Patents by Inventor Giora Dishon
Giora Dishon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9616524Abstract: A method of depositing a material on a receiving substrate, the method comprising: providing a source substrate having a back surface and a front surface, the back surface carrying at least one piece of coating material; providing a receiving substrate positioned adjacent to the source substrate and facing the coating material; and radiating light towards the front surface of the source substrate, to remove at least one piece of the coating material from the source substrate and deposit said removed at least one piece onto the receiving substrate as a whole.Type: GrantFiled: June 18, 2009Date of Patent: April 11, 2017Assignee: Utilight Ltd.Inventors: Mikhael Matusovsky, Amir Noy, Moshe Finarov, Giora Dishon
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Patent number: 9291911Abstract: Apparatus for processing substrates according to a predetermined photolithography process includes a loading station in which the substrates are loaded, a coating station in which the substrates are coated with a photoresist material, an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating, a developing station in which the latent image is developed, an unloading station in which the substrates are unloaded and a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process before reaching the unloading station.Type: GrantFiled: July 10, 2014Date of Patent: March 22, 2016Assignee: NOVA MEASURING INSTRUMENTS LTD.Inventors: Giora Dishon, Moshe Finarov, Zvi Nirel, Yoel Cohen
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Publication number: 20140320837Abstract: Apparatus for processing substrates according to a predetermined photolithography process includes a loading station in which the substrates are loaded, a coating station in which the substrates are coated with a photoresist material, an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating, a developing station in which the latent image is developed, an unloading station in which the substrates are unloaded and a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process before reaching the unloading station.Type: ApplicationFiled: July 10, 2014Publication date: October 30, 2014Inventors: Giora DISHON, Moshe FINAROV, Zvi NIREL, Yoel COHEN
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Patent number: 8780320Abstract: Apparatus for processing substrates according to a predetermined photolithography process includes a loading station in which the substrates are loaded, a coating station in which the substrates are coated with a photoresist material, an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating, a developing station in which the latent image is developed, an unloading station in which the substrates are unloaded and a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process before reaching the unloading station.Type: GrantFiled: July 8, 2013Date of Patent: July 15, 2014Assignee: Nova Measuring Instuments Ltd.Inventors: Giora Dishon, Moshe Finarov, Zvi Nirel, Yoel Cohen
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Publication number: 20130293872Abstract: Apparatus for processing substrates according to a predetermined photolithography process includes a loading station in which the substrates are loaded, a coating station in which the substrates are coated with a photoresist material, an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating, a developing station in which the latent image is developed, an unloading station in which the substrates are unloaded and a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process before reaching the unloading station.Type: ApplicationFiled: July 8, 2013Publication date: November 7, 2013Inventors: Giora DISHON, Moshe FINAROV, Zvi NIREL, Yoel COHEN
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Patent number: 8482715Abstract: A system for determining at least two properties of a substrate, including a supporting plate configured to support the substrate, and a measurement device coupled to the supporting plate, including an illumination system configured to direct light toward a surface of the substrate, and a detection system coupled to the illumination system and configured to detect light propagating from the surface of the substrate, wherein the measurement device is configured to generate one or more output signals in response to the detected light, and a control unit coupled to the measurement device and configured to determine a first property and a second property of the substrate from the one or more output signals, wherein the first property comprises a presence of macro defects on the substrate, and wherein the second property comprises overlay misregistration in the substrate.Type: GrantFiled: October 25, 2010Date of Patent: July 9, 2013Assignee: Nova Measuring Instruments Ltd.Inventors: Giora Dishon, Moshe Finarov, Zvi Nirel, Yoel Cohen
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Publication number: 20120268939Abstract: A method of manufacturing a waveguide within a substrate by local modification of material structure under high power density laser radiation applied from the mostly distant side of the substrate.Type: ApplicationFiled: June 26, 2012Publication date: October 25, 2012Inventors: Moshe Finarov, Giora Dishon, Ehud Tirosh
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Publication number: 20110097550Abstract: A method of depositing a material on a receiving substrate, the method comprising: providing a source substrate having a back surface and a front surface, the back surface carrying at least one piece of coating material; providing a receiving substrate positioned adjacent to the source substrate and facing the coating material; and radiating light towards the front surface of the source substrate, to remove at least one piece of the coating material from the source substrate and deposit said removed at least one piece onto the receiving substrate as a whole.Type: ApplicationFiled: June 18, 2009Publication date: April 28, 2011Applicant: Utillight Ltd.Inventors: Mikhael Matusovsky, Amir Noy, Moshe Finarov, Giora Dishon
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Publication number: 20110037957Abstract: Apparatus for processing substrates according to a predetermined photolithography process includes a loading station in which the substrates are loaded, a coating station in which the substrates are coated with a photoresist material, an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating, a developing station in which the latent image is developed, an unloading station in which the substrates are unloaded and a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process before reaching the unloading station.Type: ApplicationFiled: October 25, 2010Publication date: February 17, 2011Applicant: Nova Measuring Instruments Ltd.Inventors: Giora Dishon, Moshe Finarov, Zvi Nirel, Yoel Cohen
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Patent number: 7821614Abstract: Apparatus for processing substrates according to a predetermined photolithography process includes a loading station in which the substrates are loaded, a coating station in which the substrates are coated with a photoresist material, an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating, a developing station in which the latent image is developed, an unloading station in which the substrates are unloaded and a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process before reaching the unloading station.Type: GrantFiled: April 23, 2009Date of Patent: October 26, 2010Assignee: Nova Measuring Instruments Ltd.Inventors: Giora Dishon, Moshe Finarov, Zvi Nirel, Yoel Cohen
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Publication number: 20090231558Abstract: Apparatus for processing substrates according to a predetermined photolithography process includes a loading station in which the substrates are loaded, a coating station in which the substrates are coated with a photoresist material, an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating, a developing station in which the latent image is developed, an unloading station in which the substrates are unloaded and a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process before reaching the unloading station.Type: ApplicationFiled: April 23, 2009Publication date: September 17, 2009Applicant: Nova Measuring Instruments Ltd.Inventors: Giora Dishon, Moshe Finarov, Zvi Nirel, Yoel Cohen
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Patent number: 7525634Abstract: Apparatus for processing substrates according to a predetermined photolithography process includes a loading station in which the substrates are loaded, a coating station in which the substrates are coated with a photoresist material, an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating, a developing station in which the latent image is developed, an unloading station in which the substrates are unloaded and a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process before reaching the unloading station.Type: GrantFiled: October 25, 2007Date of Patent: April 28, 2009Assignee: Nova Measuring Instruments Ltd.Inventors: Giora Dishon, Moshe Finarov, Zvi Nirel, Yoel Cohen
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Publication number: 20080043229Abstract: Apparatus for processing substrates according to a predetermined photolithography process includes a loading station in which the substrates are loaded, a coating station in which the substrates are coated with a photoresist material, an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating, a developing station in which the latent image is developed, an unloading station in which the substrates are unloaded and a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process before reaching the unloading station.Type: ApplicationFiled: October 25, 2007Publication date: February 21, 2008Applicant: Nova Measuring Instruments Ltd.Inventors: Giora DISHON, Moshe Finarov, Zvi Nirel, Yoel Cohen
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Patent number: 7289190Abstract: Apparatus for processing substrates according to a predetermined photolithography process includes a loading station in which the substrates are loaded, a coating station in which the substrates are coated with a photoresist material, an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating, a developing station in which the latent image is developed, an unloading station in which the substrates are unloaded and a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process before reaching the unloading station.Type: GrantFiled: April 12, 2006Date of Patent: October 30, 2007Assignee: Nova Measuring Instruments Ltd.Inventors: Giora Dishon, Moshe Finarov, Zvi Nirel, Yoel Cohen
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Publication number: 20060193630Abstract: Apparatus for processing substrates according to a predetermined photolithography process includes a loading station in which the substrates are loaded, a coating station in which the substrates are coated with a photoresist material, an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating, a developing station in which the latent image is developed, an unloading station in which the substrates are unloaded and a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process before reaching the unloading station.Type: ApplicationFiled: April 12, 2006Publication date: August 31, 2006Applicant: Nova Measuring Instruments Ltd.Inventors: Giora Dishon, Moshe Finarov, Zvi Nirel, Yoel Cohen
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Patent number: 7030957Abstract: Apparatus for processing substrates according to a predetermined photolithography process includes a loading station in which the substrates are loaded, a coating station in which the substrates are coated with a photoresist material, an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating, a developing station in which the latent image is developed, an unloading station in which the substrates are unloaded and a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process before reaching the unloading station.Type: GrantFiled: January 26, 2004Date of Patent: April 18, 2006Assignee: Nova Measuring Instruments Ltd.Inventors: Giora Dishon, Moshe Finarov, Zvi Nirel, Yoel Cohen
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Patent number: 6842220Abstract: A method for in process monitoring of the parameters of a substrate undergoing a processing within a photolithography tools arrangement which includes substrate loading and unloading stations, and substrate coating, exposure and developing stations. The method includes the step of supplying the substrate after being developed to a monitoring station and analyzing the monitoring data to estimate the photolithography process to be used for controlling thereof.Type: GrantFiled: December 6, 2000Date of Patent: January 11, 2005Assignee: Nova Measuring Instruments Ltd.Inventors: Giora Dishon, Moshe Finarov, Yoel Cohen, Zvi Nirel
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Publication number: 20040191652Abstract: Apparatus for processing substrates according to a predetermined photolithography process includes a loading station in which the substrates are loaded, a coating station in which the substrates are coated with a photoresist material, an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating, a developing station in which the latent image is developed, an unloading station in which the substrates are unloaded and a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process before reaching the unloading station.Type: ApplicationFiled: January 26, 2004Publication date: September 30, 2004Applicant: Nova Measuring Instruments Ltd.Inventors: Giora Dishon, Moshe Finarov, Zvi Nirel, Yoel Cohen
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Patent number: 6166801Abstract: Apparatus for processing substrates according to a predetermined photolithography process includes a loading station in which the substrates are loaded, a coating station in which the substrates are coated with a photoresist material, an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating, a developing station in which the latent image is developed, an unloading station in which the substrates are unloaded and a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process before reaching the unloading station.Type: GrantFiled: November 2, 1998Date of Patent: December 26, 2000Assignee: Nova Measuring Instruments, Ltd.Inventors: Giora Dishon, Moshe Finarov, Yoel Cohen, Zvi Nirel
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Patent number: 5325265Abstract: A high performance integrated circuit chip package includes a support substrate having conductors extending from one face to the opposite face thereof and a multilayer wiring substrate on the opposite face of the support substrate for connecting chips mounted thereon to one another and to the conductors. A heat sink includes microchannels at one face thereof, with thermally conductive cushions connecting the one face of the heat sink with the exposed back sides of the chips, to provide a high density chip package with high heat dissipation. The support substrate and heat sink may be formed of blocks of material having thermal expansion matching silicon. The cushions are a low melting point solder, preferably pure indium, and are sufficiently thick to absorb thermal stresses, but sufficiently thin to efficiently conduct heat from the chips to the heat sink.Type: GrantFiled: January 7, 1992Date of Patent: June 28, 1994Assignees: MCNC, IBM Corporation, Northern Telecom LimitedInventors: Iwona Turlik, Arnold Reisman, Deepak Nayak, Lih-Tyng Hwang, Giora Dishon, Scott L. Jacobs, Robert F. Darveaux, Neil M. Poley