Abstract: An electronic device includes a component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an electronic component on and/or in the stack, and a cooling member with a fluid cooling unit at least partially therein. The component carrier and the cooling member are connected by a connection structure. The connection structure comprises thermal interface material which contributes to a heat removal from the electronic component to the cooling unit.

Abstract: Provided are a component carrier and a method for manufacturing thereof. The component carrier has a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure. At least one surface of the at least one electrically conductive layer structure is divided in at least one first portion and at least one second portion, with the at least one first portion and the at least one second portion being adjacent one to the other. The at least one first portion has a higher conductivity with respect to that of the at least one second portion. Metallic nanostructures and/or microstructures are provided on the at least one first portion.

Abstract: A component carrier having a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, wherein the stack includes: i) a central rigid portion; ii) a first flexible portion, extending from a first side of the central rigid portion; and iii) a second flexible portion, extending from a second side of the central rigid portion. The first flexible portion extends from a first vertical level from the central rigid portion that is different from a second vertical level from which the second flexible portion extends from said central rigid portion.

Abstract: A component carrier, including: i) a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; ii) a first electronic switch component and a second electronic switch component embedded side-by-side in the stack; and iii) a capacitor device, electrically connected in parallel to the first electronic switch component and the second electronic switch component; wherein the capacitor device is assembled, in particular surface-mounted, to the stack, so that the first electronic switch component and the second electronic switch component are at least partially arranged below the capacitor device in a direction z, perpendicular to the directions of main extension x, y, of the component carrier.

Abstract: An integrated circuit substrate for surface mounting an integrated circuit component thereon, wherein the integrated circuit substrate comprises a support structure having at least one hole, and at least two functional inlays placed inside said at least one hole side by side, wherein a pitch at an integrated circuit component mounting side of the integrated circuit substrate is not more than 150 ?m.

Abstract: A drive device includes a component carrier with a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and a cavity formed in the stack. A driven body is arranged at least partially in the cavity and configured for being drivable to move relative to the component carrier. At least one drive coil for creating a magnetic drive field and at least one drive magnet interacts with the magnetic drive field created by the at least one drive coil to generate a force for moving the driven body relative to the component carrier. One of the at least one drive magnet and the at least one drive coil forms part of the component carrier and the other one of the at least one drive magnet and the at least one drive coil forms part of the driven body.

Abstract: A package includes a component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a cavity in the stack, an active electronic component in the cavity, and a functional filling medium filling at least part of the cavity. The functional filling medium extends to an external surface of the stack for defining an output surface and configured to transmit at least one output of the active electronic component toward the output surface.

Abstract: An electronic device includes a component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an electronic component on and/or in the stack, and a cooling member with a fluid cooling unit at least partially therein. The component carrier and the cooling member are connected by a connection structure. The connection structure comprises thermal interface material which contributes to a heat removal from the electronic component to the cooling unit.

Abstract: An electronic device includes a component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an electronic component on and/or in the stack, and a cooling member with a fluid cooling unit at least partially therein. The component carrier and the cooling member are connected by a connection structure.

Abstract: A component carrier includes a base material stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a magnet stack with a plurality of magnetic layers and at least one bonding layer, each of the at least one bonding layer bonding two respectively neighboured magnetic layers, wherein the magnet stack is embedded in the base material stack.

Abstract: An inductor inlay, a component carrier, and methods for manufacturing the inductor inlay and the component carrier. The inductor inlay has a magnetic layer stack of interconnected magnetic layers and an electrically conductive structure embedded in the magnetic stack. The electrically conductive structure is configured as an inductor element with a coil-like shape. A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure and the inductor inlay with the magnetic layer stack with interconnected magnetic layers and the electrically conductive structure embedded in the magnetic layer stack. Methods for manufacturing the inductor inlay and component carrier are further described.

Abstract: An electronic device includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a plurality of processing components on and/or in the stack, a process control component coupled with at least part of the processing components for transmitting signals and configured for controlling processes executed by the processing components and/or by the process control component, and a heat removal structure on or above which at least one of the process control component and the processing components is arranged.

Abstract: An electronic device includes a component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an electronic component on and/or in the stack, and a cooling member with a fluid cooling unit at least partially therein. The component carrier and the cooling member are connected by a connection structure.

Abstract: A drive device includes a component carrier with a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and a cavity formed in the stack. A driven body is arranged at least partially in the cavity and configured for being drivable to move relative to the component carrier. At least one drive coil for creating a magnetic drive field and at least one drive magnet interacts with the magnetic drive field created by the at least one drive coil to generate a force for moving the driven body relative to the component carrier. One of the at least one drive magnet and the at least one drive coil forms part of the component carrier and the other one of the at least one drive magnet and the at least one drive coil forms part of the driven body.

Abstract: A component carrier which includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and an inductor arranged at least partially in the stack is disclosed. The inductor includes an electrically conductive coil structure, wound around a coil opening, and a magnetic core. At least part of the magnetic core at least partially fills the coil opening. At least part of at least one of the coil structure and the magnetic core is configured as an inlay embedded in the stack.

Abstract: A component carrier has a laminated stack including at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a front-end chip on and/or in the stack and extending at least up to a main surface of the stack, an antenna interface on an opposing other main surface of the stack, and an impedance matching circuitry in the stack and arranged vertically between the front-end chip and the antenna interface.

Abstract: An electronic device includes a first component carrier with a stack of at least one first electrically conductive layer structure and at least one first electrically insulating layer structure, and a second component carrier with a respective stack of at least one second electrically conductive layer structure and at least one second electrically insulating layer structure. The second component carrier is connected with the first component carrier so that a stacking direction of the first component carrier is angled with regard to a stacking direction of the second component carrier.

Abstract: An electronic device includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a plurality of processing components on and/or in the stack, a process control component coupled with at least part of the processing components for transmitting signals and configured for controlling processes executed by the processing components and/or by the process control component, and a heat removal structure on or above which at least one of the process control component and the processing components is arranged.

Abstract: A magnetic member having a substantially annular structure includes a non-magnetic matrix and magnetic particles embedded in the matrix. The magnetic member may be arranged on or in a component carrier.

Abstract: A component carrier has a laminated stack including at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a front-end chip on and/or in the stack and extending at least up to a main surface of the stack, an antenna interface on an opposing other main surface of the stack, and an impedance matching circuitry in the stack and arranged vertically between the front-end chip and the antenna interface.