Patents by Inventor Gerhard Ruehle
Gerhard Ruehle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20080089024Abstract: A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.Type: ApplicationFiled: December 3, 2007Publication date: April 17, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michael McAllister, Harald Pross, Gerhard Ruehle, Wolfgang Scholz, Gerhard Schoor
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Publication number: 20070072450Abstract: A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.Type: ApplicationFiled: September 26, 2005Publication date: March 29, 2007Applicant: International Business Machines CorporationInventors: Michael McAllister, Harald Pross, Gerhard Ruehle, Wolfgang Scholz, Gerhard Schoor
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Publication number: 20070069358Abstract: A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.Type: ApplicationFiled: September 26, 2005Publication date: March 29, 2007Applicant: International Business Machines CorporationInventors: Michael McAllister, Harald Pross, Gerhard Ruehle, Wolfgang Scholz, Gerhard Schoor
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Publication number: 20070069754Abstract: A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.Type: ApplicationFiled: September 26, 2005Publication date: March 29, 2007Applicant: International Business Machines CorporationInventors: Michael McAllister, Harald Pross, Gerhard Ruehle, Wolfgang Scholz, Gerhard Schoor
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Publication number: 20070069753Abstract: A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.Type: ApplicationFiled: September 26, 2005Publication date: March 29, 2007Applicant: International Business Machines CorporationInventors: Michael McAllister, Harald Pross, Gerhard Ruehle, Wolfgang Scholz, Gerhard Schoor
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Publication number: 20070072344Abstract: A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.Type: ApplicationFiled: September 26, 2005Publication date: March 29, 2007Applicant: International Business Machines CorporationInventors: Michael McAllister, Harald Pross, Gerhard Ruehle, Wolfgang Scholz, Gerhard Schoor
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Patent number: 6669488Abstract: An assembly for mounting elongated electrical contact elements to an integrated circuit package or printed circuit board. The assembly comprises a a base plate having a first surface and a multiplicity of recesses aligned with each other in the first surface. Each of the recesses is sized and configured to receive a respective one of the contact elements. The assembly also comprises first and second spaced apart supports extending from the base plate. The assembly also comprises first and second rods received by the first and second supports and supported parallel to each other. The first and second rods define an intervening slot aligned with the recesses. The assembly also comprises a multiplicity of the contact elements. One end of each of the contact elements is received in a respective one of the recesses. The contact elements are engaged by the first and second rods, whereby the contact elements are held in their respective recesses.Type: GrantFiled: December 10, 2001Date of Patent: December 30, 2003Assignee: International Business Machines CorporationInventors: Dierk Kaller, Willi Recktenwald, Gerhard Ruehle
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Patent number: 6644983Abstract: A contact assembly comprised of two parts bonded (e.g., welded) together, the first part including a male pin portion and the second part including a cylindrical jacket terminating in a flat end surface adapted for being electrically coupled (e.g., soldered) to a conductor (e.g., pad) on a substrate (e.g., PCB). Several contact assemblies may be positioned within a housing or substrate, to form a connector assembly which may then be positioned on and electrically coupled to a second substrate (e.g., a PCB), forming an electronic assembly.Type: GrantFiled: January 16, 2002Date of Patent: November 11, 2003Assignee: International Business Machines CorporationInventors: Willi Recktenwald, Gerhard Ruehle, Rene Frank Schrottenholzer
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Patent number: 6605953Abstract: A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned a the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e.g., a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as an MCM or Single Chip Module (SCM) having additional Central Processing Units (CPU's) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.Type: GrantFiled: July 19, 2002Date of Patent: August 12, 2003Assignee: International Business Machines CorporationInventors: Michael F. McAllister, Klaus K. Kempter, Charles F. Pells, Stephan R. Richter, Gerhard Ruehle
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Patent number: 6549024Abstract: A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned a the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e.g., a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as an MCM or Single Chip Module (SCM) having additional Central Processing Units (CPU's) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.Type: GrantFiled: July 19, 2002Date of Patent: April 15, 2003Assignee: International Business Machines CorporationInventors: Michael F. McAllister, Klaus K. Kempter, Charles F. Pells, Stephan R. Richter, Gerhard Ruehle
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Patent number: 6538460Abstract: A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned at the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e.g., a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as a MCM or Single Chip Module (SCM) having additional Central Processing Units (CPU's) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.Type: GrantFiled: March 16, 2000Date of Patent: March 25, 2003Assignee: International Business Machines CorporationInventors: Michael F. McAllister, Klaus K. Kempter, Charles F. Pells, Stephan R. Richter, Gerhard Ruehle
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Patent number: 6529023Abstract: A counterbalancing arrangement for use with a compressive land grid array connector system provides a counterbalancing load element at a side of a system circuit board opposite a back side holding an integrated circuit chip substrate via the connector system. In a first aspect, the counterbalancing load element is a probe template and spacer element providing measurement across to the integrated circuiting. In another aspect, the counterbalancing load element is a mirror image integrated circuit land grid array connector system.Type: GrantFiled: May 17, 2001Date of Patent: March 4, 2003Assignee: International Business Machines CorporationInventors: Wiren D. Becker, Michael F. McAllister, Gerhard Ruehle
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Publication number: 20020186002Abstract: A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned a the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e.g., a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as an MCM or Single Chip Module (SCM) having additional Central Processing Units (CPU's) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.Type: ApplicationFiled: July 19, 2002Publication date: December 12, 2002Applicant: International Business Machines CorporationInventors: Michael F. McAllister, Klaus K. Kempter, Charles F. Pells, Stephan R. Richter, Gerhard Ruehle
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Publication number: 20020180422Abstract: A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned a the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e.g., a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as an MCM or Single Chip Module (SCM) having additional Central Processing Units (CPU's) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.Type: ApplicationFiled: July 19, 2002Publication date: December 5, 2002Applicant: International Business Machines CorporationInventors: Michael F. McAllister, Klaus K. Kempter, Charles F. Pells, Stephen R. Richter, Gerhard Ruehle
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Publication number: 20020171442Abstract: A counterbalancing arrangement for use with a compressive land grid array connector system provides a counterbalancing load element at a side of a system circuit board opposite a back side holding an integrated circuit chip substrate via the connector system. In a first aspect, the counterbalancing load element is a probe template and spacer element providing measurement across to the integrated circuiting. In another aspect, the counterbalancing load element is a mirror image integrated circuit land grid array connector system.Type: ApplicationFiled: May 17, 2001Publication date: November 21, 2002Inventors: Wiren D. Becker, Michael F. McAllister, Gerhard Ruehle
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Patent number: 6462573Abstract: A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned at the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e.g., a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as a MCM or Single Chip Module (SCM) having additional Central Processing Units (CPU's) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.Type: GrantFiled: March 16, 2000Date of Patent: October 8, 2002Assignee: International Business Machines CorporationInventors: Michael F. McAllister, Klaus K. Kempter, Charles F. Pells, Stephan R. Richter, Gerhard Ruehle
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Publication number: 20020111080Abstract: A contact assembly comprised of two parts bonded (e.g., welded) together, the first part including a male pin portion and the second part including a cylindrical jacket terminating in a flat end surface adapted for being electrically coupled (e.g., soldered) to a conductor (e.g., pad) on a substrate (e.g., PCB). Several contact assemblies may be positioned within a housing or substrate, to form a connector assembly which may then be positioned on and electrically coupled to a second substrate (e.g., a PCB), forming an electronic assembly.Type: ApplicationFiled: January 16, 2002Publication date: August 15, 2002Applicant: International Business Machines CorporationInventors: Willi Recktenwald, Gerhard Ruehle, Rene Frank Schrottenholzer
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Patent number: 6433562Abstract: A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned at the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e.g., a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as a MCM or Single Chip Module (SCM) having additional Central Processing Units (CPU's) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.Type: GrantFiled: August 28, 1998Date of Patent: August 13, 2002Assignee: International Business Machines CorporationInventors: Michael F. McAllister, Klaus K. Kempter, Charles F. Pells, Stephan R. Richter, Gerhard Ruehle
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Patent number: 6429644Abstract: A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned at the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e.g., a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as a MCM or Single Chip Module (SCM) having additional Central Processing Units (CPU's) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.Type: GrantFiled: March 16, 2000Date of Patent: August 6, 2002Assignee: International Business Machines CorporationInventors: Michael F. McAllister, Klaus K. Kempter, Charles F. Pells, Stephan R. Richter, Gerhard Ruehle
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Publication number: 20020071257Abstract: An assembly for mounting elongated electrical contact elements to an integrated circuit package or printed circuit board. The assembly comprises a a base plate having a first surface and a multiplicity of recesses aligned with each other in the first surface. Each of the recesses is sized and configured to receive a respective one of the contact elements. The assembly also comprises first and second spaced apart supports extending from the base plate. The assembly also comprises first and second rods received by the first and second supports and supported parallel to each other. The first and second rods define an intervening slot aligned with the recesses. The assembly also comprises a multiplicity of the contact elements. One end of each of the contact elements is received in a respective one of the recesses. The contact elements are engaged by the first and second rods, whereby the contact elements are held in their respective recesses.Type: ApplicationFiled: December 10, 2001Publication date: June 13, 2002Applicant: International Business Machines CorporationInventors: Dierk Kaller, Willi Recktenwald, Gerhard Ruehle