Abstract: A probe test assembly for testing electronic devices maintained at lowered temperatures includes heaters and flows of dried air to prevent condensation from forming on the devices. The devices have pins received in an electrically non-conductive system board, and the probe test assembly includes a heat conductive and electrically conductive apertured probe plate to transfer heat from the heaters to the system board. Grounding pins extend from the probe plate to grounding pads on the system board, and a non-conductive apertured pattern plate spaced above the probe plate protects exposed ends of the grounding pins. In an alternate embodiment, the pattern plate is omitted in favor of a conductive intermediate plate and a superposed non-conductive contact plate. Signal pins extend from the system board to the contact plate in order to transfer contact points for electronic device from the system board to the contact plate.

Abstract: A high frequency probe is presented. The probe comprises a probe body having a coaxial resilient double ended probe element attached thereto by an adaptor. A locking pin is attached to the probe adaptor and extends parallel to the probe element, however, it is slightly shorter as the locking pin should not contact any pins of the device being probed. The locking pin serves to hold the probe in place. Alternatively, a high frequency differential probe is presented. The high frequency differential probe comprises a base having a first pair of opposing spring steel plates and a second adjacent pair of opposing spring steel plates connected thereto. The first pair of spring plates are also connected to a first probe adaptor and the second pair of spring plates are also connected to a second probe adaptor. A first probe body is mounted at an angle to the first adaptor and a second probe body is mounted at an angle to the second adaptor.