Abstract: The invention relates to a method for producing an electrical connection to a high temperature superconductor (HTS) circuit, where a polymer material is applied to the HTS surface covering the circuit contact disposed on one surface of the HTS circuit, a via is created in the polymer material exposing the circuit contact, a diffusion barrier is applied into the via covering the circuit contact; and, a solder bump is applied to the diffusion barrier.

Abstract: A reworkable cold welded microelectronic multi-chip module contains cold welded microelectronic chips in which the chip's cold weld metal bonding pads (3) are constructed of a metal having one hardness and the corresponding cold weld metal bonding pads of the multi-chip module's substrate (5) are of a different greater hardness, which, despite the difference in hardness, cold weld to one another. Two forms of Indium preferably serve as the metals. If for any reason the chip must be removed from the module, it is found that the cold weld breaks at a predictable location. A new microelectronic chip may thereby be cold welded to the module substrate as a replacement. New rework and testing procedures are thereby made possible.

Abstract: A reworkable cold welded microelectronic multi-chip module contains cold welded microelectronic chips in which the chip's cold weld metal bonding pads (3) are constructed of a metal having one hardness and the corresponding cold weld metal bonding pads of the multi-chip module's substrate (5) are of a different greater hardness, which, despite the difference in hardness, cold weld to one another. Two forms of Indium preferably serve as the metals. If for any reason the chip must be removed from the module, it is found that the cold weld breaks at a predictable location. A new microelectronic chip may thereby be cold welded to the module substrate as a replacement. New rework and testing procedures are thereby made possible.

Abstract: A new electrical connector system employs two printed circuit board type connector components (1 & 3), each containing a plurality of plated-on metal lines (11 & 13) running along the board in parallel, and a replaceable contact element (9), termed an interposer, that is sandwiched between those printed circuit boards. The interposer contains malleable electrical contacts (15 & 17) on each side that extend electrically from one surface to the other and serves as a contact bridge for those connector contacts. The interposer is formed as a thin insulator strip and metal bumps on the top and bottom sides of the strip serve as the electrical contacts. Bridging connection for metal bumps on the top side with associated bumps on the bottom side is served with plated-through holes (16). The metal bumps are of Indium and Tin that is covered by a flash of Gold. Ancillary to the described connector, a new method for constructing an electrical connector is also presented.

Abstract: A new electrical connector system employs two printed circuit board type connector components (1 & 3), each containing a plurality of plated-on metal lines (11 & 13) running along the board in parallel, and a replaceable contact element (9), termed an interposer, that is sandwiched between those printed circuit boards. The interposer contains malleable electrical contacts (15 & 17) on each side that extend electrically from one surface to the other and serves as a contact bridge for those connector contacts. The interposer is formed as a thin insulator strip and metal bumps on the top and bottom sides of the strip serve as the electrical contacts. Bridging connection for metal bumps on the top side with associated bumps on the bottom side is served with plated-through holes (16). The metal bumps are of Indium and Tin that is covered by a flash of Gold. Ancillary to the described connector, a new method for constructing an electrical connector is also presented.

Abstract: A reworkable cold welded microelectronic multi-chip module contains cold welded microelectronic chips in which the chip's cold weld metal bonding pads (3) are constructed of a metal having one hardness and the corresponding cold weld metal bonding pads of the multi-chip module's substrate (5) are of a different greater hardness, which, despite the difference in hardness, cold weld to one another. Two forms of Indium preferably serve as the metals. If for any reason the chip must be removed from the module, it is found that the cold weld breaks at a predictable location. A new microelectronic chip may thereby be cold welded to the module substrate as a replacement. New rework and testing procedures are thereby made possible.