Patents by Inventor Gershon Akerling
Gershon Akerling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11056760Abstract: A method of making an electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled. The method includes the steps of depositing a plating material into a mold, pouring a foam polymer into the mold and removing the plated foam structure from the mold without etching the section from the mold. The method further includes steps of forming a metallic form into a planar structure, filling the open pores of the foam with a material such as photo-resist, machining a cavity from the foam, electroplating the cavity in the foam then removing the photo-resist material.Type: GrantFiled: October 2, 2018Date of Patent: July 6, 2021Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: Steven J. Mass, Anthony L. Long, Mansoor K. Siddiqui, Marijan D. Grgas, Gershon Akerling
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Publication number: 20190081381Abstract: A method of making an electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled. The method includes the steps of depositing a plating material into a mold, pouring a foam polymer into the mold and removing the plated foam structure from the mold without etching the section from the mold. The method further includes steps of forming a metallic form into a planar structure, filling the open pores of the foam with a material such as photo-resist, machining a cavity from the foam, electroplating the cavity in the foam then removing the photo-resist material.Type: ApplicationFiled: October 2, 2018Publication date: March 14, 2019Inventors: Steven J. Mass, Anthony L. Long, Mansoor K. Siddiqui, Marijan D. Grgas, Gershon Akerling
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Patent number: 10122063Abstract: A method of making an electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled. The method includes the steps of depositing a plating material into a mold, pouring a foam polymer into the mold and removing the plated foam structure from the mold without etching the section from the mold. The method further includes steps of forming a metallic form into a planar structure, filling the open pores of the foam with a material such as photo-resist, machining a cavity from the foam, electroplating the cavity in the foam then removing the photo-resist material.Type: GrantFiled: February 2, 2016Date of Patent: November 6, 2018Assignee: Northrop Grumman Systems CorporationInventors: Steven J. Mass, Anthony L. Long, Mansoor K. Siddiqui, Marijan D. Grgas, Gershon Akerling
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Patent number: 9960204Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.Type: GrantFiled: September 22, 2016Date of Patent: May 1, 2018Assignee: Northrop Grumman Systems CorporationInventors: Chunbo Zhang, Peter Ngo, Gershon Akerling, Kevin M. Leong, Patty Chang-Chien, Kelly J. Hennig, William R. Deal
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Publication number: 20170018597Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.Type: ApplicationFiled: September 22, 2016Publication date: January 19, 2017Inventors: Chunbo Zhang, Peter Ngo, Gershon Akerling, Kevin M. Leong, Patty Chang-Chien, Kelly J. Hennig, William R. Deal
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Patent number: 9478458Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.Type: GrantFiled: January 8, 2014Date of Patent: October 25, 2016Assignee: Northrop Grumman Systems CorporationInventors: Chunbo Zhang, Peter Ngo, Gershon Akerling, Kevin M. Leong, Patty Chang-Chien, Kelly J. Hennig, William R. Deal
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Publication number: 20160149286Abstract: A method of making an electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled. The method includes the steps of depositing a plating material into a mold, pouring a foam polymer into the mold and removing the plated foam structure from the mold without etching the section from the mold. The method further includes steps of forming a metallic form into a planar structure, filling the open pores of the foam with a material such as photo-resist, machining a cavity from the foam, electroplating the cavity in the foam then removing the photo-resist material.Type: ApplicationFiled: February 2, 2016Publication date: May 26, 2016Inventors: Steven J. Mass, Anthony L. Long, Mansoor K. Siddiqui, Marijan D. Grgas, Gershon Akerling
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RF transmission line disposed within a conductively plated cavity located in a low mass foam housing
Patent number: 9293800Abstract: An electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled.Type: GrantFiled: December 9, 2011Date of Patent: March 22, 2016Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: Steven J. Mass, Anthony L. Long, Mansoor K. Siddiqui, Marijan D. Grgas, Gershon Akerling -
Publication number: 20140254979Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.Type: ApplicationFiled: January 8, 2014Publication date: September 11, 2014Applicant: Northrop Grumman Systems CorporationInventors: Chunbo Zhang, Peter Ngo, Gershon Akerling, Kevin M. Leong, Patty Chang-Chien, Kelly J. Hennig, William R. Deal
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Publication number: 20120152454Abstract: An electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled.Type: ApplicationFiled: December 9, 2011Publication date: June 21, 2012Inventors: Steven J. Mass, Anthony L. Long, Mansoor K. Siddiqui, Marijan D. Grgas, Gershon Akerling
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Patent number: 7135779Abstract: A method for packaging integrated circuits in a wafer format that eliminates wire bonds. A wafer substrate on which the integrated circuits have been fabricated is patterned and etched to form signal and ground via through the substrate. A back-side ground plane is deposited in contact with the ground vias. A protective layer is formed on the top surface of the substrate, and a protective layer is formed on the bottom surface of the substrate, where the bottom protective layer fills in removed substrate material between the integrated circuits. Vias are formed through the bottom protective layer, and the wafer substrate is diced between the integrated circuits.Type: GrantFiled: April 14, 2004Date of Patent: November 14, 2006Assignee: Northrop Grumman CorporationInventors: James Anderson, Gershon Akerling
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Patent number: 6936913Abstract: A semiconductor device, a microelectromechanical system package and a method of making the same utilize high performance vias for vertical IC packaging. A semiconductor die of the device/package has a substrate with integrated circuitry formed on a front side of the substrate. A metal bonding pad overlies the substrate on the front side of the substrate and is electrically connected to the integrated circuitry. A solder bump is located on the metal bonding pad. An electrically conductive via extends through the substrate from the metal bonding pad to a back side of the substrate where the via forms a side wall of a via hole. A plurality of the substrates are stacked on one another with the outer end of the solder bump of one substrate fitting within the via hole of an adjacent substrate. During reflow soldering, surface tension forces of the molten solder bump self-align the substrates.Type: GrantFiled: December 11, 2002Date of Patent: August 30, 2005Assignee: Northrop Grumman CorporationInventors: Gershon Akerling, James M. Anderson, Eric L. Upton
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Publication number: 20040248342Abstract: A method for packaging integrated circuits in a wafer format that eliminates wire bonds. A wafer substrate on which the integrated circuits have been fabricated is patterned and etched to form signal and ground via through the substrate. A back-side ground plane is deposited in contact with the ground vias. A protective layer is formed on the top surface of the substrate, and a protective layer is formed on the bottom surface of the substrate, where the bottom protective layer fills in removed substrate material between the integrated circuits. Vias are formed through the bottom protective layer, and the wafer substrate is diced between the integrated circuits.Type: ApplicationFiled: April 14, 2004Publication date: December 9, 2004Applicant: Northrop Grumman CorporationInventors: James Anderson, Gershon Akerling
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Publication number: 20040214377Abstract: Filled composite compositions can be used as encapsulants, underfill materials, and potting materials in electronic and optical packages that are subjected to a wide temperature range. The composites contain a matrix and a filler composition. In a preferred embodiment, the matrix is an organic material. The filler composition contains particles of a material that have a negative coefficient of thermal expansion. The filler composition contains particles having a wide range of sizes. Furthermore, the particles exhibit a non-normal, for example, log normal or power-law, particle distribution. The non-normal size distribution of the particles enables the filler composition to be formulated at high levels into organic matrices, resulting in composites that have very low coefficient of thermal expansion to match those of the semiconductor materials in the electronic package or optical components in an optical assembly.Type: ApplicationFiled: April 28, 2003Publication date: October 28, 2004Inventors: John A. Starkovich, Gershon Akerling, Larry R. Eaton
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Patent number: 6768189Abstract: A packaged die (112) for an integrated circuit (62) that eliminates the wire bonds required in the prior art, and provides integrated circuit packaging while the circuit (62) is still in a wafer format. A wafer substrate (64) on which the integrated circuits (62) have been fabricated is patterned and etched to form signal and ground vias (74, 72) through the substrate (64). A back-side ground plane (82) is deposited in contact with the ground vias (72). A protective layer (90) is formed on the top surface (76) of the substrate (64), and a protective layer (98) is formed on the bottom surface (84) of the substrate (64), where the bottom protective layer (98) fills in removed substrate material between the integrated circuits (62). Vias (106) are formed through the bottom protective layer (98), and the wafer substrate (64) is diced between the integrated circuits (62).Type: GrantFiled: June 4, 2003Date of Patent: July 27, 2004Assignee: Northrop Grumman CorporationInventors: James Anderson, Gershon Akerling
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Publication number: 20040113264Abstract: A semiconductor device, a microelectromechanical system package and a method of making the same utilize high performance vias for vertical IC packaging. A semiconductor die of the device/package has a substrate with integrated circuitry formed on a front side of the substrate. A metal bonding pad overlies the substrate on the front side of the substrate and is electrically connected to the integrated circuitry. A solder bump is located on the metal bonding pad. An electrically conductive via extends through the substrate from the metal bonding pad to a back side of the substrate where the via forms a side wall of a via hole. A plurality of the substrates are stacked on one another with the outer end of the solder bump of one substrate fitting within the via hole of an adjacent substrate. During reflow soldering, surface tension forces of the molten solder bump self-align the substrates.Type: ApplicationFiled: December 11, 2002Publication date: June 17, 2004Inventors: Gershon Akerling, James M. Anderson, Eric L. Upton
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Patent number: 6219254Abstract: The chip-to-board (or chip-to-MCM) connection assembly and method therefor features a semiconductor chip (31) having a front surface (31f) on which external terminal pads are provided; a board or MCM (32) having a surface (e.g., a recessed surface) at a first side thereof to which the rear surface (31r) of the chip is affixed; and a connection carrier (33), disposed as an overlay, which electrically links the chip and the board or MCM. In this assembly scheme, the connection carrier (e.g., a bump carrier) which is affixed to both the chip and the board or MCM, contains all required signal line tracings (57) to provide the electrical interconnection between the semiconductor chip and the board or MCM. The bump carrier replaces all bond wires (24) and the like and can include support/control circuitry, passive and/or active, associated with, for example, high-speed/high-power IC chips (51).Type: GrantFiled: April 5, 1999Date of Patent: April 17, 2001Assignee: TRW Inc.Inventors: Gershon Akerling, James M. Anderson, John W. Spargo, Benjamin Tang
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Patent number: 6216941Abstract: A method for forming high frequency connections between a fragile chip and a substrate is described, wherein metal is selectively deposited on a surface of a chip and a surface of a substrate, and corresponding patterns of electrically conductive bumps are selectively evaporated on the surface of the chip and the surface of the substrate over the metal layers, to form a pattern of electrically conductive bumps having spongy and dendritic properties, placing the chip in aligned contact with the substrate where each electrically conductive chip bump mates with each corresponding electrically conductive substrate bump, and selectively applying heat and pressure to the chip and substrate causing each chip bump to fuse together with each corresponding substrate bump to form an electromechanical bond.Type: GrantFiled: January 6, 2000Date of Patent: April 17, 2001Assignee: TRW Inc.Inventors: Karen E. Yokoyama, Gershon Akerling, Moshe Sergant
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Patent number: 6146912Abstract: A method and apparatus for bonding a chip to a substrate is described, wherein the apparatus includes a chip holder assembly comprising an outer holder having a cavity formed therein and an inner holder for holding the chip, and by releaseably securing the inner holder within the outer holder cavity and contacting the chip to the substrate the inner holder has selective angular rotation within the cavity to make parallel the chip and the substrate.Type: GrantFiled: May 11, 1999Date of Patent: November 14, 2000Assignee: TRW Inc.Inventors: Thomas S. Tighe, Gershon Akerling
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Patent number: 6055722Abstract: Shielded stripline multi-lead flex cable is successfully attached to solder pads on a circuit board by applying a hot bar to the backside of the cable placed in abuttment with the associated solder pads. The hot bar generates sufficient heat to reflow pretinned cable elements and the corresponding solder pads of the circuit board. An attachment is attained in which the outer ground plane metal layer of the cable covers the signal lines and the other ground plane metal layer is attached adjacent those signal lines, producing effective RF shielding of the signal leads and minimizing introduction of inductance into the ground current circuit. A novel cable end configuration and cable termination is disclosed to implement the attaching procedure.Type: GrantFiled: May 20, 1998Date of Patent: May 2, 2000Assignee: TRW Inc.Inventors: Thomas S. Tighe, Gershon Akerling