Abstract: A package includes a component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a cavity in the stack, an active electronic component in the cavity, and a functional filling medium filling at least part of the cavity. The functional filling medium extends to an external surface of the stack for defining an output surface and configured to transmit at least one output of the active electronic component toward the output surface.

Abstract: An electronic device includes a component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an electronic component on and/or in the stack, and a cooling member with a fluid cooling unit at least partially therein. The component carrier and the cooling member are connected by a connection structure. The connection structure comprises thermal interface material which contributes to a heat removal from the electronic component to the cooling unit.

Abstract: A component carrier includes a base material stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a magnet stack with a plurality of magnetic layers and at least one bonding layer, each of the at least one bonding layer bonding two respectively neighboured magnetic layers, wherein the magnet stack is embedded in the base material stack.

Abstract: An electronic device includes a component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an electronic component on and/or in the stack, and a cooling member with a fluid cooling unit at least partially therein. The component carrier and the cooling member are connected by a connection structure.

Abstract: An inductor inlay, a component carrier, and methods for manufacturing the inductor inlay and the component carrier. The inductor inlay has a magnetic layer stack of interconnected magnetic layers and an electrically conductive structure embedded in the magnetic stack. The electrically conductive structure is configured as an inductor element with a coil-like shape. A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure and the inductor inlay with the magnetic layer stack with interconnected magnetic layers and the electrically conductive structure embedded in the magnetic layer stack. Methods for manufacturing the inductor inlay and component carrier are further described.

Abstract: An electronic device includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a plurality of processing components on and/or in the stack, a process control component coupled with at least part of the processing components for transmitting signals and configured for controlling processes executed by the processing components and/or by the process control component, and a heat removal structure on or above which at least one of the process control component and the processing components is arranged.

Abstract: An electronic device includes a component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an electronic component on and/or in the stack, and a cooling member with a fluid cooling unit at least partially therein. The component carrier and the cooling member are connected by a connection structure.

Abstract: A drive device includes a component carrier with a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and a cavity formed in the stack. A driven body is arranged at least partially in the cavity and configured for being drivable to move relative to the component carrier. At least one drive coil for creating a magnetic drive field and at least one drive magnet interacts with the magnetic drive field created by the at least one drive coil to generate a force for moving the driven body relative to the component carrier. One of the at least one drive magnet and the at least one drive coil forms part of the component carrier and the other one of the at least one drive magnet and the at least one drive coil forms part of the driven body.

Abstract: A component carrier which includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and an inductor arranged at least partially in the stack is disclosed. The inductor includes an electrically conductive coil structure, wound around a coil opening, and a magnetic core. At least part of the magnetic core at least partially fills the coil opening. At least part of at least one of the coil structure and the magnetic core is configured as an inlay embedded in the stack.

Abstract: A component carrier has a laminated stack including at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a front-end chip on and/or in the stack and extending at least up to a main surface of the stack, an antenna interface on an opposing other main surface of the stack, and an impedance matching circuitry in the stack and arranged vertically between the front-end chip and the antenna interface.

Abstract: An electronic device includes a first component carrier with a stack of at least one first electrically conductive layer structure and at least one first electrically insulating layer structure, and a second component carrier with a respective stack of at least one second electrically conductive layer structure and at least one second electrically insulating layer structure. The second component carrier is connected with the first component carrier so that a stacking direction of the first component carrier is angled with regard to a stacking direction of the second component carrier.

Abstract: An electronic device includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a plurality of processing components on and/or in the stack, a process control component coupled with at least part of the processing components for transmitting signals and configured for controlling processes executed by the processing components and/or by the process control component, and a heat removal structure on or above which at least one of the process control component and the processing components is arranged.

Abstract: A magnetic member having a substantially annular structure includes a non-magnetic matrix and magnetic particles embedded in the matrix. The magnetic member may be arranged on or in a component carrier.

Abstract: A component carrier has a laminated stack including at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a front-end chip on and/or in the stack and extending at least up to a main surface of the stack, an antenna interface on an opposing other main surface of the stack, and an impedance matching circuitry in the stack and arranged vertically between the front-end chip and the antenna interface.

Abstract: An electric device which includes a first component carrier structure with a first magnet structure and a first connection structure, and a second component carrier structure with a second magnet structure and a second connection structure. The first magnet structure and the second magnet structure are configured such that upon attaching the first component carrier structure and the second component carrier structure to one another the first connection structure is connected to the second connection structure, holding the first component carrier structure and the second component carrier structure together by an attracting magnetic force between the first magnet structure and the second magnet structure.

Abstract: Provided is an electronic assembly including (a) an interconnect carrier having an electrically insulating core and at least two electrically conducting layers formed at the electrically insulating core; (b) a first integrated circuit chip mounted at a first side of the interconnect carrier; (c) a second integrated circuit chip mounted at a second side of the interconnect carrier opposite to the first side; and (d) an interconnection structure electrically connecting the first integrated circuit chip with the second integrated circuit chip. The electric interconnection structure extends around the insulating core and includes at least one electric conductor path which is designed in such a manner that an impedance match between the first integrated circuit chip and the second integrated circuit chip is provided. Further, there is provided an electronic system comprising such an electronic assembly.

Abstract: A component carrier with a stack including a plurality of electrically conductive layer structures and/or electrically insulating layer structures, and a first transistor component and a second transistor component embedded side-by-side in the stack.

Abstract: An electric device which includes a first component carrier structure with a first magnet structure and a first connection structure, and a second component carrier structure with a second magnet structure and a second connection structure. The first magnet structure and the second magnet structure are configured such that upon attaching the first component carrier structure and the second component carrier structure to one another the first connection structure is connected to the second connection structure, holding the first component carrier structure and the second component carrier structure together by an attracting magnetic force between the first magnet structure and the second magnet structure.

Abstract: A component carrier which includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and an inductor arranged at least partially in the stack is disclosed. The inductor includes an electrically conductive coil structure, wound around a coil opening, and a magnetic core. At least part of the magnetic core at least partially fills the coil opening. At least part of at least one of the coil structure and the magnetic core is configured as an inlay embedded in the stack.

Abstract: An electronic device includes a first component carrier with a stack of at least one first electrically conductive layer structure and at least one first electrically insulating layer structure, and a second component carrier with a respective stack of at least one second electrically conductive layer structure and at least one second electrically insulating layer structure. The second component carrier is connected with the first component carrier so that a stacking direction of the first component carrier is angled with regard to a stacking direction of the second component carrier.