device. The status information is indicative of whether an anomaly is present in the slave device and/or the interconnect device. The controller is operative to generate output response information as a function of the status information relating to the slave device for detecting and/or responding to hardware system anomalies in a manner which reduces a need for resetting the hardware system to return to normal operation.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: December 30, 2014
    Assignee: LSI Corporation
    Inventors: George Wayne Nation, Gary M. Lippert, Srinivasa Rao Kothamasu
  • Publication number: 20130262918
    Abstract: An apparatus for handling anomalies in a hardware system including a master device and at least one slave device coupled with the master device through an interconnect device is provided. The apparatus includes at least one controller operative to receive status information relating to the slave device. The status information is indicative of whether an anomaly is present in the slave device and/or the interconnect device. The controller is operative to generate output response information as a function of the status information relating to the slave device for detecting and/or responding to hardware system anomalies in a manner which reduces a need for resetting the hardware system to return to normal operation.
    Type: Application
    Filed: March 30, 2012
    Publication date: October 3, 2013
    Applicant: LSI CORPORATION
    Inventors: George Wayne Nation, Gary M. Lippert, Srinivasa Rao Kothamasu
  • Patent number: 8484608
    Abstract: A process is disclosed for configuring a base platform having ASIC and FPGA modules to perform a plurality of functions. A verified RTL hardware description of a circuit is mapped and annotated to identify memory programmable functions. The memory programmable functions are grouped for assignment to FPGA modules. The non-memory programmable functions are synthesized to ASIC modules, and the memory programmable functions are synthesized to FPGA modules. Placement, signal routing and boundary timing closure are completed and the platform is configured by adding metallization layer(s) to configure the ASIC modules and creating a firmware memory to configure the FPGA modules. An over-provisioning feature in the FPGA modules permits post-fabrication alteration of logic functions.
    Type: Grant
    Filed: October 9, 2009
    Date of Patent: July 9, 2013
    Assignee: LSI Corporation
    Inventors: Gary S. Delp, George Wayne Nation
  • Publication number: 20130111181
    Abstract: A data processing system comprises a device and device access circuitry. The device is mapped to a first mapped address region and to a second mapped address region. The device access circuitry, in turn, is operative to access the device in accordance with a first set of memory attributes when addressing the device within the first mapped address region and to access the device in accordance with a second set of memory attributes when addressing the device within the second mapped address region. The first set of memory attributes is different from the second set of memory attributes.
    Type: Application
    Filed: October 31, 2011
    Publication date: May 2, 2013
    Applicant: LSI CORPORATION
    Inventors: Srinivasa Rao Kothamasu, George Wayne Nation, Krishna Venkanna Bhandi
  • Patent number: 7831653
    Abstract: A partially manufactured semiconductor chip comprising a slice and a number of shells is a template for a communication and networking chip. The slice has a number of I/O ports, blocks, and PHYs. The hardmac PHYs are established to correspond to a high speed data transmission protocol. The interior of the template comprises logic gate arrays and configurable memory. Once particular protocols of data receipt and transmission are selected, the logic gate arrays and configurable memory can be programmed and otherwise configured to develop protocol layers for data networking and communication.
    Type: Grant
    Filed: December 13, 2002
    Date of Patent: November 9, 2010
    Assignee: LSI Corporation
    Inventors: George Wayne Nation, Gary Scott Delp, William D. Scharf, Narayanan Raman, John N. Fryar, III, Majid Bemanian
  • Patent number: 7684326
    Abstract: Methods and structure for standardized, high-speed serial communication to reduce memory capacity requirements within receiving elements of a high-speed serial communication channel. In an exemplary SPI compliant embodiment of the invention, the semantic meaning of the STARVING, HUNGRY and SATISFIED flow control states is modified to allow the transmitting and receiving elements to manage buffer storage in a more efficient manner to thereby reduce memory capacity requirements while maintaining the integrity of flow control contracts and commitments. The methods and structure further provide for generation of storage metric information to dynamically update the flow control status information asynchronously with respect to data packet transmissions.
    Type: Grant
    Filed: October 17, 2007
    Date of Patent: March 23, 2010
    Assignee: LSI Corporation
    Inventors: George Wayne Nation, Gurumani Senthil, Gary Scott Delp
  • Publication number: 20100031222
    Abstract: A process is disclosed for configuring a base platform having ASIC and FPGA modules to perform a plurality of functions. A verified RTL hardware description of a circuit is mapped and annotated to identify memory programmable functions. The memory programmable functions are grouped for assignment to FPGA modules. The non-memory programmable functions are synthesized to ASIC modules, and the memory programmable functions are synthesized to FPGA modules. Placement, signal routing and boundary timing closure are completed and the platform is configured by adding metallization layer(s) to configure the ASIC modules and creating a firmware memory to configure the FPGA modules. An over-provisioning feature in the FPGA modules permits post-fabrication alteration of logic functions.
    Type: Application
    Filed: October 9, 2009
    Publication date: February 4, 2010
    Applicant: LSI CORPORATION
    Inventors: Gary S. Delp, George Wayne Nation
  • Publication number: 20090313416
    Abstract: A main memory for a computer system comprises a controller including an interface to one or more processors, non-volatile memory, and volatile memory. The main memory comprises one or more contiguous range of real addresses supported by both the non-volatile memory and the volatile memory. The controller may be incorporated into a mainboard and the non-volatile memory and the volatile memory may comprise pluggable memory modules. Alternatively, the controller may be incorporated into a hybrid pluggable memory module including non-volatile memory and volatile memory. The controller may utilize the volatile memory as a cache for the non-volatile memory. One or more subsets of the non-volatile memory may be configured to contain a system image, an operating system managed emulated disk image, and/or an operating system managed a page-file. The controller may encrypt and/or compress data written to and/or decrypt and/or decompress data read from the non-volatile memory.
    Type: Application
    Filed: June 16, 2008
    Publication date: December 17, 2009
    Inventor: George Wayne Nation
  • Patent number: 7620924
    Abstract: A process is disclosed for configuring a base platform having ASIC and FPGA modules to perform a plurality of functions. A verified RTL hardware description of a circuit is mapped and annotated to identify memory programmable functions. The memory programmable functions are grouped for assignment to FPGA modules. The non-memory programmable functions are synthesized to ASIC modules, and the memory programmable functions are synthesized to FPGA modules. Placement, signal routing and boundary timing closure are completed and the platform is configured by adding metallization layer(s) to configure the ASIC modules and creating a firmware memory to configure the FPGA modules. An over-provisioning feature in the FPGA modules permits post-fabrication alteration of logic functions.
    Type: Grant
    Filed: March 14, 2005
    Date of Patent: November 17, 2009
    Assignee: LSI Corporation
    Inventors: Gary S. Delp, George Wayne Nation
  • Patent number: 7491579
    Abstract: An SIP for performing a plurality of hard and soft functions comprises standard IC die and custom platforms mounted to a substrate. Die are identified for each standard hard function, such as memory, processing, I/O and other standard functions and one or more user-configurable base platforms are selected that, when configured, execute the custom soft functions. Optionally, the substrate is laminated to the die and the platforms are attached to the substrate. Testing is performed by defining the configured base platforms coupled to logic representing the die and their connections and performing placement and timing closure on the combination.
    Type: Grant
    Filed: March 14, 2005
    Date of Patent: February 17, 2009
    Assignee: LSI Corporation
    Inventors: Gary S. Delp, George Wayne Nation
  • Patent number: 7430725
    Abstract: A set of tools is provided herein that produces useful, proven, and correct integrated semiconductor chips. Having as input either a customer's requirements for a chip, or a design specification for a partially manufactured semiconductor chip, the tools generate the RTL for control plane interconnect; memory composition, test, and manufacture; embedded logic analysis, trace interconnection, and utilization of spare resources on the chip; I/O qualification, JTAG, boundary scan, and SSO analysis; testable clock generation, control, and distribution; interconnection of all of the shared logic in a testable manner from a transistor fabric and/or configurable blocks in the slice. The input customer requirements are first conditioned by RTL analysis tools to quickly implement its logic. The slice definition and the RTL shell provides the correct logic for a set of logic interfaces for the design specification to connect. The tools share a common database so that logical interactions do not require multiple entries.
    Type: Grant
    Filed: June 18, 2005
    Date of Patent: September 30, 2008
    Assignee: LSI Corporation
    Inventors: Robert Neal Carlton Broberg, III, Jonathan William Byrn, Gary Scott Delp, Michael K. Eneboe, Gary Paul McClannahan, George Wayne Nation, Paul Gary Reuland, Thomas Sandoval, Matthew Scott Wingren
  • Patent number: 7379422
    Abstract: A networking/communication chip having a receiving buffer or FIFO whereby it receives data from a data source across a network and transfers the data to a host system. The memory in the host system acts as a logical extension of the receiving buffer in the chip; in this way, the host system controls the flow of data from the source, rather than the control flow being based on the capacity of the receiving buffer in the networking/communication chip. The networking/communication chip may be a controller, such as a 10 Gigabit Ethernet controller, wherein data received from the source in one protocol is transformed to a second protocol input to the host. If either or both the networking/communication chip or the host system is/are made of FPGAs, it/they can be reprogrammed to disable the flow control in the networking/communication chip and enable flow control in the host system. Data flow is enhanced because memory in the host system typically is much larger than memory in the networking/communication chip.
    Type: Grant
    Filed: December 20, 2002
    Date of Patent: May 27, 2008
    Assignee: LSI Logic Corporation
    Inventor: George Wayne Nation
  • Patent number: 7301906
    Abstract: Methods and structure for standardized, high-speed serial communication to reduce memory capacity requirements within receiving elements of a high-speed serial communication channel. In an exemplary SPI compliant embodiment of the invention, the semantic meaning of the STARVING, HUNGRY and SATISFIED flow control states is modified to allow the transmitting and receiving elements to manage buffer storage in a more efficient manner to thereby reduce memory capacity requirements while maintaining the integrity of flow control contracts and commitments. The methods and structure further provide for generation of storage metric information to dynamically update the flow control status information asynchronously with respect to data packet transmissions.
    Type: Grant
    Filed: August 30, 2002
    Date of Patent: November 27, 2007
    Assignee: LSI Corporation
    Inventors: George Wayne Nation, Gurumani Senthil, Gary Scott Delp
  • Patent number: 7069523
    Abstract: A tool for designing integrated circuits that optimizes the placement and timing of memory blocks within the circuit. Given a manufactured slice that has a number of blocks already diffused and logically integrated, the memory generation tool herein automatically considers the available diffused memory and the gate array of the slices to configure and optimize them into a customer's requirements for memory. The memory generation tool has a memory manager, a memory resource database, a memory resource selector, and a memory composer. Together these all interact to generate memories from the available memories within the memory resource database. The memory composer actually generates the RTL logic shells for the memories, and outputs the memory designs in Verilog, VHDL, or other tool synthesis language. Once a memory is created, it is tested.
    Type: Grant
    Filed: December 13, 2002
    Date of Patent: June 27, 2006
    Assignee: LSI Logic Corporation
    Inventors: George Wayne Nation, Gary Scott Delp, Paul Gary Reuland
  • Patent number: 7055113
    Abstract: A set of tools is provided herein that produces useful, proven, and correct integrated semiconductor chips. Having as input either a customer's requirements for a chip, or a design specification for a partially manufactured semiconductor chip, the tools generate the RTL for control plane interconnect; memory composition, test, and manufacture; embedded logic analysis, trace interconnection, and utilization of spare resources on the chip; I/O qualification, JTAG, boundary scan, and SSO analysis; testable clock generation, control, and distribution; interconnection of all of the shared logic in a testable manner from a transistor fabric and/or configurable blocks in the slice. The input customer requirements are first conditioned by RTL analysis tools to quickly implement its logic. The slice definition and the RTL shell provides the correct logic for a set of logic interfaces for the design specification to connect. The tools share a common database so that logical interactions do not require multiple entries.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: May 30, 2006
    Assignee: LSI Logic Corporation
    Inventors: Robert Neal Carlton Broberg, III, Jonathan William Byrn, Gary Scott Delp, Michael K. Eneboe, Gary Paul McClannahan, George Wayne Nation, Paul Gary Reuland, Thomas Sandoval, Matthew Scott Wingren
  • Patent number: 6823502
    Abstract: A tool for designing an integrated circuit and semiconductor product that generates correct RTL for I/O buffer structures in consideration of the requirements of diffused configurable I/O blocks and/or I/O hardmacs of the product. Given either a slice description of a partially manufactured semiconductor product, a designer can generate the I/O resources of an application set. Then given an application set having a transistor fabric, and the diffused configurable I/O blocks and/or the I/O hardmacs, and a plurality of accompanying shells, the I/O generation tool herein automatically reads a database having the slice description and generates the I/O buffer structures from the transistor fabric. The I/O generation tool further conditions and integrates input from either or both customer having her/his own logic and requesting a specific semiconductor product or from IP cores with their preestablished logic.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: November 23, 2004
    Assignee: LSI Logic Corporation
    Inventors: Matthew Scott Wingren, George Wayne Nation, Gary Scott Delp, Jonathan William Byrn
  • Publication number: 20040128626
    Abstract: A tool for designing an integrated circuit and semiconductor product that generates correct RTL for I/O buffer structures in consideration of the requirements of diffused configurable I/O blocks and/or I/O hardmacs of the product. Given either a slice description of a partially manufactured semiconductor product, a designer can generate the I/O resources of an application set. Then given an application set having a transistor fabric, and the diffused configurable I/O blocks and/or the I/O hardmacs, and a plurality of accompanying shells, the I/O generation tool herein automatically reads a database having the slice description and generates the I/O buffer structures from the transistor fabric. The I/O generation tool further conditions and integrates input from either or both customer having her/his own logic and requesting a specific semiconductor product or from IP cores with their preestablished logic.
    Type: Application
    Filed: December 31, 2002
    Publication date: July 1, 2004
    Applicant: LSI Logic Corporation
    Inventors: Matthew Scott Wingren, George Wayne Nation, Gary Scott Delp, Jonathan William Byrn
  • Publication number: 20040128641
    Abstract: A set of tools is provided herein that produces useful, proven, and correct integrated semiconductor chips. Having as input either a customer's requirements for a chip, or a design specification for a partially manufactured semiconductor chip, the tools generate the RTL for control plane interconnect; memory composition, test, and manufacture; embedded logic analysis, trace interconnection, and utilization of spare resources on the chip; I/O qualification, JTAG, boundary scan, and SSO analysis; testable clock generation, control, and distribution; interconnection of all of the shared logic in a testable manner from a transistor fabric and/or configurable blocks in the slice. The input customer requirements are first conditioned by RTL analysis tools to quickly implement its logic. The slice definition and the RTL shell provides the correct logic for a set of logic interfaces for the design specification to connect. The tools share a common database so that logical interactions do not require multiple entries.
    Type: Application
    Filed: December 31, 2002
    Publication date: July 1, 2004
    Applicant: LSI Logic Corporation
    Inventors: Robert Neal Carlton Broberg, Jonathan William Byrn, Gary Scott Delp, Michael K. Eneboe, Gary Paul McClannahan, George Wayne Nation, Paul Gary Reuland, Thomas Sandoval, Matthew Scott Wingren
  • Publication number: 20040120334
    Abstract: A networking/communication chip having a receiving buffer or FIFO whereby it receives data from a data source across a network and transfers the data to a host system. The memory in the host system acts as a logical extension of the receiving buffer in the chip; in this way, the host system controls the flow of data from the source, rather than the control flow being based on the capacity of the receiving buffer in the networking/communication chip. The networking/communication chip may be a controller, such as a 10 Gigabit Ethernet controller, wherein data received from the source in one protocol is transformed to a second protocol input to the host. If either or both the networking/communication chip or the host system is/are made of FPGAs, it/they can be reprogrammed to disable the flow control in the networking/communication chip and enable flow control in the host system. Data flow is enhanced because memory in the host system typically is much larger than memory in the networking/communication chip.
    Type: Application
    Filed: December 20, 2002
    Publication date: June 24, 2004
    Applicant: LSI LOGIC CORPORATION
    Inventor: George Wayne Nation
  • Publication number: 20040117744
    Abstract: A tool for designing integrated circuits that optimizes the placement and timing of memory blocks within the circuit. Given a manufactured slice that has a number of blocks already diffused and logically integrated, the memory generation tool herein automatically considers the available diffused memory and the gate array of the slices to configure and optimize them into a customer's requirements for memory. The memory generation tool has a memory manager, a memory resource database, a memory resource selector, and a memory composer. Together these all interact to generate memories from the available memories within the memory resource database. The memory composer actually generates the RTL logic shells for the memories, and outputs the memory designs in Verilog, VHDL, or other tool synthesis language. Once a memory is created, it is tested.
    Type: Application
    Filed: December 13, 2002
    Publication date: June 17, 2004
    Applicant: LSI LOGIC CORPORATION
    Inventors: George Wayne Nation, Gary Scott Delp, Paul Gary Reuland