Abstract: A method for producing an optical element made of quartz glass, said element being designed for a conversion of pump light, may include providing a sol having a silicon precursor, admixing the sol with at least one luminescent substance and one luminescent substance educt, gelling the sol to form a gel body, and sintering the gel body to form a quartz glass solid.

Abstract: An optoelectronic semiconductor component includes at least one radiation-emitting semiconductor chip including a radiation-outcoupling face through which at least some of electromagnetic radiation generated in the semiconductor chip leaves the semiconductor chip; and at least one radiation-transmissive body arranged at least in places downstream of the semiconductor chip on its radiation-outcoupling face, which body is in at least indirect contact with the semiconductor chip, wherein the radiation-transmissive body is formed with at least one polymer or contains at least one polymer, and one monomer of the polymer is formed with at least one silazane.

Abstract: A carrier for an optoelectronic unit has a carrier material which includes polyethylene terephthalate which contains reflector particles and a further filler. Methods for the production of the optoelectronic unit and the carrier are also disclosed.

Abstract: An optoelectronic semiconductor chip includes an active layer with a first and a second major face, including a semiconductor material which emits or receives radiation when the semiconductor chip is in operation; a patterned layer including three-dimensional patterns for outcoupling or incoupling radiation and arranged on the first major face in a beam path of the radiation, wherein the patterned layer includes an inorganic-organic hybrid material.

Abstract: A radiation-emitting semiconductor component, having a layer structure which includes an active layer which, in operation, emits radiation with a spectral distribution, and electrical contacts for applying a current to the layer structure, includes a coating layer which at least partially surrounds the active layer and holds back a short-wave component of the emitted radiation.

Abstract: An optoelectronic component, including a housing including a thermosetting plastic including at least one material selected from the group consisting of aminoplastic thermosetting plastic, urea thermosetting plastic, melamine-formaldehyde thermosetting plastic, wet polyester thermosetting plastics, bulk molding compounds, polyester resin, phenolic resin and vinyl ester resin, a recess in the housing, and a radiation-emitting component, arranged in the recess, wherein the optoelectronic component includes a gate mark.

Abstract: A method for producing a luminescent material element which is configured for conversion of pump light is provided. The method may include: providing a polysilazane solution; bringing the polysilazane solution in contact with a luminescent material; and partially curing the polysilazane solution.

Abstract: A light-emitting diode includes a carrier having a mounting surface; at least one light-emitting diode chip fixed to the mounting surface; and a reflective element provided for reflecting electromagnetic radiation, wherein the reflecting element is fixed to the carrier and includes porous polytetrafluoroethylene.

Abstract: An optoelectronic semiconductor component includes a housing main body and at least one optoelectronic semiconductor chip mounted on the housing main body. In operation, the optoelectronic semiconductor chip emits primary radiation including an ultraviolet radiation fraction. The semiconductor component also includes a filter medium that absorbs the ultraviolet radiation fraction and is located at least in part between the semiconductor chip and the housing main body and/or between the semiconductor chip and an optical component.

Abstract: A radiation-emitting component includes: a radiation source containing semiconductor materials which emits first radiation of a first wavelength when in operation; a transparent body including a matrix material and an inorganic filler and arranged at least in part in the beam path of the first radiation; and a converter material arranged at least in part in the beam path of the first radiation and which converts first radiation at least in part into second radiation of a second, longer wavelength.

Abstract: An optoelectronic component includes a protective layer including a material containing hydrophobic groups. Furthermore, a method is described, by means of which an optoelectronic component can be produced, and in which a protective layer including hydrophobic groups is applied.

Abstract: An optoelectronic component includes a housing which includes a first partial region having a first thermoplastic material crosslinked by irradiation and a second partial region having a second thermoplastic material, a recess in the housing, and a radiation-emitting device disposed in the recess.

Abstract: An arrangement and a method for producing such an arrangement serve for generating mixed light. In this case, a semiconductor chip that emits an electromagnetic primary radiation has a luminescence conversion element in the beam path of the primary radiation. Furthermore, the arrangement includes a connecting element and a carrier element, wherein the carrier element carries and shapes the luminescence conversion element and the connecting element.

Abstract: A method is provided for producing a luminescence conversion element (4), in particular for an optoelectronic component. In the method a raw material (1) is provided, which is intended for further processing to yield the ceramic material and which contains luminescent material particles and a binder material. A blank is molded by injecting the raw material (1) into a closed mold (3). The blank is released from the mold (3). The binder material is removed from the blank. The blank is sintered to yield the luminescence conversion element (4), wherein the luminescent material particles are bonded together and/or with further particles of the raw material to yield the ceramic material. A luminescence conversion element and an optoelectronic component are additionally provided.

Abstract: An optoelectronic semiconductor component includes a radiation emitting semiconductor chip having a radiation coupling out area. Electromagnetic radiation generated in the semiconductor chip leaves the semiconductor chip via the radiation coupling out area. A converter element is disposed downstream of the semiconductor chip at its radiation coupling out area. The converter element is configured to convert electromagnetic radiation emitted by the semiconductor chip. The converter element has a first surface facing away from the radiation coupling out area. A reflective encapsulation encapsulates the semiconductor chip and portions of the converter element at side areas in a form-fitting manner. The first surface of the converter element is free of the reflective encapsulation.

Abstract: A method can be used to produce a housing for an optoelectronic semiconductor device. A reflector part, which has an inner area configured to reflect electromagnetic radiation, is encased in places with a housing material using an injection molding method. The inner area of the reflector part remains free of the housing material at least in places. The reflector part is formed with a first plastic material and the housing material is formed with a second plastic material that is different than the first plastic material. The first plastic material and the second plastic material differ from one another with regard to at least thermal stability or resistance to electromagnetic radiation.

Abstract: A housing for an optoelectronic component including a main housing body formed by a first plastics material, and which has a recess, and a coating formed by a second plastics material, and which, at least in a region of the recess, connects at least in places to the main housing body and is in direct contact with the main housing body, wherein the first plastics material is different from the second plastics material, and the first plastics material and the second plastics material differ from one another with regard to at least one of the following material properties: temperature resistance with regard to discoloration, temperature resistance with regard to deformation, temperature resistance with regard to destruction, and resistance to electromagnetic radiation.

Abstract: An optical device having a specific form is provided that includes a resin molding compound having an adhesion-reducing, chemically modified surface layer.

Abstract: A light-emitting diode includes a carrier having a mounting surface; at least one light-emitting diode chip fixed to the mounting surface; and a reflective element provided for reflecting electromagnetic radiation, wherein the reflecting element is fixed to the carrier and includes porous polytetrafluoroethylene.

Abstract: An optical element (1) is specified comprising an optical body (2) containing a plastic material. The optical body (2) is completely encapsulated by a protective layer (3) containing a silicon oxide. An optoelectronic component comprising such an optical element is furthermore described.